Front accessible fan tray with front-to-back cooling in a modular electronic system
US-2020015386-A1 · Jan 9, 2020 · US
US11032936B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11032936-B2 |
| Application number | US-201916671943-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 1, 2019 |
| Priority date | Nov 20, 2018 |
| Publication date | Jun 8, 2021 |
| Grant date | Jun 8, 2021 |
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An information processing device includes a board, a receiver that includes a top wall facing the board, the receiver to allow a coupling device to be inserted into a space between the board and the top wall, a movable part provided in the top wall, the movable part to be movable in a direction facing the board, the movable part having a contact portion to be in contact with a top surface of the coupling device, an elastic part that has elasticity provided at the movable part, the elastic part urging the movable part toward the board, a heat sink thermally coupled to the movable part through the elastic part, a housing positioned over a side opposite the board relative to the heat sink, the housing having a facing wall facing the heat sink, and a fan to supply wind to the heat sink along the facing wall.
Opening claim text (preview).
What is claimed is: 1. An information processing device comprising: a board; a receiver that includes a top wall facing the board, the receiver configured to allow a coupling device to be inserted into a space between the board and the top wall; a movable part provided in the top wall, the movable part configured to be movable in a direction facing the board, the movable part having a contact portion configured to be in contact with a top surface of the coupling device; an elastic part that has elasticity provided at the movable part, the elastic part urging the movable part toward the board; a housing positioned over a side opposite the board relative to the heat sink, the housing having a facing wall facing the heat sink; a fan configured to supply wind to the heat sink along the facing wall; a heat generator, separate from the coupling device, disposed over the board and positioned upstream of the movable part in a wind flowing direction; a heat transfer member thermally coupled to the elastic part and the heat generator; a first heat sink thermally coupled to the heat transfer member and the heat generator; and a second heat sink thermally coupled to the heat transfer member. 2. The information processing device according to claim 1 , wherein the first heat sink is positioned upstream of the second heat sink in a wind flowing direction. 3. The information processing device according to claim 1 , wherein the heat generator is positioned upstream of the second heat sink in a wind flowing direction, and the second heat sink is disposed relative to the heat generator in a direction perpendicular to the wind flowing direction in plan view of the board. 4. The information processing device according to claim 1 , wherein the first heat sink is positioned on a top surface of the heat generator. 5. The information processing device according to claim 4 , wherein the heat transfer member is a heat pipe. 6. The information processing device according to claim 1 , wherein the contact portion is a projecting portion that projects toward the board relative to the top wall. 7. A board device comprising: a board; a receiver that includes a top wall facing the board, the receiver configured to allow a coupling device to be inserted into a space between the board and the top wall; a movable part provided in the top wall, the movable part configured to be movable in a direction facing the board, the movable part having a contact portion configured to be in contact with a top surface of the coupling device; an elastic part that has elasticity provided at the movable part, the elastic part urging the movable part toward the board; a heat generator, separate from the coupling device, disposed over the board and positioned upstream of the movable part in a wind flowing direction; a heat transfer member thermally coupled to the elastic part and the heat generator; a first heat sink thermally coupled to the heat transfer member and the heat generator; and a second heat sink thermally coupled to the heat transfer member. 8. The board device according to claim 7 , wherein the first heat sink is positioned upstream of the second heat sink in a wind flowing direction. 9. The board device according to claim 7 , wherein the contact portion is a projecting portion that projects toward the board relative to the top wall.
within server blades for removing heat from heat source · CPC title
Cooling means · CPC title
with heat sinks or radiation fins · CPC title
Fan mounting or fan specifications · CPC title
the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels · CPC title
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