Information processing device and board device

US11032936B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11032936-B2
Application numberUS-201916671943-A
CountryUS
Kind codeB2
Filing dateNov 1, 2019
Priority dateNov 20, 2018
Publication dateJun 8, 2021
Grant dateJun 8, 2021

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An information processing device includes a board, a receiver that includes a top wall facing the board, the receiver to allow a coupling device to be inserted into a space between the board and the top wall, a movable part provided in the top wall, the movable part to be movable in a direction facing the board, the movable part having a contact portion to be in contact with a top surface of the coupling device, an elastic part that has elasticity provided at the movable part, the elastic part urging the movable part toward the board, a heat sink thermally coupled to the movable part through the elastic part, a housing positioned over a side opposite the board relative to the heat sink, the housing having a facing wall facing the heat sink, and a fan to supply wind to the heat sink along the facing wall.

First claim

Opening claim text (preview).

What is claimed is: 1. An information processing device comprising: a board; a receiver that includes a top wall facing the board, the receiver configured to allow a coupling device to be inserted into a space between the board and the top wall; a movable part provided in the top wall, the movable part configured to be movable in a direction facing the board, the movable part having a contact portion configured to be in contact with a top surface of the coupling device; an elastic part that has elasticity provided at the movable part, the elastic part urging the movable part toward the board; a housing positioned over a side opposite the board relative to the heat sink, the housing having a facing wall facing the heat sink; a fan configured to supply wind to the heat sink along the facing wall; a heat generator, separate from the coupling device, disposed over the board and positioned upstream of the movable part in a wind flowing direction; a heat transfer member thermally coupled to the elastic part and the heat generator; a first heat sink thermally coupled to the heat transfer member and the heat generator; and a second heat sink thermally coupled to the heat transfer member. 2. The information processing device according to claim 1 , wherein the first heat sink is positioned upstream of the second heat sink in a wind flowing direction. 3. The information processing device according to claim 1 , wherein the heat generator is positioned upstream of the second heat sink in a wind flowing direction, and the second heat sink is disposed relative to the heat generator in a direction perpendicular to the wind flowing direction in plan view of the board. 4. The information processing device according to claim 1 , wherein the first heat sink is positioned on a top surface of the heat generator. 5. The information processing device according to claim 4 , wherein the heat transfer member is a heat pipe. 6. The information processing device according to claim 1 , wherein the contact portion is a projecting portion that projects toward the board relative to the top wall. 7. A board device comprising: a board; a receiver that includes a top wall facing the board, the receiver configured to allow a coupling device to be inserted into a space between the board and the top wall; a movable part provided in the top wall, the movable part configured to be movable in a direction facing the board, the movable part having a contact portion configured to be in contact with a top surface of the coupling device; an elastic part that has elasticity provided at the movable part, the elastic part urging the movable part toward the board; a heat generator, separate from the coupling device, disposed over the board and positioned upstream of the movable part in a wind flowing direction; a heat transfer member thermally coupled to the elastic part and the heat generator; a first heat sink thermally coupled to the heat transfer member and the heat generator; and a second heat sink thermally coupled to the heat transfer member. 8. The board device according to claim 7 , wherein the first heat sink is positioned upstream of the second heat sink in a wind flowing direction. 9. The board device according to claim 7 , wherein the contact portion is a projecting portion that projects toward the board relative to the top wall.

Assignees

Inventors

Classifications

  • within server blades for removing heat from heat source · CPC title

  • Cooling means · CPC title

  • with heat sinks or radiation fins · CPC title

  • Fan mounting or fan specifications · CPC title

  • the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels · CPC title

Patent family

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Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11032936B2 cover?
An information processing device includes a board, a receiver that includes a top wall facing the board, the receiver to allow a coupling device to be inserted into a space between the board and the top wall, a movable part provided in the top wall, the movable part to be movable in a direction facing the board, the movable part having a contact portion to be in contact with a top surface of th…
Who is the assignee on this patent?
Fujitsu Ltd
What technology area does this patent fall under?
Primary CPC classification H05K7/20727. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 08 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).