Chip antenna and chip antenna module including the same

Patent metadata

Field	Value
Publication number	US-11018418-B2
Application number	US-201816185118-A
Country	US
Kind code	B2
Filing date	Nov 9, 2018
Priority date	Jan 31, 2018
Publication date	May 25, 2021
Grant date	May 25, 2021

Abstract

A chip antenna includes a radiation portion having a block shape and a first surface and a second surface opposing each other, and configured to receive and radiate a feed signal as an electromagnetic wave; a first block made of a dielectric material and coupled to the first surface of the radiation portion; a second block made of a dielectric material and coupled to the second surface of the radiation portion; a ground portion having a block shape and coupled to the first block, and configured to reflect the electromagnetic wave radiated by the radiation portion back toward the radiation portion; and a director having a block shape and coupled to the second block, wherein an overall width of the ground portion, the first block, and the radiation portion is 2 mm or less, and the first block has a dielectric constant of 3.5 or more to 25 or less.

First claim

What is claimed is:

1. A chip antenna for radio communications in a millimeter wave communications band, the chip antenna being configured to be mounted on a board, receive a feed signal from a signal processing element, and externally radiate the feed signal, the chip antenna comprising:
a radiation portion having a block shape, and a first surface and a second surface opposing each other, and configured to receive and radiate the feed signal as an electromagnetic wave;
a first block made of a dielectric material and coupled to the first surface of the radiation portion;
a second block made of a dielectric material and coupled to the second surface of the radiation portion;
a ground portion having a block shape, coupled to the first block side so that the first block is between the ground portion and the radiation portion, and configured to reflect the electromagnetic wave radiated by the radiation portion back toward the radiation portion; and
a director having a block shape and coupled to the second block so that the second block is between the director and the radiation portion,
wherein an overall width of the ground portion, the first block, and the radiation portion is 2 mm or less,
the first block has a dielectric constant of 3.5 or more to 25 or less, and
the chip antenna has a hexahedral shape and a surface configured to be mounted on a surface of the board so that the radiation portion and the ground portion are mounted on the surface of the board.

2. The chip antenna of claim 1 , wherein the second block is made of the same dielectric material as the first block.

3. A chip antenna for radio communications in a millimeter wave communications band, the chip antenna being configured to be mounted on a board, receive a feed signal from a signal processing element, and externally radiate the feed signal, the chip antenna comprising:
a radiation portion having a block shape, and a first surface and a second surface opposing each other, and configured to receive and radiate the feed signal as an electromagnetic wave;
a first block made of a dielectric material and coupled to the first surface of the radiation portion;
a second block made of a dielectric material and coupled to the second surface of the radiation portion;
a ground portion having a block shape, coupled to the first block so that the first block is between the ground portion and the radiation portion, and configured to reflect the electromagnetic wave radiated by the radiation portion back toward the radiation portion; and
a director having a block shape and coupled to the second block so that the second block is between the director and the radiation portion,
wherein an overall width of the ground portion, the first block, and the radiation portion is 2 mm or less,
the first block has a dielectric constant of 3.5 or more to 25 or less, and
each of the radiation portion, the ground portion, and the director comprises:
a first conductor bonded to either one or both of the first block and the second block; and
a second conductor disposed on a surface of the first conductor.

4. The chip antenna of claim 1 , wherein the first block has a first surface to which the radiation portion is bonded and a second surface to which the ground portion is bonded,
the second block has a first surface to which the radiation portion is bonded and a second surface to which the director is bonded, and
a distance between the first surface and the second surface of the first block is greater than a distance between the first surface and the second surface of the second block.

5. The chip antenna of claim 1 , wherein a distance between a first surface of the ground portion bonded to the first block and a second surface of the ground portion opposing the first surface of the ground portion is greater than a distance between a first surface of the radiation portion bonded to the first block and a second surface of the radiation portion opposing the first surface of the radiation portion.

6. The chip antenna of claim 1 , wherein a size of the director is the same as a size of the radiation portion.

7. The chip antenna of claim 1 , wherein a length of the director is smaller than a length of the radiation portion.

8. The chip antenna of claim 7 , wherein a length of the second block is the same as a length of the director.

9. The chip antenna of claim 1 , wherein the radiation portion comprises a first radiation portion and a second radiation portion spaced apart from each other, and
the director comprises a first director and a second director spaced apart from each other.

10. The chip antenna of claim 9 , wherein the ground portion comprises a first ground portion and a second ground portion spaced apart from each other,
the first ground portion is disposed on a straight line with the first radiation portion and the first director, and
the second ground portion is disposed on a straight line with the second radiation portion and the second director.

11. The chip antenna of claim 1 , wherein the surface of the chip antenna is further configured to be mounted on the surface of the board so that the director is mounted on the surface of the board.

12. The chip antenna of claim 1 , wherein the radiation portion has a third surface perpendicular to the first surface of the radiation portion and the second surface of the radiation portion,
the ground portion has a first surface and a second surface opposing each other, and a third surface perpendicular to the first surface of the ground portion and the second surface of the ground portion, the second surface of the ground portion being coupled to the first block, and
the surface of the chip antenna comprises the third surface of the radiation portion and the third surface of the ground portion, and is further configured to be mounted on the surface of the board so that the third surface of the radiation portion and the third surface of the ground portion are mounted on the surface of the board.

13. The chip antenna of claim 12 , wherein the director has a first surface and a second surface opposing each other, and a third surface perpendicular to the first surface of the director and the second surface of the director, the first surface of the director being coupled to the second block, and
the surface of the chip antenna further comprises the third surface of the director, and is further configured to be mounted on the surface of the board so that the third surface of the director is mounted on the surface of the board.

14. A chip antenna for radio communications in a millimeter wave communications band, the chip antenna being configured to be mounted on a board, receive a feed signal from a signal processing element, and externally radiate the feed signal, the chip antenna comprising:
a radiation portion having a block shape, a first surface and a second surface opposing each other, and a third surface perpendicular to the first surface of the radiation portion and the second surface of the radiation portion, the radiation portion being configured to receive and radiate the feed signal as an electromagnetic wave;
a first block made of a dielectric material and having a first surface and a second surface opposing each other, the second surface of the first block being coupled to the first surface of the radiation portion;
a second block made of a dielectric material and having a first surface and a second surface opposing each other, the first surface of the second block being coupled to the second surface of the radiation portion;
a ground portion having a block shape, a first surface and a second surface opposing e

Assignees

• Samsung Electro Mech

Inventors

• Kim Jae Yeong
• An Sung Yong
• Lee Sang Jong
• Choi Seong Hee
• Han Kyu Bum
• Ryoo Jeong Ki
• Moon Byeong Cheol
• Choi Chang Hak

Classifications

• H01Q1/48

  Earthing means; Earth screens; Counterpoises · CPC title

• H01Q1/243

  with built-in antennas · CPC title

• H01Q1/2283 Primary

  mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title

• H01Q11/02

  Non-resonant antennas, e.g. travelling-wave antenna (Yagi antennas H01Q19/30) · CPC title

• H01Q9/26

  with folded element or elements, the folded parts being spaced apart a small fraction of operating wavelength (resonant loop antennas H01Q7/00) · CPC title