Particles, connecting material and connection structure

Patent metadata

Field	Value
Publication number	US-11024439-B2
Application number	US-201615767833-A
Country	US
Kind code	B2
Filing date	Nov 18, 2016
Priority date	Nov 20, 2015
Publication date	Jun 1, 2021
Grant date	Jun 1, 2021

Abstract

Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part, and can increase the connection strength are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection is twice or less the average particle diameter of the particles before connection, or the particles have an average particle diameter of 1 μm or more and 300 μm or less, the particles have a 10% K value of 30 N/mm2 or more and 3000 N/mm2 or less, and the particles have a particle diameter CV value of 10% or less.

First claim

The invention claimed is:

1. A connecting material comprising:
resin particles; and
metal atom-containing particles,
the resin particles having an average particle diameter of 1 μm or more and 300 μm or less,
the resin particles having a 10% K value of 30 N/mm 2 or more and 3000 N/mm 2 or less,
the resin particles having a particle diameter CV value of 10% or less, and
the resin particles having a thermal decomposition temperature of 200° C. or more, and
the metal atom-containing particles being metal atom-containing particles that are capable of being sintered by heating at less than 400° C.

2. The connecting material according to claim 1 , wherein the number of aggregated particles per million particles of the resin particles is 100 or less.

3. The connecting material according to claim 1 , wherein
a material for the resin particles contains a vinyl compound, a (meth)acrylic compound, an α-olefin compound, a diene compound, or a silicone compound.

4. The connecting material according to claim 1 , further comprising:
a resin.

5. The connecting material according to claim 1 , wherein
the thermal decomposition temperature of the resin particles is higher than a melting point of the metal atom-containing particles.

6. A connection structure, comprising:
a first member to be connected;
a second member to be connected; and
a connection part that connects the first member to be connected and the second member to be connected,
a material for the connection part being the connecting material according to claim 1 .

7. The connecting material according to claim 1 , wherein
the resin particles have the thermal decomposition temperature of 300° C. or more.

Assignees

• Sekisui Chemical Co Ltd

Inventors

• Yamagami Mai
• Haneda Satoshi
• Wakiya Takeshi
• Yamada Yasuyuki
• Ueda Saori
• Sasadaira Masao

Classifications

• H10W72/354

  comprising polymers · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W72/351

  Materials of die-attach connectors · CPC title

• H10W72/325

  Die-attach connectors having a filler embedded in a matrix · CPC title

• B22F1/17

  Metallic particles coated with metal · CPC title