LED device

Patent metadata

Field	Value
Publication number	US-11018282-B2
Application number	US-201916266414-A
Country	US
Kind code	B2
Filing date	Feb 4, 2019
Priority date	Jan 16, 2018
Publication date	May 25, 2021
Grant date	May 25, 2021

Abstract

A LED device includes LED chips mounted on a substrate, a first fluorescent layer, a second fluorescent layer and a package housing. The LED chips emit a blue light. The first fluorescent layer has a first side facing to the LED chips for converting the blue light to a red light. The second fluorescent layer has a first side attached to a second side of the first fluorescent layer for converting the blue light to a red light emitted from a second side of the second fluorescent layer. The package housing holds the substrate and the first fluorescent layer.

First claim

The invention claimed is:

1. A LED device, comprising:
a LED module comprising a plurality of LED components mounted on a substrate for emitting an original light of an original spectrum, the substrate is bent with a curved shape;
a first fluorescent layer surrounding the plurality of LED components for converting the original light to a first output light of a first spectrum;
a second fluorescent layer stacked on the first fluorescent layer for converting the original light not absorbed by the first fluorescent layer and entering the second fluorescent layer to a second output light of a second spectrum,
wherein the second spectrum is partially overlapped with an excitation spectrum of the first fluorescent layer, wherein the substrate is an elongated strip;
a third fluorescent layer attaching to a backside of the elongated strip for converting the original light passing through the elongated strip to a third output light of the first spectrum; and
a fourth fluorescent layer stacked on the third fluorescent layer for converting the original light not absorbed by the third fluorescent layer and entering the fourth fluorescent layer to a fourth output light of the second spectrum.

2. The LED device of claim 1 , further comprising a package housing for holding the substrate and the first fluorescent layer, wherein the substrate has a plurality of electrode pads, the plurality of LED components are attached to the plurality of electrode pads and electrically connected with wires, the electrode pads are connected to an external power source to drive the LED components to emit the original light.

3. The LED device of claim 1 , wherein the LED components are LED semiconductor chips mounted on the substrate using chip-on-board packaging.

4. The LED device of claim 1 , wherein the LED component is made with CSP (Chip Scale Package).

5. The LED device of claim 4 , further comprising a package housing with reflecting walls for reflecting the original light, the first output light, the second output light to predetermined directions.

6. The LED device of claim 5 , wherein the reflecting walls prevent the second output light to enter the first fluorescent layer.

7. The LED device of claim 1 , wherein the substrate is a flexible circuit board substrate.

8. The LED device of claim 1 , further comprising a side wall fixed to the substrate, wherein the side wall comprises a convex structure engaging the second fluorescent layer.

9. The LED device of claim 1 , further comprising a side wall fixed to the substrate, wherein the side wall comprises a concave structure engaging the second fluorescent layer.

10. The LED device of claim 1 , wherein the first fluorescent layer has a first convex surface on top of the first fluorescent layer, the second fluorescent layer has a second convex surface on top of the second fluorescent layer.

11. The LED device of claim 1 , wherein the first fluorescent layer has a first concave surface on top of the first fluorescent layer, the second fluorescent layer has a second concave surface on top of the second fluorescent layer.

12. The LED device of claim 11 , wherein the first convex surface and the second convex surface forming lens guiding the first output light and the second output light for mixing the first output light and the second output light.

13. The LED device of claim 1 , wherein a boundary surface between the first fluorescent layer and the second fluorescent layer is a convex surface facing to the LED module.

14. The LED device of claim 1 , wherein a boundary surface between the first fluorescent layer and the second fluorescent layer is a concave surface facing to the LED module.

15. The LED device of claim 1 , wherein the first output light, the second light and the original light not absorbed by the first fluorescent layer and the second fluorescent layer form an overall output spectrum of a white light.

16. The LED device of claim 15 , wherein the first fluorescent layer and the second fluorescent layer both comprise red phosphor material for generating 640-650 nm output light.

17. The LED device of claim 15 , wherein the first fluorescent layer and the second fluorescent layer both comprise red phosphor material for generating 628-635 nm output light.

18. The LED device of claim 1 , wherein there is an intermediate part between the first fluorescent layer and the second fluorescent layer, the intermediate part comprises mixed materials of the first fluorescent layer and the second fluorescent layer, and the intermediate part has a plurality of micro convex structures between the first fluorescent layer and the second fluorescent layer.

Assignees

• Leedarson Lighting Co Ltd

Inventors

• Chen Yanbiao
• Cao Liangliang
• Chen Huiwu
• Wang Qiyuan

Classifications

• H10W90/00

  Package configurations · CPC title

• H10H20/8514

  characterised by their shape, e.g. plate or foil · CPC title

• H10H20/8506

  Containers · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H10H20/856

  Reflecting means · CPC title