Chemically amplified positive-type photosensitive resin composition, photosensitive dry film, method of manufacturing photosensitive dry film, method of manufacturing patterned resist film, method of manufacturing substrate with template, method of manufacturing plated article, and mercapto compound

Patent metadata

Field	Value
Publication number	US-11022880-B2
Application number	US-201816160297-A
Country	US
Kind code	B2
Filing date	Oct 15, 2018
Priority date	Oct 25, 2017
Publication date	Jun 1, 2021
Grant date	Jun 1, 2021

Abstract

A chemically amplified positive-type photosensitive resin composition capable of suppressing the occurrence of “footing” in which the width of the bottom (the side proximal to the surface of a support) becomes narrower than that of the top (the side proximal to the surface of a resist layer) in the nonresist portion; and the generation of development residue when a resist pattern serving as a template for a plated article is formed on a metal surface of a substrate using the photosensitive resin composition. A mercapto compound having a specific structure is included in the photosensitive resin composition, and includes an acid generator which generates acid upon exposure to an irradiated active ray or radiation, and a resin whose solubility in alkali increases under the action of acid.

First claim

What is claimed is:

1. A chemically amplified positive-type photosensitive resin composition comprising:
an acid generator (A) which generates acid upon exposure to an irradiated active ray or radiation;
a resin (B) whose solubility in alkali increases under the action of acid; and
a mercapto compound (C) represented by the following formula (C1-1):

wherein R c1 s each independently represent a hydrogen atom, a hydrocarbon group or an acid dissociable group, n1 is an integer of 1 or more and 4 or less, n2 is 1 or 2, at least one of R c1 is a hydrogen atom or an acid dissociable group, and A c is an (n1+n2)-valent aliphatic cyclic group which optionally has one or more substituents and optionally includes one or more heteroatoms, or is represented by the following formula (C1-4):

wherein R c1 s each independently represent a hydrogen atom, a hydrocarbon group or an acid dissociable group, n1 is an integer of 1 or more and 4 or less, n2 is 1 or 2, at least one of R c1 is a hydrogen atom or an acid dissociable group, X c1 is an (n1+1)-valent nitrogen-containing heterocyclic group, and X c2 is a single bond or an optionally substituted (n2+1)-valent hydrocarbon group.

2. The chemically amplified positive-type photosensitive resin composition according to claim 1 , comprising, as the mercapto compound (C) a mercapto compound represented by the following formula (C1-1):

wherein R c1 , n1 and n2 are the same as those in the formula (C1-1), and A c is an (n1+n2)-valent aliphatic cyclic group which optionally has one or more substituents and optionally includes one or more heteroatoms.

3. The chemically amplified positive-type photosensitive resin composition according to claim 1 , wherein the mercapto compound (C) is represented by the following formula (C1-2):

wherein R c1 is the same as that in the formula (C1-1), R c2 and R c6 are each independently a hydrogen atom or an alkyl group, or R c2 and R c6 may be bonded to each other to form a divalent group selected from the group consisting of —O—, —S—, —CH 2 — and —C(CH 3 ) 2 —, R c3 , R c4 , R c5 and R c7 are each independently a hydrogen atom or a mercapto group, R c8 is a hydrogen atom or a group represented by —CO—O—R c9 , R c9 is a hydrogen atom, a hydrocarbon group or an acid dissociable group, at least one of R c1 and R c9 is a hydrogen atom or an acid dissociable group, and at least one of R c3 , R c4 , R c5 and R c7 is a mercapto group.

4. The chemically amplified positive-type photosensitive resin composition according to claim 1 , comprising, as the mercapto compound (C) is a compound represented by the following formula (C1-4):

wherein R c1 , n1 and n2 are the same as those in the formula (C1-1), X c1 is an (n1+1)-valent nitrogen-containing heterocyclic group, and X c2 is a single bond or an optionally substituted (n2+1)-valent hydrocarbon group.

5. The chemically amplified positive-type photosensitive resin composition according to claim 4 , wherein X c2 is an aromatic (n2+1)-valent hydrocarbon group substituted with one or more electron withdrawing groups.

