One or more conformal members used in the manufacture of a lapping plate, and related apparatuses and methods of making

Patent metadata

Field	Value
Publication number	US-11020838-B2
Application number	US-201715693837-A
Country	US
Kind code	B2
Filing date	Sep 1, 2017
Priority date	Sep 1, 2017
Publication date	Jun 1, 2021
Grant date	Jun 1, 2021

Abstract

The present disclosure includes one or more resilient members for use in an apparatus used to form lapping plates. The resilient members can permit processing members such as charging elements and shaving blades to conform to irregularities in surface topography of lapping plate platens.

First claim

What is claimed is:

1. An apparatus for processing a major surface of a lapping plate platen during the manufacture of an abrasive surface on the major surface of the lapping plate platen, wherein the apparatus comprises:
a) a rotatable platter configured to secure and physically support the lapping plate platen during processing of the major surface of the lapping plate platen;
b) a processing head mechanism that is rotatably and removably coupled to a processing head, wherein the processing head comprises:
i) a base;
ii) at least three resilient members attached to the base; and
iii) at least three processing members, wherein each processing member is attached to a corresponding resilient member, wherein each resilient member comprises a shaft, wherein the base comprises at least three corresponding through-holes to receive the shaft so that each resilient member is physically coupled to the base, wherein each resilient member is physically coupled to the base via a threaded connection, wherein each processing member can contact the major surface of the lapping plate platen under pressure to modify the surface of the lapping plate platen during the manufacture of the abrasive surface on the major surface of the lapping plate platen, wherein each resilient member permits the corresponding processing member to elastically move in response to a pressure increase while the corresponding processing member is in contact the major surface of the lapping plate platen under pressure to modify the surface of the lapping plate platen during the manufacture of the abrasive surface on the major surface of the lapping plate platen, and wherein the apparatus is configured to move the processing head to contact the major surface of the lapping plate platen with the at least three processing members under pressure while the processing head and the lapping plate platen rotate to modify the surface of the lapping plate platen during the manufacture of the abrasive surface on the major surface of the lapping plate platen.

2. The apparatus of claim 1 , wherein the at least three resilient members comprise a rubber member.

3. The apparatus of claim 1 , wherein the at least three processing members comprise at least three charging elements to force abrasive particles into the major surface of the lapping plate platen while the charging elements are in contact with the major surface of the lapping plate platen.

4. The apparatus of claim 3 , wherein the at least three charging elements comprise at least three charging rings.

5. The apparatus of claim 4 , wherein the at least three charging rings are made out of material comprising zirconia toughened alumina (ZTA).

6. The apparatus of claim 4 , wherein each charging ring has a diameter in the range from 0.5 to 3 inches.

7. The apparatus of claim 3 , wherein the at least three charging elements comprise at least three charging bars.

8. The apparatus of claim 1 , wherein each resilient member comprises elastomeric material.

9. The apparatus of claim 3 , wherein the at least three charging elements comprise three to eight charging rings.

10. The apparatus of claim 1 , wherein the rotatable platter and processing head are configured to rotate in the same direction.

11. The apparatus of claim 1 , wherein the processing head rotates about a first axis and the lapping plate platen rotates about a second axis, wherein the first axis is parallel to and offset from the second axis.

12. The apparatus of claim 1 , wherein each processing member is coupled to each corresponding resilient member via a threaded connection.

13. The apparatus of claim 1 , wherein the processing head is coupled to the processing head mechanism via a ball pin.

14. An apparatus for processing a major surface of a lapping plate platen during the manufacture of an abrasive surface on the major surface of the lapping plate platen, wherein the apparatus comprises:
a) a rotatable platter configured to secure and physically support the lapping plate platen during processing of the major surface of the lapping plate platen;
b) a processing head mechanism that is rotatably and removably coupled to a processing head, wherein the processing head comprises:
i) a base;
ii) at least three resilient members attached to the base; and
iii) at least three processing members, wherein each processing member is attached to a corresponding resilient member, wherein the at least three processing members comprise at least three charging elements to force abrasive particles into the major surface of the lapping plate platen while the charging elements are in contact with the major surface of the lapping plate platen, wherein the at least three charging elements comprise three to eight charging rings, wherein each resilient member comprises a shaft, and wherein the base comprises a corresponding through-hole for each shaft to receive the shaft so that the corresponding resilient member is physically coupled to the base via threaded connection, wherein each processing member can contact the major surface of the lapping plate platen under pressure to modify the surface of the lapping plate platen during the manufacture of the abrasive surface on the major surface of the lapping plate platen, wherein each resilient member permits the corresponding processing member to elastically move in response to a pressure increase while the corresponding processing member is in contact the major surface of the lapping plate platen under pressure to modify the surface of the lapping plate platen during the manufacture of the abrasive surface on the major surface of the lapping plate platen, and wherein the apparatus is configured to move the processing head to contact the major surface of the lapping plate platen with the at least three processing members under pressure while the processing head and the lapping plate platen rotate to modify the surface of the lapping plate platen during the manufacture of the abrasive surface on the major surface of the lapping plate platen.

15. The apparatus of claim 14 , wherein each processing member is coupled to each corresponding resilient member via a threaded connection.

16. The apparatus of claim 14 , wherein the processing head is coupled to the processing head mechanism via a ball pin.

17. The apparatus of claim 14 , wherein the at least three resilient members comprise a rubber member.

18. The apparatus of claim 14 , wherein each resilient member comprises elastomeric material.

19. The apparatus of claim 14 , wherein the rotatable platter and processing head are configured to rotate in the same direction.

20. The apparatus of claim 14 , wherein the processing head rotates about a first axis and the lapping plate platen rotates about a second axis, wherein the first axis is parallel to and offset from the second axis.

Assignees

• Seagate Technology Llc

Inventors

• Baurceanu Mihaela Ruxandra
• Phann Chea
• Mayer Kevin Lamber
• Anderson Ricky Ray
• Habermas Andrew David

Classifications

• B24B27/0076

  grinding machines comprising two or more grinding tools · CPC title

• B24B37/20

  Lapping pads for working plane surfaces · CPC title

• B24B53/017 Primary

  Devices or means for dressing, cleaning or otherwise conditioning lapping tools · CPC title

• B24B53/12

  Dressing tools; Holders therefor · CPC title

• B24B37/12

  Lapping plates for working plane surfaces · CPC title