Manufacturing of decorative surfaces by inkjet
US-2016207307-A1 · Jul 21, 2016 · US
US11021623B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11021623-B2 |
| Application number | US-201916382895-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 12, 2019 |
| Priority date | Jul 3, 2014 |
| Publication date | Jun 1, 2021 |
| Grant date | Jun 1, 2021 |
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A jet ink composition, a jet ink coating method and a resulting jet ink coated article are all predicated upon the jet ink composition which includes in addition to a particulate pigment material and a solvent composition a resin composition. The resin composition includes an uncured silicone resin, an uncured epoxy resin and an uncured melamine resin. Upon thermal cure the uncured resin composition forms a cured resin composition with superior adhesion to substrates such as but not limited to glass substrates, ceramic substrates and metal oxide substrates.
Opening claim text (preview).
What is claimed is: 1. An ink composition comprising: a pigment material; an uncured resin composition comprising: an uncured silicone resin component comprising a silsesquioxane; an uncured epoxy resin component; and an uncured melamine resin component; and a solvent composition, wherein the ink composition has a viscosity of from about 4 to about 6 centipoise at about 25 degrees Celsius and the silsesquioxane is present in an amount of from about 15 to about 20 weight percent based on a total weight of the ink composition. 2. The ink composition of claim 1 wherein: the pigment material comprises a carbon black particulate pigment material present at about 3 to about 5 weight percent; the uncured resin composition comprises: the uncured epoxy resin component present at about 0.5 to about 3 weight percent; and the uncured melamine resin component present at about 1 to about 4 weight percent. 3. The ink composition of claim 2 wherein the carbon black particulate material has a particle size from about 100 to about 150 nanometers. 4. The ink composition of claim 1 further comprising an additive composition. 5. The ink composition of claim 4 wherein the additive composition comprises at least one of: a dispersant present at about 1.5 to about 3.5 weight percent; a flow promoter present at about 0.5 to about 1 weight percent; and a resin strengthener present at up to about 3 percent. 6. An ink coating method comprising: coating upon a substrate an uncured jet ink composition comprising: a pigment material; an uncured resin composition comprising: an uncured silicone resin component comprising a silsesquioxane component present at about 15 to about 20 weight percent based on a total weight of the ink composition; an uncured epoxy resin component; and an uncured melamine resin component; and a solvent composition; and curing in-situ the uncured jet ink composition upon the substrate to form a cured ink composition upon the substrate. 7. The method of claim 6 wherein the uncured jet ink composition is thermally cured to form the cured ink composition. 8. The method of claim 7 wherein the uncured ink composition is thermally cured at: a temperature from about 160 to about 250 degrees centigrade; and a time period from about 1 to about 20 minutes, in an inter atmosphere. 9. The method of claim 6 wherein the substrate is selected from the group consisting of a glass substrate, a ceramic substrate, a metal oxide substrate, a metal substrate, and a polymeric substrate. 10. The method of claim 6 , wherein the pigment material comprises a carbon black particulate. 11. The method of claim 6 , wherein: the pigment material comprises a carbon black particulate pigment material present at about 3 to about 5 weight percent; the uncured resin composition comprises: the uncured epoxy resin component present at about 0.5 to about 3 weight percent; and the uncured melamine resin component present at about 1 to about 4 weight percent.
Dispersed materials, e.g. conductive pastes or inks · CPC title
Carbon · CPC title
Ink jet · CPC title
Ethers; Acetals; Ketals; Ortho-esters · CPC title
Carbon · CPC title
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