Sensor, input device, and electronic apparatus

US11029221B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11029221-B2
Application numberUS-201816486755-A
CountryUS
Kind codeB2
Filing dateFeb 16, 2018
Priority dateFeb 17, 2017
Publication dateJun 8, 2021
Grant dateJun 8, 2021

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

An electronic apparatus includes: an exterior body; a pressure-sensitive sensor having a first surface and a second surface; a support body supporting the pressure-sensitive sensor such that the exterior body faces the first surface; and a first deformation layer disposed at least either between the first surface and the exterior body or between the second surface and the support body. The pressure-sensitive sensor includes a capacitive sensor electrode unit including a sensing unit, a reference electrode layer, and a second deformation layer disposed between the reference electrode layer and the sensor electrode unit. The first deformation layer and the second deformation layer satisfy a predetermined relationship.

First claim

Opening claim text (preview).

The invention claimed is: 1. An electronic apparatus comprising: an exterior body; a pressure-sensitive sensor having a first surface and a second surface; a support body supporting the pressure-sensitive sensor such that the exterior body faces the first surface; and a first deformation layer disposed at least either between the first surface and the exterior body or between the second surface and the support body, wherein the pressure-sensitive sensor includes a capacitive sensor electrode unit including a sensing unit, a reference electrode layer, and a second deformation layer disposed between the reference electrode layer and the sensor electrode unit, and the first deformation layer and the second deformation layer satisfy at least one of relationships represented by the following formulas (1) to (3), Elastic modulus of the first deformation layer≤elastic modulus of the second deformation layer  (1) Thickness of the first deformation layer≥thickness of the second deformation layer  (2) Area occupancy of the first deformation layer≤area occupancy of the second deformation layer  (3) 2. The electronic apparatus according to claim 1 , wherein the first deformation layer and the second deformation layer each contain a foamed resin. 3. The electronic apparatus according to claim 1 , wherein the first deformation layer has a shape pattern. 4. The electronic apparatus according to claim 1 , wherein the exterior body contains a metal or a polymer resin. 5. The electronic apparatus according to claim 1 , wherein the exterior body has a side wall portion, and the pressure-sensitive sensor and the first deformation layer are disposed on the side wall portion. 6. The electronic apparatus according to claim 1 , wherein the exterior body includes a housing. 7. The electronic apparatus according to claim 1 , wherein the exterior body can press the first surface by being pressed toward the first surface. 8. The electronic apparatus according to claim 1 , wherein the first deformation layer and the second deformation layer satisfy at least two of the relationships represented by the above formulas (1) to (3). 9. The electronic apparatus according to claim 1 , wherein the first deformation layer and the second deformation layer satisfy all the relationships represented by the above formulas (1) to (3). 10. The electronic apparatus according to claim 1 , wherein the first deformation layer and the second deformation layer satisfy at least one of relationships represented by the following formulas (4) to (6), Elastic modulus of the first deformation layer<elastic modulus of the second deformation layer  (4) Thickness of the first deformation layer>thickness of the first deformation layer  (5) Area occupancy of the first deformation layer<area occupancy of the first deformation layer  (6) 11. The electronic apparatus according to claim 1 , wherein the first deformation layer has an elastic modulus of 0.04 MPa or less, the first deformation layer has a thickness of 10 μm or more and 1000 μm or less, and the first deformation layer has an area occupancy of 10% or more and 100% or less. 12. An electronic apparatus comprising: an exterior body; a pressure-sensitive sensor having a first surface and a second surface; a support body supporting the pressure-sensitive sensor such that the exterior body faces the first surface; and a first deformation layer disposed at least either between the first surface and the exterior body or between the second surface and the support body, and including a conductive material, wherein the pressure-sensitive sensor includes a capacitive sensor electrode unit including a sensing unit, and a second deformation layer disposed between the first deformation layer and the sensor electrode unit, and the first deformation layer and the second deformation layer satisfy at least one of relationships represented by the following formulas (1) to (3), Elastic modulus of the first deformation layer≤elastic modulus of the second deformation layer  (1) Thickness of the first deformation layer≥thickness of the second deformation layer  (2) Area occupancy of the first deformation layer≤area occupancy of the second deformation layer  (3) 13. A sensor comprising: a pressure-sensitive sensor main body having a first surface and a second surface; and a first deformation layer disposed on at least one of the first surface or the second surface, wherein the pressure-sensitive sensor main body includes a capacitive sensor electrode unit including a sensing unit, a reference electrode layer, and a second deformation layer disposed between the reference electrode layer and the sensor electrode unit, and the first deformation layer and the second deformation layer satisfy at least one of relationships represented by the following formulas (1) to (3), Elastic modulus of the first deformation layer≤elastic modulus of the second deformation layer  (1) Thickness of the first deformation layer≥thickness of the second deformation layer  (2) Area occupancy of the first deformation layer≤area occupancy of the second deformation layer  (3) 14. An input device comprising: an exterior body; a pressure-sensitive sensor having a first surface and a second surface; a support body supporting the pressure-sensitive sensor such that the exterior body faces the first surface; and a first deformation layer disposed at least either between the first surface and the exterior body or between the second surface and the support body, wherein the pressure-sensitive sensor includes a capacitive sensor electrode unit including a sensing unit, a reference electrode layer, and a second deformation layer disposed between the reference electrode layer and the sensor electrode unit, and the first deformation layer and the second deformation layer satisfy at least one of relationships represented by the following formulas (1) to (3), Elastic modulus of the first deformation layer≤elastic modulus of the second deformation layer  (1) Thickness of the first deformation layer≥thickness of the second deformation layer  (2) Area occupancy of the first deformation layer≤area occupancy of the second deformation layer  (3)

Assignees

Inventors

Classifications

  • Elastic · CPC title

  • comprising epoxy resins · CPC title

  • Metallic coating · CPC title

  • comprising polyesters · CPC title

  • using interposed adhesives or interposed materials with bonding properties · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11029221B2 cover?
An electronic apparatus includes: an exterior body; a pressure-sensitive sensor having a first surface and a second surface; a support body supporting the pressure-sensitive sensor such that the exterior body faces the first surface; and a first deformation layer disposed at least either between the first surface and the exterior body or between the second surface and the support body. The pres…
Who is the assignee on this patent?
Sony Corp
What technology area does this patent fall under?
Primary CPC classification G06F1/169. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jun 08 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).