Electronic component

Patent metadata

Field	Value
Publication number	US-11031185-B2
Application number	US-201815975131-A
Country	US
Kind code	B2
Filing date	May 9, 2018
Priority date	Feb 24, 2016
Publication date	Jun 8, 2021
Grant date	Jun 8, 2021

Abstract

An electronic component includes external electrodes formed on an external surface of a body to be electrically connected to internal electrodes, and containing metal particles and glass, wherein the metal particles include particles having a polyhedral shape.

First claim

What is claimed is:

1. An electronic component comprising:
a body including dielectric layers and first and second internal electrodes; and
external electrodes disposed on an external surface of the body to be electrically respectively connected to the first and second internal electrodes, and containing metal particles and glass,
wherein the metal particles include particles having an octahedral shape, and are composed of nickel (Ni), copper (Cu), or alloys thereof.

2. The electronic component of claim 1 , wherein the glass contains an oxide of at least one of vanadium (V) and manganese (Mn).

3. The electronic component of claim 1 , wherein a diffusion layer in which the glass is diffused is formed disposed in a region of the body contacting the external electrodes.

4. The electronic component of claim 1 , wherein a content of the glass is 5 to 10%, based on an overall content of the metal particles.

5. The electronic component of claim 1 , wherein the metal particles include particles having at least one shape of a spherical shape and a flake shape.

6. The electronic component of claim 1 , wherein the glass contains an oxide or carbonate of at least one of lithium (Li), potassium (K), and barium (Ba).

7. The electronic component of claim 1 , wherein the glass contains an oxide of at least one of calcium (Ca), zinc (Zn), and aluminum (Al).

8. The electronic component of claim 1 , wherein the glass contains an oxide of at least one of boron (B) and silicon (Si).

9. An electronic component comprising:
a body including dielectric layers and first and second internal electrodes;
external electrodes disposed on an external surface of the body to be respectively connected to the first and second internal electrodes, and containing metal particles and glass; and
a diffusion layer disposed on a boundary of the external electrodes and the dielectric layers by diffusion of the glass,
wherein the metal particles include particles having a polyhedral shape.

10. The electronic component of claim 9 , wherein the particles having the polyhedral shape include particles having an octahedral shape.

11. The electronic component of claim 9 , wherein the glass contains an oxide of at least one of vanadium (V) and manganese (Mn).

12. The electronic component of claim 9 , wherein the metal particles are formed of nickel (Ni), copper (Cu), or alloys thereof.

13. The electronic component of claim 9 , wherein a content of the glass is 5 to 10%, based on an overall content of the metal particles.

14. The electronic component of claim 9 , wherein the metal particles include particles having at least one shape of a spherical shape and a flake shape.

15. The electronic component of claim 9 , wherein the glass contains an oxide or carbonate of at least one of lithium (Li), potassium (K), and barium (Ba).

16. The electronic component of claim 9 , wherein the glass contains an oxide of at least one of calcium (Ca), zinc (Zn), and aluminum (Al).

17. The electronic component of claim 9 , wherein the glass contains an oxide of at least one of boron (B) and silicon (Si).

18. The electronic component of claim 9 , wherein the diffusion layer contains a secondary phase containing the glass and a ceramic material of the dielectric layers.

19. The electronic component of claim 18 , wherein the secondary phase has an acicular shape.

20. The electronic component of claim 18 , wherein the secondary phase includes a Ba--V--O-based secondary phase.

Assignees

• Samsung Electro Mech

Inventors

• Kim Jeong Ryeol
• Kang Bum Suk
• Kang Hyo Min
• Cho Hang Kyu
• Kim Chang Hoon

Classifications

• H01C1/148 Primary

  the terminals embracing or surrounding the resistive element (H01C1/142 takes precedence) · CPC title

• H01C7/18

  comprising a plurality of layers stacked between terminals · CPC title

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01F17/0006

  Printed inductances (printed coils for dynamo-electric machines H02K3/26; printed circuits H05K) · CPC title

• H01F27/292

  Surface mounted devices · CPC title