Bonded laminate including a formed nonwoven substrate

US11020938B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11020938-B2
Application numberUS-201916690164-A
CountryUS
Kind codeB2
Filing dateNov 21, 2019
Priority dateDec 20, 2018
Publication dateJun 1, 2021
Grant dateJun 1, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Bonded formed laminates, and methods for making bonded formed laminates, are made from multiple layers of formed substrates comprising at least one nonwoven formed substrate which are bonded together at the distal ends or bases of protrusions formed in the substrates. The bonded formed laminate provides a very soft and lofty structure that is sustainable under compression.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of forming a laminate, the method comprising: incrementally mechanically stretching a first nonwoven substrate having a first plane by engaging at least a first portion of the first nonwoven substrate with a first pair of forming members to form within the first portion a plurality of first protrusions extending out of the first plane and a first region adjacent to the plurality of first protrusion in the first plane; the first pair of forming members comprising a first forming member having a plurality of male forming elements and a second forming member having a plurality of recesses; incrementally mechanically stretching a second substrate having a second plane by engaging at least a second portion of the second nonwoven substrate with a second pair of forming members to form within the second portion a plurality of second protrusions extending out of the second plane and a second region adjacent to the plurality of second protrusion in the second plane; the second pair of forming members comprising a first forming member having a plurality of male forming elements and a second forming member having a plurality of recesses; and directly connecting the first region adjacent to the plurality of first protrusion in the first plane to the a second region adjacent to the plurality of second protrusion in the second plane at a plurality of attachment areas, to form the laminate, while the portion of the first nonwoven substrate is engaged with the second forming member from the first pair of forming members having the plurality of recesses, and while the portion of the second substrate is engaged with the second forming member from the second pair of forming members having the plurality of recesses. 2. The method of claim 1 wherein the plurality of male forming elements are discrete spaced apart male forming elements. 3. A method of forming a laminate, the method comprising: incrementally mechanically stretching a first nonwoven substrate having a first plane by engaging at least a first portion of the first nonwoven substrate with a first pair of forming members to form within the first portion a plurality of first protrusions extending out of the first plane and a first region adjacent to the plurality of first protrusion in the first plane; the first pair of forming members comprising a first forming member having a plurality of male forming elements and a second forming member having a plurality of recesses; incrementally mechanically stretching a second nonwoven substrate having a second plane by engaging at least a second portion of the second nonwoven substrate with a second pair of forming members to form within the second portion a plurality of second protrusions extending out of the second plane and a second region adjacent to the plurality of second protrusion in the second plane; the second pair of forming members comprising a first forming member having a plurality of male forming elements and a second forming member having a plurality of recesses; and directly connecting the first distal ends of the plurality of first protrusions to the second distal ends of the plurality of second protrusions at a plurality of attachment areas to form the laminate, while the portion of the first nonwoven substrate is engaged with the first forming member from the first pair of forming members having a plurality of male elements, and while the portion of the second substrate is engaged with the first forming member from the second pair of forming members having a plurality of male elements. 4. The method of claim 3 wherein the plurality of male forming elements are discrete spaced apart male forming elements.

Assignees

Inventors

Classifications

  • characterised by a layer formed with recesses or projections, e.g. {hollows, grooves, protuberances, ribs (apertured layer B32B3/266; layer with cavities or internal voids B32B3/26)} · CPC title

  • characterised by a fibrous {or filamentary} layer {mechanically connected, e.g. by needling} to another layer, e.g. of fibres, of paper · CPC title

  • next to a fibrous or filamentary layer · CPC title

  • another layer {next to it} also being fibrous or filamentary {(relative arrangement of fibres or filaments of different layers B32B5/12)} · CPC title

  • using interposed adhesives or interposed materials with bonding properties · CPC title

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What does patent US11020938B2 cover?
Bonded formed laminates, and methods for making bonded formed laminates, are made from multiple layers of formed substrates comprising at least one nonwoven formed substrate which are bonded together at the distal ends or bases of protrusions formed in the substrates. The bonded formed laminate provides a very soft and lofty structure that is sustainable under compression.
Who is the assignee on this patent?
Procter & Gamble
What technology area does this patent fall under?
Primary CPC classification B32B3/28. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jun 01 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).