Rolled-up electromagnetic component for on-chip applications and method of making a rolled-up electromagnetic component

US11031456B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11031456-B2
Application numberUS-201916434524-A
CountryUS
Kind codeB2
Filing dateJun 7, 2019
Priority dateJun 8, 2018
Publication dateJun 8, 2021
Grant dateJun 8, 2021

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A rolled-up electromagnetic component for on-chip applications comprises: a multilayer sheet in a rolled configuration comprising at least one turn about a longitudinal axis; a core defined by a first turn of the rolled configuration; and a soft magnetic material disposed within the core, where the multilayer sheet comprises a conductive pattern layer on a strain-relieved layer. A method of making a rolled-up electromagnetic component for on-chip applications includes forming a rolled-up device comprising: a multilayer sheet in a rolled configuration having at least one turn about a longitudinal axis, where the multilayer sheet comprises a conductive pattern layer on a strain-relieved layer; and a core defined by a first turn of the rolled configuration. The method further includes introducing a soft magnetic material into the core.

First claim

Opening claim text (preview).

The invention claimed is: 1. A rolled-up electromagnetic component for on-chip applications, the rolled-up electromagnetic component comprising: a multilayer sheet in a rolled configuration comprising at least one turn about a longitudinal axis, the multilayer sheet comprising a conductive pattern layer on a strain-relieved layer; a core defined by a first turn of the rolled configuration; and a soft magnetic material disposed within the core, wherein a magnetic layer comprising the soft magnetic material is disposed on the conductive pattern layer. 2. The rolled-up electromagnetic component of claim 1 , wherein the soft magnetic material comprises iron, nickel, chromium, iron oxide, a ferrite, iron nitride, manganese selenide, a nickel-iron alloy, and/or an iron-silicon-aluminum alloy. 3. The rolled-up electromagnetic component of claim 2 , wherein the ferrite is selected from the group consisting of: ZnFe 2 O 4 , MnFe 2 O 4 , NiFe 2 O 4 , CoFe 2 O 4 , Co x Ni 1-x Fe 2 O 4 , Co x Zn 1-x Fe 2 O 4 , Ni x Zn 1-x Fe 2 O 4 , Mn x Zn 1-x Fe 2 O 4 , where 0<x<1. 4. The rolled-up electromagnetic component of claim 1 , wherein magnetic particles comprising the soft magnetic material are disposed within the core. 5. The rolled-up electromagnetic component of claim 1 , wherein a solid body comprising the soft magnetic material is disposed within the core. 6. The rolled-up electromagnetic component of claim 1 , wherein the strain-relieved layer comprises silicon nitride, and wherein the conductive pattern layer comprises carbon, gold, silver, aluminum, palladium, platinum, and/or copper. 7. The rolled-up electromagnetic component of claim 1 , wherein the conductive pattern layer comprises at least one conductive strip having a length extending in a rolling direction so as to wrap around the longitudinal axis in the rolled configuration, the length being at least about 1 mm. 8. The rolled-up electromagnetic component of claim 1 being selected from the group consisting of: a rolled-up inductor, a rolled-up transformer, and a tubular resonant filter. 9. The rolled-up electromagnetic component of claim 8 , wherein the rolled-up inductor comprises an inductance of at least about 1 μH at a frequency up to 10 MHz. 10. An array of rolled-up electromagnetic components, each rolled-up magnetic component comprising: a multilayer sheet in a rolled configuration comprising at least one turn about a longitudinal axis, the multilayer sheet comprising a conductive pattern layer on a strain-relieved layer; a core defined by a first turn of the rolled configuration; and a soft magnetic material disposed within the core. 11. A method of making a rolled-up electromagnetic component, the method comprising: forming a rolled-up device structure comprising: a multilayer sheet in a rolled configuration comprising at least one or multiple turns about a longitudinal axis, the multilayer sheet comprising a conductive pattern layer on a strain-relieved layer; and a core defined by a first turn of the rolled configuration; and introducing a soft magnetic material into the core, wherein introducing the soft magnetic material into the core comprises: delivering a ferrofluid including magnetic particles comprising the soft magnetic material into the core; and/or inserting a solid body comprising the soft magnetic material into the core; and/or depositing a magnetic layer comprising the soft magnetic material on the conductive pattern layer after forming the rolled-up device structure. 12. The method of claim 11 , wherein the soft magnetic material is introduced into the core as the rolled-up device structure is being formed, the multilayer sheet further comprising, prior to roll-up, a magnetic layer comprising the soft magnetic material on the conductive pattern layer. 13. The method of claim 11 , wherein the conductive pattern layer comprises at least one conductive strip having a length extending in a rolling direction, the length of the conductive strip being at least about 1 mm. 14. The method of claim 11 , wherein forming the rolled-up device structure comprises: forming a sacrificial layer on a substrate; forming a strained layer on the sacrificial layer, the strained layer comprising an upper portion under tensile stress and a lower portion under compressive stress, the strained layer being held on the substrate by the sacrificial layer; forming a conductive pattern layer on the strained layer; initiating removal of the sacrificial layer from the substrate, thereby releasing an end of the strained layer, and continuing the removal of the sacrificial layer, thereby allowing the strained layer to move away from the substrate and roll up to relieve strain in the strained layer, the conductive pattern layer adhering to the strained layer during the roll-up, and thereby forming the rolled-up device structure. 15. The method of claim 14 , wherein removing the sacrificial layer comprises vapor-phase etching of the sacrificial layer. 16. The method of claim 14 , further comprising forming discrete bumps on the strained layer to serve as spacers during roll-up, wherein, during the roll-up, the discrete bumps keep adjacent turns spaced apart such that the rolled-up device structure includes gaps between adjacent turns. 17. The method of claim 16 , further comprising, after the roll-up, directing a soft magnetic material into the core and into the gaps between adjacent turns, the soft magnetic material being deposited on the conductive pattern layer as a magnetic layer. 18. The method of claim 16 , further comprising, after the roll-up, directing a conductive material into the core and into the gaps between adjacent turns, the conductive material being deposited on and increasing a thickness of the conductive pattern layer. 19. A rolled-up electromagnetic component for on-chip applications, the rolled-up electromagnetic component comprising: a multilayer sheet in a rolled configuration comprising at least one turn about a longitudinal axis, the multilayer sheet comprising a conductive pattern layer on a strain-relieved layer; a core defined by a first turn of the rolled configuration; and a soft magnetic material disposed within the core, wherein magnetic particles comprising the soft magnetic material are disposed within the core.

Assignees

Inventors

Classifications

  • the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz · CPC title

  • the material being a silicon oxide, e.g. SiO2 · CPC title

  • in the presence of a plasma [PECVD] · CPC title

  • H10D1/20Primary

    Inductors · CPC title

  • Electricity · mapped topic

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11031456B2 cover?
A rolled-up electromagnetic component for on-chip applications comprises: a multilayer sheet in a rolled configuration comprising at least one turn about a longitudinal axis; a core defined by a first turn of the rolled configuration; and a soft magnetic material disposed within the core, where the multilayer sheet comprises a conductive pattern layer on a strain-relieved layer. A method of mak…
Who is the assignee on this patent?
Univ Illinois
What technology area does this patent fall under?
Primary CPC classification H10D1/20. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 08 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).