Printed circuit board and communications device

Patent metadata

Field	Value
Publication number	US-11019724-B2
Application number	US-201916727402-A
Country	US
Kind code	B2
Filing date	Dec 26, 2019
Priority date	Jun 27, 2017
Publication date	May 25, 2021
Grant date	May 25, 2021

Abstract

This application provides a multilayer printed circuit board (PCB). There is a pad array on a surface of the multilayer PCB. The pad array includes at least one padding unit, and each padding unit includes a first pad and a second pad that are adjacent. Both the first pad and the second pad are connected to a first Z-directed transmission line located in a Z-directed groove. In this way, to wire a signal wire on a signal layer of the multilayer PCB, a quantity of Z-directed grooves that need to be bypassed is less than a quantity of vias that need to be bypassed in the prior art. In other words, wiring of the signal wire is easier to some extent. In addition, this application further provides a corresponding communications device.

First claim

What is claimed is:

1. A multilayer printed circuit board (PCB), comprising:
a plurality of layers of subboards;
an X-row and Y-column pad array disposed on a surface of the multilayer PCB, wherein both X and Y are integers greater than or equal to 2; the pad array comprises at least one padding unit, wherein the padding unit comprises a first pad and a second pad that are adjacent; and
a Z-directed groove, wherein both the first pad and the second pad are located on a first side of the Z-directed groove, and the Z-directed groove penetrates through at least a portion of the subboards of the layers from the surface of the multilayer PCB in a thickness direction of the multilayer PCB; and
a first Z-directed transmission line disposed on a first inner wall closer to the first pad and the second pad in the Z-directed groove, wherein both the first pad and the second pad are connected to the first Z-directed transmission line, and the first Z-directed transmission line extends in the thickness direction of the multilayer PCB.

2. The multilayer PCB according to claim 1 , wherein both the first pad and the second pad are ground pads, or power pads connected to a same power supply.

3. The multilayer PCB according to claim 1 , wherein the padding unit further comprises a third pad and a fourth pad that are adjacent, the third pad is further adjacent to the second pad, the fourth pad is further adjacent to the first pad, both the third pad and the fourth pad are located on a second side of the Z-directed groove, and the first side and the second side are two sides of the Z-directed groove opposite to each other; and
wherein the multilayer PCB further comprises a second Z-directed transmission line disposed on a second inner wall closer to the third pad and the fourth pad in the Z-directed groove, wherein both the third pad and the fourth pad are connected to the second Z-directed transmission line, the second Z-directed transmission line extends in the thickness direction of the multilayer PCB, and the second Z-directed transmission line is isolated from the first Z-directed transmission line.

4. The multilayer PCB according to claim 3 , wherein both the third pad and the fourth pad are ground pads, or power pads connected to a same power supply.

5. The multilayer PCB according to claim 3 , wherein the multilayer PCB comprises a signal layer, a power layer, and a ground layer, wherein
one end of a Z-directed transmission line is connected to the signal pad, and the other end of the Z-directed transmission line is connected to the signal layer; or
one end of a Z-directed transmission line is connected to the power pad, and the other end of the Z-directed transmission line is connected to the power layer; or
one end of a Z-directed transmission line is connected to the ground pad, and the other end of the Z-directed transmission line is connected to the ground layer; wherein
the Z-directed transmission line is the first Z-directed transmission line or the second Z-directed transmission line.

6. The multilayer PCB according to claim 5 , wherein on the signal layer, a signal wire passes through a region between the two adjacent Z-directed grooves.

7. The multilayer PCB according to claim 1 , wherein the padding unit further comprises a third pad and a fourth pad that are adjacent, the third pad is further adjacent to the second pad, the fourth pad is further adjacent to the first pad, both the third pad and the fourth pad are located on a second side of the Z-directed groove, and the first side and the second side are two sides of the Z-directed groove opposite to each other; and
wherein the multilayer PCB further comprises two second Z-directed transmission lines disposed on a second inner wall closer to the third pad and the fourth pad in the Z-directed groove, wherein the third pad and the fourth pad each are connected to one of the second Z-directed transmission lines, the second Z-directed transmission lines extend in the thickness direction of the multilayer PCB, the two second Z-directed transmission lines are isolated from each other, and the second Z-directed transmission lines are both isolated from the first Z-directed transmission line.

8. The multilayer PCB according to claim 7 , wherein the third pad and the fourth pad are pads of different types, or signal pads configured to receive a pair of differential signals, or signal pads configured to receive different single-ended signals, or power pads configured to connect different power supplies.

9. The multilayer PCB according to claim 7 , wherein the third pad is connected to the corresponding second Z-directed transmission line through a first metallic wire, and an extending direction of the first metallic wire is perpendicular to the corresponding second Z-directed transmission line.

10. The multilayer PCB according to claim 7 , wherein a width of the first Z-directed transmission line is greater than a width of the second Z-directed transmission line, wherein in the thickness direction of the multilayer PCB, the width of the first Z-directed transmission line is fixed, and the width of the first Z-directed transmission line is a width of a projection of the first Z-directed transmission line on a plane of the surface of the multilayer PCB in the thickness direction of the multilayer PCB; and
in the thickness direction of the multilayer PCB, the width of the second Z-directed transmission line is fixed, and the width of the second Z-directed transmission line is a width of a projection of the second Z-directed transmission line on the plane of the surface of the multilayer PCB in the thickness direction of the multilayer PCB.

11. The multilayer PCB according to claim 1 , wherein
when the first pad and the second pad are located in one row, a length direction of the Z-directed groove is a row direction of the pad array; or
when the first pad and the second pad are located in one column, a length direction of the Z-directed groove is a column direction of the pad array; wherein
the length direction of the Z-directed groove is a direction of a connection line between two points with a longest distance in an opening corresponding to the Z-directed groove on the surface of the multilayer PCB.

12. The multilayer PCB according to claim 11 , wherein when two adjacent Z-directed grooves have a same length direction, the two adjacent Z-directed grooves communicate with each other.

13. The multilayer PCB according to claim 1 , wherein the Z-directed groove is filled with non-conductive dielectric.

14. A communications device, comprising a multilayer printed circuit board (PCB) and an input/output chip, wherein the multilayer PCB comprises
a plurality of layers of subboards;
an X-row and Y-column pad array on a surface of the multilayer PCB, wherein both X and Y are integers greater than or equal to 2; the pad array comprises at least one padding unit, wherein the padding unit comprises a first pad and a second pad that are adjacent;
a Z-directed groove, wherein both the first pad and the second pad are located on a first side of the Z-directed groove, and the Z-directed groove penetrates through at least a portion of the subboards of the layers from the surface of the multilayer PCB in a thickness direction of the multilayer PCB;
a first Z-directed transmission line disposed on a first inner wall closer to the first pad and the second pad in the Z-directed groove, wherein both the first pad and the second pad are connected to the first Z-directed transmission line, and the first Z-directed transmission line extends in the thickness direction of the multilayer PCB; and
wherein the inpu

Assignees

• Huawei Tech Co Ltd

Inventors

• Gao Feng
• Xie Ertang
• Jing Wei

Classifications

• H05K1/111 Primary

  Pads for surface mounting, e.g. lay-out · CPC title

• H05K1/113 Primary

  Via provided in pad; Pad over filled via · CPC title

• H05K2201/09427

  Special relation between the location or dimension of a pad or land and the location or dimension of a terminal · CPC title

• H05K2203/0207

  Partly drilling through substrate until a controlled depth, e.g. with end-point detection · CPC title

• H05K2201/10666

  Plated through-hole for surface mounting on PCB · CPC title