Semiconductor device with discharge path, and method for producing the same

Patent metadata

Field	Value
Publication number	US-11027968-B2
Application number	US-202016805112-A
Country	US
Kind code	B2
Filing date	Feb 28, 2020
Priority date	Mar 20, 2019
Publication date	Jun 8, 2021
Grant date	Jun 8, 2021

Abstract

In a semiconductor device, a first substrate and a second substrate are bonded to each other through an insulating film. A hermetically sealed chamber is provided between the first substrate and the second substrate, and a sensing part is enclosed in the hermetically sealed chamber. The second substrate has a through hole penetrating in a stacking direction of the first substrate and the second substrate and exposing the first surface of the first substrate. A penetrating electrode is disposed on a wall surface of the through hole of the second substrate, and is electrically connected to the sensing part. A discharge path is provided, at a position located between the hermetically sealed chamber and the through hole for releasing outgas generated during bonding from the hermetically sealed chamber to the through hole.

First claim

What is claimed is:

1. A semiconductor device comprising:
a first substrate having a first surface;
a second substrate having a second surface, the second substrate being bonded to the first substrate such that the second surface faces the first surface of the first substrate and a hermetically sealed chamber is provided between the first substrate and the second substrate, the second substrate having a through hole that penetrates the second substrate in a stacking direction of the first substrate and the second substrate and exposes the first surface of the first substrate;
an insulating film disposed between the first surface of the first substrate and the second surface of the second substrate;
a sensing part disposed in the hermetically sealed chamber, the sensing part including a vibrator;
a penetrating electrode disposed on a wall surface of the through hole of the second substrate, the penetrating electrode being electrically connected to the sensing part; and
a discharge path defining a space, at a position located between the hermetically sealed chamber and the through hole.

2. The semiconductor device according to claim 1 , wherein
the discharge path is disposed at the position that is away from the hermetically sealed chamber and the through hole.

3. The semiconductor device according to claim 1 , wherein
the discharge path is disposed at the position that is in communication with the through hole and is away from the hermetically sealed chamber.

4. The semiconductor device according to claim 1 , wherein
the discharge path is disposed at the position that is in communication with the hermetically sealed chamber and is away from the through hole.

5. The semiconductor device according to claim 1 , wherein
the first substrate, the second substrate and the insulating film are bonded to each other entirely in an area between the hermetically sealed chamber and the through hole excluding the position where the discharge path is provided.

6. A method for producing a semiconductor device, comprising:
preparing a first substrate having a first surface;
forming a sensing part in the first substrate adjacent to the first surface;
preparing a second substrate having a second surface;
forming an insulating film on at least one of the first substrate and the second substrate;
bonding the first surface of the first substrate and the second surface of the second substrate through the insulating film to provide a hermetically sealed chamber between the first substrate and the second substrate and to enclose the sensing part including a vibrator in the hermetically sealed chamber;
forming a through hole in the second substrate and the insulating film in a stacking direction of the first substrate and the second substrate to expose the first surface of the first substrate;
forming a penetrating electrode in the through hole to be electrically connected to the sensing part; and
before the bonding, forming a recess at a position that is to be located between the hermetically sealed chamber and the through hole in the bonding and the forming of the through hole, wherein
in the bonding, the first surface of the first substrate and the second surface of the second substrate are bonded through the insulating film so that a discharge path is provided by the recess at the position that is to be located between the hermetically sealed chamber and the through hole in the forming of the through hole,
the method further comprising:
after the forming of the through hole and before the forming of the penetrating electrode, performing a heat treatment to release outgas, which is generated in the bonding, from the hermetically sealed chamber to the through hole through the discharge path.

7. The method according to claim 6 , wherein
the heat treatment to release the outgas is performed at a temperature higher than a temperature of the bonding.

Assignees

• Denso Corp

Inventors

• Suzuki Megumi
• Akashi Teruhisa

Classifications

• H10W95/00 Primary

  Packaging processes not covered by the other groups of this subclass · CPC title

• B81B7/0061

  suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound · CPC title

• B81B2201/0242

  Gyroscopes · CPC title

• B81B2207/096

  through the substrate · CPC title

• B81C1/00309 Primary

  suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound · CPC title