Conductive paste

Patent metadata

Field	Value
Publication number	US-11021626-B2
Application number	US-201816771274-A
Country	US
Kind code	B2
Filing date	Sep 26, 2018
Priority date	Dec 20, 2017
Publication date	Jun 1, 2021
Grant date	Jun 1, 2021

Abstract

A conductive paste of the present invention includes an elastomer composition containing silica particles (C), a conductive filler, and a solvent.

First claim

What is claim is:

1. A conductive paste comprising:
an elastomer composition containing silica particles (C);
a conductive filler, and
a solvent,
wherein the conductive filler includes a scale-like metallic powder (G) having a tap density of equal to or more than 2.80 g/cm 3 and equal to or less than 4.50 g/cm 3 and an average particle diameter D 50 of equal to or more than 2.30 μm and equal to or less than 14.0 μm.

2. The conductive paste according to claim 1 ,
wherein the elastomer composition includes one or more thermosetting elastomer composition for forming elastomers selected from the group consisting of silicone rubber, urethane rubber, and fluorine rubber.

3. The conductive paste according to claim 1 ,
wherein the conductive paste is used to form a wire configuring a stretchable wiring substrate.

4. The conductive paste according to claim 1 ,
wherein the solvent includes a high-boiling point solvent having a boiling point of equal to or higher than 100° C. and equal to or lower than 300° C.

5. The conductive paste according to claim 1 ,
wherein the solvent includes an aliphatic hydrocarbon having 5 to 20 carbon atoms.

6. The conductive paste according to claim 1 ,
wherein the solvent includes a first solvent in which a polarity term (δ p ) of a Hansen solubility parameter is equal to or less than 10 MPa 1/2 .

7. The conductive paste according to claim 1 ,
wherein a viscosity of the conductive paste measured at a room temperature (25° C.) and a shear rate of 20 [1/s] is equal to or more than 1 Pa·s and equal to or less than 100 Pa·s.

8. The conductive paste according to claim 1 ,
wherein, in the conductive paste, when a viscosity measured at a room temperature (25° C.) and a shear rate of 1 [1/s] is represented by η1, and a viscosity measured at a room temperature (25° C.) and a shear rate of 5 [1/s] is represented by η5, a thixotropy index that is a viscosity ratio (η1/η5) is equal to or more than 1.0 and equal to or less than 3.0.

9. The conductive paste according to claim 1 ,
wherein the conductive filler includes a metallic powder (G).

10. The conductive paste according to claim 1 ,
wherein a content of the conductive filler is equal to or more than 30% by mass and equal to or less than 85% by mass with respect to the entire conductive paste.

11. The conductive paste according to claim 1 ,
wherein a content of the silica particles (C) is equal to or more than 1% by mass and equal to or less than 20% by mass with respect to 100% by mass of a total amount of the silica particles (C) and the conductive filler.

12. The conductive paste according to claim 1 ,
wherein the elastomer composition includes a silicone rubber-based curable composition.

13. The conductive paste according to claim 12 ,
wherein the silicone rubber-based curable composition includes a vinyl group-containing organopolysiloxane (A).

14. The conductive paste according to claim 12 ,
wherein the silicone rubber-based curable composition further includes an organohydrogen polysiloxane (B).

15. The conductive paste according to claim 12 ,
wherein the silicone rubber-based curable composition further includes platinum or a platinum compound (E).

16. The conductive paste according to claim 1 ,
wherein a content of the elastomer composition is equal to or more than 1% by mass and equal to or less than 25% by mass with respect to the entire conductive paste.

17. A conductive paste comprising:
an elastomer composition containing silica particles (C);
a conductive filler, and
a solvent,
wherein the conductive filler includes a scale-like metallic powder (G) having a specific surface area of equal to or more than 0.50 m 2 /g and equal to or less than 2.00 m 2 /g and an average particle diameter D 50 of equal to or more than 2.30 μm and equal to or less than 10.0 μm.

18. The conductive paste according to claim 17 ,
wherein the elastomer composition includes one or more thermosetting elastomer composition for forming elastomers selected from the group consisting of silicone rubber, urethane rubber, and fluorine rubber.

19. The conductive paste according to claim 17 ,
wherein the conductive paste is used to form a wire configuring a stretchable wiring substrate.

20. The conductive paste according to claim 17 ,
wherein the solvent includes a high-boiling point solvent having a boiling point of equal to or higher than 100° C. and equal to or lower than 300° C.

Assignees

• Sumitomo Bakelite Co

Inventors

• Otani Mariko
• Hayakawa Shun
• Horimoto Akihiro
• MIYACHI Mayo

Classifications

• C08K2201/001

  Conductive additives · CPC title

• C08K2201/006

  Additives being defined by their surface area · CPC title

• C08G77/20

  containing silicon bound to unsaturated aliphatic groups · CPC title

• C08K3/36

  Silica · CPC title

• H01B1/22 Primary

  the conductive material comprising metals or alloys · CPC title