Dual seated by-pass valve for surface coolers

Patent metadata

Field	Value
Publication number	US-11029103-B2
Application number	US-201916444546-A
Country	US
Kind code	B2
Filing date	Jun 18, 2019
Priority date	Sep 22, 2013
Publication date	Jun 8, 2021
Grant date	Jun 8, 2021

Abstract

A heat exchanger circuit can include a heat exchanger having a body with a plurality of cooling fins for the heat exchanger, a plurality of core cooling channels within the body, a plurality of de-congealing channels in fluid communication with the plurality of core cooling channels, and a by-pass valve in fluid communication with the plurality of core cooling channels and the plurality of de-congealing channels.

First claim

What is claimed is:

1. A heat exchanger circuit, comprising:
a heat exchanger having a body comprising:
a plurality of cooling fins for the heat exchanger;
a plurality of core cooling channels within the body;
a plurality of de-congealing channels in fluid communication with the plurality of core cooling channels; and
a by-pass valve in fluid communication with the plurality of core cooling channels and the plurality of de-congealing channels, the by-pass valve further comprising:
a valve body;
a power element extending through the valve body;
a de-congealing flow path passing through the valve body;
a core cooling flow path passing through the valve body;
a de-congealing poppet in fluid communication with the de-congealing flow path and operably connected to the power element, the de-congealing poppet being movable between a closed position and an open position that allows for fluid flow to the plurality of de-congealing channels; and
a core cooling poppet in fluid communication with the core cooling flow path and operably connected to the power element, the core cooling poppet being movable between a closed position and an open position that allows for fluid flow to the plurality of core cooling channels.

2. The heat exchanger circuit of claim 1 , wherein the power element is biased by a return spring.

3. The heat exchanger circuit of claim 2 further comprising an overpressure spring engaging the de-congealing poppet.

4. The heat exchanger circuit of claim 3 wherein the de-congealing poppet is spring biased toward the closed position.

5. The heat exchanger circuit of claim 3 further comprising an overpressure poppet disposed between the de-congealing flow path and the core cooling flow path.

6. The heat exchanger circuit of claim 5 wherein the overpressure spring is configured to engage the overpressure poppet.

7. The heat exchanger circuit of claim 1 wherein the power element comprises a wax capsule.

8. The heat exchanger circuit of claim 7 wherein the wax capsule is configured to change state based on a temperature of the fluid passing therethrough.

9. The heat exchanger circuit of claim 1 wherein the core cooling poppet is closed and the de-congealing poppet is open when a temperature of the fluid is at or below a predetermined threshold temperature.

10. The heat exchanger circuit of claim 9 wherein the core cooling poppet is open and the de-congealing poppet is closed when the temperature of the fluid exceeds the predetermined threshold temperature.

11. The heat exchanger circuit of claim 10 further comprising an overpressure poppet configured to open to relieve pressure when a pressure of the fluid exceeds a predetermined threshold pressure.

12. The heat exchanger circuit of claim 1 , wherein the core cooling poppet is connected to the power element, and the de-congealing poppet moves relative to the power element.

13. A heat exchanger circuit, comprising:
a heat exchanger having a body comprising:
a plurality of cooling fins for the heat exchanger;
a plurality of core cooling channels within the body arranged closer to the plurality of cooling fins, with the plurality of core cooling channels having a cooling inlet connection and a cooling outlet connection;
a plurality of de-congealing channels in fluid communication with the cooling inlet connection and the cooling outlet connection, the de-congealing channels having a de-congealing inlet and a de-congealing outlet; and
a by-pass valve in fluid communication with the cooling inlet connection, the cooling outlet connection, the de-congealing inlet, and the de-congealing outlet, and configured to selectively channel fluid through the plurality of core cooling channels during a first mode of operation and through the plurality of de-congealing channels during a second mode of operation.

14. The heat exchanger circuit of claim 13 wherein the by-pass valve further comprises a movable de-congealing poppet that selectively allows for fluid flow to the plurality of de-congealing channels, and a movable core cooling poppet that selectively allows for fluid flow to the plurality of core cooling channels.

15. The heat exchanger circuit of claim 14 wherein the by-pass valve further comprises:
a valve body;
a power element extending through the valve body;
a de-congealing flow path passing through the valve body; and
a core cooling flow path passing through the valve body.

16. The heat exchanger circuit of claim 15 wherein at least one of the de-congealing poppet or the core cooling poppet are operably coupled to the power element.

17. The heat exchanger circuit of claim 15 wherein the power element comprises a wax capsule configured to change state based on a temperature of the fluid passing therethrough.

18. The heat exchanger circuit of claim 15 wherein the core cooling poppet is open and the de-congealing poppet is closed during the first mode of operation when a temperature of the fluid exceeds a predetermined threshold temperature.

19. The heat exchanger circuit of claim 15 wherein the core cooling poppet is closed and the de-congealing poppet is open during the second mode of operation when a temperature of the fluid is at or below a predetermined threshold temperature.

20. The heat exchanger circuit of claim 15 wherein the core cooling poppet is connected to the power element, and the de-congealing poppet is movable relative to the power element.

Assignees

• Unison Ind Llc

Inventors

• Storage Michael Ralph
• Mcqueen Dennis Alan

Classifications

• F16K11/02

  with all movable sealing faces moving as one unit · CPC title

• F28F1/022

  with multiple channels · CPC title

• F28F3/048

  in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels · CPC title

• F28F3/02

  Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations (F28F3/08 takes precedence) · CPC title

• F28F2250/06

  Derivation channels, e.g. bypass · CPC title