Oxazine compound, composition and cured product

Patent metadata

Field	Value
Publication number	US-11028059-B2
Application number	US-201615781801-A
Country	US
Kind code	B2
Filing date	Nov 24, 2016
Priority date	Dec 8, 2015
Publication date	Jun 8, 2021
Grant date	Jun 8, 2021

Abstract

The present invention provides an oxazine compound having a specific structure, which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon triple bond structure. The present invention further provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having a layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention.

First claim

The invention claimed is:

1. An oxazine compound comprising:
a structure which is represented by General Formula (1-1):

wherein, in General Formula (1-1),
Ar 1 represents a substituted or unsubstituted aromatic group,
a ring A represents a substituted or unsubstituted aromatic ring,
each R 1 is indenpendtly a functional group represented by General Formula (2)
a 1 -X 1 —Y 1 —X 2 —≡—R 2   (2),

and R 3 and R 4 each independently represent a hydrogen atom, or an alkyl group having 1 to 3 carbon atoms;
and wherein, in General Formula (2),
X 1 , X 2 , and Y 1 each independtly represent a single bond or a divalent linking group,
R 2 represents a hydrogen atom, a hydrocarbon group, or a hydrocarbon group in which one or more hydrogen atoms contained in the hydrocarbon group are substituted with any one of a hydroxyl group, an alkoxy group, and a halogen atom,
and a 1 represents a bonding point to the oxazinc compound (1-1);
and wherein the divalent linking group in each of X 1 , X 2 , and Y 1 in General Formula (2) is an oxygen atom; a divalent hydrocarbon group; a divalent group in which one or more hydrogen atoms contained in a divalent hydrocarbon group are substituted with a hydroxyl group, an alkoxy group, or a halogen atom; a carbonyl group; an ester group; an amide group; an imino group; an azo group; a sulfide group; a sulfone group; or a divalent linking group formed by combining two or more these groups.

2. The oxazine compound according to claim 1 , wherein the aromatic ring of ring A is a benzene ring or a naphthalene ring.

3. A composition comprising the oxazine compound according to claim 1 .

4. The composition according to claim 3 , further comprising a reactive compound.

5. The composition according to claim 3 , further comprising a filler.

6. The composition according to claim 3 , further comprising a fibrous substrate.

7. A cured product, which is obtained by curing the composition according to claim 3 .

8. A laminate comprising:
a base material; and
a layer of the cured product according to claim 7 .

9. A heat-resistant member comprising the cured product according to claim 7 .

10. An electronic member comprising the cured product according to claim 7 .

11. A semiconductor sealing material comprising the composition according to claim 3 .

12. A prepreg comprising the composition according to claim 6 .

13. A circuit board comprising the prepreg according to claim 12 and a copper foil layer.

14. A build-up substrate comprising the laminate of claim 8 .

Assignees

• Dainippon Ink & Chemicals

Inventors

• Shimono Tomohiro
• Yamaguchi Junji
• Otsu Masato
• Arita Kazuo

Classifications

• H10W74/473

  containing a filler · CPC title

• H10W74/40

  characterised by their materials · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W70/695

  Organic materials · CPC title

• H10W40/251

  Organics · CPC title