Monomer composition and curable composition containing same
US-2017158812-A1 · Jun 8, 2017 · US
US11028224B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11028224-B2 |
| Application number | US-201916622222-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 25, 2019 |
| Priority date | Feb 5, 2018 |
| Publication date | Jun 8, 2021 |
| Grant date | Jun 8, 2021 |
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The present invention provides a monomer mixture that rapidly cures even in high humidity environments, and is useful as a raw material for a curable composition that forms a cured product having excellent adhesion to metals and glass, as well as of course to paper and plastic.The monomer mixture according to an embodiment of the present invention contains two or more types of cationically polymerizable monomers. The monomer mixture contains, as the cationically polymerizable monomers, a compound (A) having a vinyl ether group and a hydroxyl group; a compound (B) having an oxetanyl group and a hydroxyl group; and a compound (C) represented by Formula (c) below. A total content of the compound (A), the compound (B), and the compound (C) is 50 wt. % or greater of the total amount of the monomer mixture, and a content [A] of the compound (A) and a content [B] of the compound (B) satisfy Relationship (1) below.A/(A+B)≥0.3 (1)
Opening claim text (preview).
The invention claimed is: 1. A monomer mixture comprising two or more types of cationically polymerizable monomers, the monomer mixture comprising, as the cationically polymerizable monomers: a compound (A) having one vinyl ether group and one hydroxyl group; a compound (B) having one oxetanyl group and one hydroxyl group; a compound (C) represented by Formula (c): where X denotes a single bond or a linking group; and a compound (E) having two or more oxetanyl groups, excluding a compound having a hydroxyl group; wherein a total content of the compound (A), the compound (B), and the compound (C) is 50 wt. % or greater of the total amount of the monomer mixture, and a content [A] of the compound (A) and a content [B] of the compound (B) satisfy Relationship (1); A /( A+B )≥0.3 (1) and the content of the compound (E) being from 15 to 40 wt. % of the total amount of the monomer mixture and the content [B] of the compound (B) being from 1 to 15 wt. % of the total amount of the monomer mixture. 2. The monomer mixture according to claim 1 , further comprising, as a cationically polymerizable monomer, a compound (D) having two or more vinyl ether groups bonded to an alicyclic skeleton or a non-aromatic heterocyclic skeleton, excluding a compound having a hydroxyl group, the content of the compound (D) being from 1 to 10 wt. % of the total amount of the monomer mixture. 3. A curable composition comprising a monomer mixture described in claim 1 and a curing catalyst. 4. The curable composition according to claim 3 , comprising a sensitizer, or a sensitizer and a sensitization auxiliary agent. 5. The curable composition according to claim 3 , comprising a coloring material. 6. The curable composition according to claim 3 , comprising a dispersant. 7. The curable composition according to claim 3 , wherein the curable composition is a coating agent. 8. The curable composition according to claim 3 , wherein the curable composition is an adhesive agent. 9. A cured product of the curable composition described in claim 3 . 10. A cured product described in claim 8 , wherein adhesion to a paper substrate, a plastic substrate, a metal substrate, and a glass substrate is rated grade 0 to 2 in a 6-grade classification test through a cross-cut method in accordance with JIS K 5600-5-6. 11. A molded article comprising the cured product described in claim 9 . 12. A structure comprising the cured product described in claim 9 on a substrate surface.
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