Polarizing device and method for preparing the same, display substrate and display device
US-2020174172-A1 · Jun 4, 2020 · US
Metal wire grid and its manufacturing method, and display panel
US11022736B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11022736-B2 |
| Application number | US-201916408973-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 10, 2019 |
| Priority date | Nov 23, 2018 |
| Publication date | Jun 1, 2021 |
| Grant date | Jun 1, 2021 |
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- Title
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Abstract
Official abstract text for this publication.
An embodiment of this disclosure discloses a metal wire grid comprising: a patterned metal layer and a patterned antireflective layer located on the patterned metal layer, wherein a surface of the antireflective layer distal to the patterned metal layer has a plurality of continuous pits. Embodiments of this disclosure further disclose a method of manufacturing a metal wire grid and a display panel.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of manufacturing a metal wire grid, comprising: providing a metal layer, providing a antireflective layer on the metal layer, wherein a surface of the antireflective layer distal to the metal layer has a plurality of continuous pits, and patterning the metal layer and the antireflective layer through a pattering process to form a metal wire grid, wherein providing the antireflective layer on the metal layer comprises: providing a protective layer on the metal layer; providing a substrate and performing ion implantation on a surface of the substrate to form an ion implantation layer; bonding the substrate with the protective layer so that the ion implantation layer is in contact with the protective layer; and pretreating the substrate, the protective layer, and the metal layer after the bonding, such that portions of the substrate other than the ion implantation layer are peeled off, and the plurality of continuous pits are formed on a surface of the ion implantation layer distal to the protective layer. 2. The manufacturing method according to claim 1 , wherein patterning the metal layer and the antireflective layer through the pattering process comprises: patterning the metal layer, the protective layer, and the ion implantation layer through a pattering process to form the metal wire grid. 3. The manufacturing method according to claim 2 , wherein performing ion implantation on a surface of the substrate comprises: implanting any of hydrogen ions, helium ions or oxygen ions into the surface of the substrate. 4. The manufacturing method according to claim 2 , wherein pretreating the substrate, the protective layer and the metal layer after the bonding comprises: heat-treating the substrate, the protective layer and the metal layer after the bonding. 5. The manufacturing method according to claim 2 , wherein a material of the substrate includes silicon.
Assignees
Inventors
Classifications
- G02B5/3058Primary
comprising electrically conductive elements, e.g. wire grids, conductive particles · CPC title
adapted to provide an additional optical effect, e.g. anti-reflection or filter · CPC title
Polarisers · CPC title
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Frequently asked questions
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- What does patent US11022736B2 cover?
- An embodiment of this disclosure discloses a metal wire grid comprising: a patterned metal layer and a patterned antireflective layer located on the patterned metal layer, wherein a surface of the antireflective layer distal to the patterned metal layer has a plurality of continuous pits. Embodiments of this disclosure further disclose a method of manufacturing a metal wire grid and a display p…
- Who is the assignee on this patent?
- Boe Technology Group Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification G02B5/3058. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Jun 01 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).