Cooling module design for servers

US11019752B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11019752-B2
Application numberUS-201916447703-A
CountryUS
Kind codeB2
Filing dateJun 20, 2019
Priority dateJun 20, 2019
Publication dateMay 25, 2021
Grant dateMay 25, 2021

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

In one embodiment, a cooling module includes a base frame, a fluid supply channel disposed on the base frame to receive cooling fluid from an external cooling fluid source, a fluid return channel disposed on the base frame to return the cooling fluid, multiple cold plates disposed on the base frame, wherein the cold plates are to be attached to a plurality of data processing modules. The cooling module also includes multiple distribution channels to distribute the cooling fluid received from the fluid supply channel to the cold plates to exchange heat generated by the heat generating modules and to return the cooling fluid carrying the exchanged heat back to the external cooling fluid source via the fluid return channel. The base frame, the fluid supply and return channels, the fluid distribution channels, and the cold plates are integrated as a single integrated cooling unit.

First claim

Opening claim text (preview).

What is claimed is: 1. A cooling module, comprising: a base frame; a fluid supply channel disposed on the base frame to receive cooling fluid from an external cooling fluid source, wherein the fluid supply channel comprises a tapered manifold that narrows in the direction of fluid flow; a fluid return channel disposed on the base frame to return the cooling fluid; a plurality of cold plates disposed on a bottom surface of the base frame, wherein the cold plates are to be attached to a plurality of data processing modules; and a plurality of fluid distribution channels disposed on a top surface of the base frame to distribute the cooling fluid received from the fluid supply channel to the cold plates to exchange heat generated by the data processing modules and to return the cooling fluid carrying the exchanged heat back to the external cooling fluid source via the fluid return channel, wherein the base frame, the fluid supply and return channels, the fluid distribution channels, and the cold plates are integrated as a single integrated cooling unit comprised of a single piece of material, and wherein all fluid distribution channel connections are internal to the base frame and the fluid supply channel and the fluid return channel are the only external fluid connections to the plurality of fluid distribution channels. 2. The cooling module of claim 1 , wherein the base frame, the fluid supply channel, the fluid return channel, the plurality of cold plates, and the plurality of fluid distribution channels are formed from a single material. 3. The cooling module of claim 2 , wherein the single material comprises aluminum, copper, steel, or titanium. 4. The cooling module of claim 1 , wherein the plurality of cold plates are coupled to the plurality of distribution channels via a permanent coupling. 5. The cooling module of claim 1 , wherein the plurality of fluid distribution channels are located above a top surface of the base frame. 6. The cooling module of claim 1 , wherein the cooling module is adapted for use inside an autonomous vehicle. 7. The cooling module of claim 1 , wherein the plurality of cold plates are arranged in series on the cooling module, such that the cooling fluid passes a first group of cold plates before passing a second group of cold plates. 8. The cooling module of claim 1 , wherein the plurality of cold plates are arranged in parallel on the cooling module, such that the cooling fluid passes each of the plurality of cold plates at substantially the same time. 9. An electronic rack, comprising: a rack manifold having a rack liquid supply line to receive cooling liquid from a cooling liquid source and a rack liquid return line to return warmer liquid back to the cooling liquid source; and a plurality of server blades arranged in a stack, wherein each of the server blades includes a plurality of data processing modules and a cooling module attached to the data processing modules for heat exchanges, wherein the cooling module comprises a base frame, a fluid supply channel disposed on the base frame to receive cooling fluid from the rack liquid supply line, wherein the fluid supply channel comprises a tapered manifold that narrows in the direction of fluid flow, a fluid return channel disposed on the base frame to return the cooling fluid to rack liquid return line, a plurality of cold plates disposed on a bottom surface of the base frame, wherein the cold plates are to be attached to the data processing modules, and a plurality of fluid distribution channels disposed on a top surface of the base frame to distribute the cooling fluid received from the fluid supply channel to the cold plates to exchange heat generated by the data processing modules and to return the cooling fluid carrying the exchanged heat back to the external cooling fluid source via the fluid return channel, wherein the base frame, the fluid supply and return channels, the fluid distribution channels, and the cold plates are integrated as a single integrated cooling unit comprised of a single piece of material, and wherein all fluid distribution channel connections are internal to the base frame and the fluid supply channel and the fluid return channel are the only external fluid connections to the plurality of fluid distribution channels. 10. The electronic rack of claim 9 , wherein the base frame, the fluid supply channel, the fluid return channel, the plurality of cold plates, and the plurality of fluid distribution channels are formed from a single material. 11. The electronic rack of claim 10 , wherein the single material comprises aluminum, copper, steel, or titanium. 12. The electronic rack of claim 9 , wherein the plurality of cold plates are coupled to the plurality of distribution channels via a permanent coupling. 13. The electronic rack of claim 9 , wherein the plurality of fluid distribution channels are located above a top surface of the base frame. 14. The electronic rack of claim 9 , wherein the cooling module is adapted for use inside an autonomous vehicle. 15. The electronic rack of claim 9 , wherein the plurality of cold plates are arranged in series on the cooling module, such that the cooling fluid passes a first group of cold plates before passing a second group of cold plates. 16. A data center system, comprising: a room liquid supply line to receive cooling liquid from an external cooling source; a room liquid return line to return the cooling liquid back to the external cooling source; and a plurality of electronic racks, wherein each of the electronic racks comprises a rack manifold having a rack liquid supply line to receive cooling liquid from the room liquid supply line and a rack liquid return line to return warmer liquid back to the room liquid return line, and a plurality of server blades arranged in a stack, wherein each of the server blades includes a plurality of data processing modules and a cooling module attached to the data processing modules for heat exchanges, wherein the cooling module comprises a base frame, a fluid supply channel disposed on the base frame to receive cooling fluid from the rack liquid supply line, wherein the fluid supply channel comprises a tapered manifold that narrows in the direction of fluid flow, a fluid return channel disposed on the base frame to return the cooling fluid to rack liquid return line, a plurality of cold plates disposed on a bottom surface of the base frame, wherein the cold plates are to be attached to the data processing modules, and a plurality of fluid distribution channels disposed on a top surface of the base frame to distribute the cooling fluid received from the fluid supply channel to the cold plates to exchange heat generated by the data processing modules and to return the cooling fluid carrying the exchanged heat back to the external cooling fluid source via the fluid return channel, wherein the base frame, the fluid supply and return channels, the fluid distribution channels, and the cold plates are integrated as a single integrated cooling unit comprised of a single piece of material, and wherein all fluid distribution channel connections are internal to the base frame and the fluid supply channel and the fluid return channel are the only external fluid connections to the plurality of fluid distribution channels.

Assignees

Inventors

Classifications

  • within server blades for removing heat from heat source · CPC title

  • within server blades for removing heat from heat source · CPC title

  • within cabinets for removing heat from server blades · CPC title

  • within rooms for removing heat from cabinets · CPC title

  • Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11019752B2 cover?
In one embodiment, a cooling module includes a base frame, a fluid supply channel disposed on the base frame to receive cooling fluid from an external cooling fluid source, a fluid return channel disposed on the base frame to return the cooling fluid, multiple cold plates disposed on the base frame, wherein the cold plates are to be attached to a plurality of data processing modules. The coolin…
Who is the assignee on this patent?
Baidu Usa Llc
What technology area does this patent fall under?
Primary CPC classification H05K7/20772. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue May 25 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).