Electroplating composition and electroplating method

Patent metadata

Field	Value
Publication number	US-11035050-B2
Application number	US-201816226620-A
Country	US
Kind code	B2
Filing date	Dec 19, 2018
Priority date	Oct 23, 2018
Publication date	Jun 15, 2021
Grant date	Jun 15, 2021

Abstract

The present invention relates to a electroplating composition and an electroplating method using the same. The electroplating composition of the present invention comprising a first leveling agent and a second leveling agent, wherein the first leveling agent and the second leveling agent each, independently, comprise a compound represented by Chemical Formula 1 below:

First claim

What is claimed is:

1. An electroplating composition comprising:
a first leveling agent and a second leveling agent,
wherein the first leveling agent is a compound represented by Chemical Formula 2, and the second leveling agent is one selected from the compounds represented by Chemical Formulas 3 to 5 below,
wherein the weight ratio of the first leveling agent to the second leveling agent is 3:7 to 7:3

2. The electroplating composition of claim 1 , wherein the amount of the leveling agents is 0.1 g/L to 10 g/L.

3. The electroplating composition of claim 1 , further comprising a metal ion source and an electrolyte.

4. The electroplating composition of claim 3 , wherein the metal ion source is at least one selected from the group consisting of copper sulfate, copper chloride, copper acetate, copper citrate, copper nitrate, copper fluoroborate, copper methane sulfonate, copper phenyl sulfonate and copper p-toluene sulfonate.

5. The electroplating composition of claim 3 , wherein the electrolyte is at least one selected from the group consisting of sulfuric acid, acetic acid, fluoroboric acid, methanesulfonic acid, ethanesulfonic acid, propanesulfonic acid, trifluoromethanesulfonic acid, benzenesulfonic acid, p-toluenesulfonic acid, sulfamic acid, hydrochloric acid, hydrobromic acid, perchloric acid, nitric acid, chromic acid, and phosphoric acid.

6. The electroplating composition of claim 3 , wherein the metal ion source supplies a monovalent metal cation, a divalent metal cation, or a mixture thereof.

7. The electroplating composition of claim 6 , wherein the metal ion source is at least one selected from the group consisting of sulfates, halides, acetates, citrates, borates, and sulfonates.

8. The electroplating composition of claim 1 , further comprising at least one of an accelerator and a suppressor.

9. The electroplating composition of claim 8 , wherein an amount of the accelerator is 0.0001 g/L to 0.02 g/L based on the volume of the electroplating composition.

10. The electroplating composition of claim 8 , wherein an amount of the suppressor is 0.01 g/L to 1 g/L based on the volume of the electroplating composition.

Assignees

• Soulbrain Co Ltd

Inventors

• Yun Jong Cheol
• Kim Wan Joong
• Ryu Hee Jeong
• Park Seung Min

Classifications

• C25D3/38 Primary

  of copper · CPC title

• C07D239/48 Primary

  Two nitrogen atoms · CPC title

• C07D473/38

  attached in position 6 · CPC title

• C07D239/56

  One oxygen atom and one sulfur atom · CPC title

• C07D239/58

  Two sulfur atoms · CPC title