6. The chemically amplified positive-type photosensitive resin composition according to claim 1 , further comprising an alkali-soluble resin (D).

7. The chemically amplified positive-type photosensitive resin composition according to claim 6 , wherein the alkali-soluble resin (D) comprises a resin selected from the group consisting of a novolak resin (D1), a polyhydroxystyrene resin (D2), and an acrylic resin (D3).

8. A photosensitive dry film comprising a substrate film, and a photosensitive resin layer formed on a surface of the substrate film, the photosensitive resin layer comprising the chemically amplified positive-type photosensitive resin composition according to claim 1 .

9. A method of manufacturing a photosensitive dry film comprising applying the chemically amplified positive-type photosensitive resin composition according to claim 1 onto a substrate film to form a photosensitive resin layer.

10. A method of manufacturing a patterned resist film comprising:
laminating a photosensitive resin layer on a substrate having a metal surface, the layer comprising the chemically amplified positive-type photosensitive resin composition according to claim 1 ;
exposing the photosensitive resin layer through irradiation with an active ray or radiation in a position-selective manner; and
developing the exposed photosensitive resin layer.

11. A method of manufacturing a substrate with a template comprising:
laminating a photosensitive resin layer on a substrate having a metal surface, the layer comprising the chemically amplified positive-type photosensitive resin composition according to claim 1 ,
exposing the photosensitive resin layer through irradiation with an active ray or radiation in a position-selective manner, and
developing the exposed photosensitive resin layer to prepare a template for a plated article.

12. A method of manufacturing a plated article comprising plating the substrate with the template manufactured by the method according to claim 11 to form the plated article in the template.

13. A mercapto compound represented by the following formula (C1-1):

wherein A c is an (n1+n2)-valent aliphatic cyclic group which optionally has one or more substituents and optionally includes one or more heteroatoms, R c1 each independently represent a hydrogen atom, a hydrocarbon group or an acid dissociable group, n1 is an integer of 1 or more and 4 or less, n2 is 2, and at least one of R c1 s is a hydrogen atom or an acid dissociable group or represented by the following formula (C1-5):

wherein each R c1 independently represent a hydrogen atom, a hydrocarbon group or an acid dissociable group, n1 is an integer of 1 or more and 4 or less, n2 is 1 or 2, at least one of R c1 s is a hydrogen atom or an acid dissociable group, X c1 is an (n1+1)-valent nitrogen-containing heterocyclic group, and X c3 is an aromatic (n2+1)-valent hydrocarbon group substituted with one or more electron withdrawing groups.

14. The mercapto compound according to claim 13 , which is represented by the following formula (C1-3):

wherein R c1 is the same as that in the formula (C1-1), R c2 , and R c6 are each independently a hydrogen atom or an alkyl group, or R c2 and R c6 may be bonded to each other to form a divalent group selected from the group consisting of —O—, —S—, —CH 2 — and —C(CH 3 ) 2 —, R c3 , R c4 , R c5 and R c7 are each independently a hydrogen atom or a mercapto group, R c9 is a hydrogen atom, a hydrocarbon group or an acid dissociable group, at least one of R c1 and R c9 is a hydrogen atom or an acid dissociable group, and at least one of R c3 , R c4 , R c5 and R c7 is a mercapto group.

Assignees

• Tokyo Ohka Kogyo Co Ltd

Inventors

• Kawaue Akiya
• Yamamoto Yuta
• Ebisawa Kazuaki
• Kuroiwa Yasushi

Classifications

• G03F7/26

  Processing photosensitive materials; Apparatus therefor (G03F7/12 - G03F7/24 take precedence) · CPC title

• G03F7/039 Primary

  Macromolecular compounds which are photodegradable, e.g. positive electron resists (G03F7/075 takes precedence; macromolecular quinonediazides G03F7/023) · CPC title

• G03F7/0045 Primary

  with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors · CPC title

• C07C323/62

  having the sulfur atom of at least one of the thio groups bound to a carbon atom of a six-membered aromatic ring of the carbon skeleton · CPC title

• C07C323/61 Primary

  having the sulfur atom of at least one of the thio groups bound to a carbon atom of a ring other than a six-membered aromatic ring of the carbon skeleton · CPC title