Amide combinations for cleaning and stripping of electronic parts

Patent metadata

Field	Value
Publication number	US-11016392-B2
Application number	US-201716628598-A
Country	US
Kind code	B2
Filing date	Jul 6, 2017
Priority date	Jul 6, 2017
Publication date	May 25, 2021
Grant date	May 25, 2021

Abstract

A solvent consisting essentially of: (A) a first component consisting of N,N-diethylacetamide (DEAC); (B) a second component consisting of 3-methoxy-N, N-dimethyl propionamide (M3DMPA); and (C) an optional third component consisting of one or more glycol ethers or glycol ether acetates; or a solvent consisting essentially of: (1) a first component consisting of one or more acyclic amides of Formula (I): and (2) an optional second component consisting of one or more of DEAC, M3DMPA, N,N-dimethylpropionamide, one or more glycol ethers or glycol ether acetates, and one or more cyclic amides of Formulae (II-IV).

First claim

What is claimed is:

1. A solvent consisting essentially of:
(A) a first component consisting of N,N-diethylacetamide (DEAC);
(B) a second component consisting of 3-methoxy-N,N-dimethylpropionamide (M3DMPA); and
(C) an optional third component consisting of one or more glycol ethers or glycol ether acetates.

2. The solvent of claim 1 in which the optional third component is absent.

3. The solvent of claim 1 in which the optional third component is present.

4. The solvent of claim 3 in which the optional third component is present in an amount of >0 to ≤20 wt % based on the total weight of the first, second and third components of the solvent.

5. The solvent of claim 4 in which the optional third component is one or more of an alkyl ether or alkyl ether acetate of ethylene glycol or propylene glycol.

6. A solvent consisting essentially of:
(A) a first component consisting of an acyclic amide of Formula I:

wherein
(1) each of R 1 and R 2 are independently hydrogen or C1-C4 alkyl or alkoxy groups; and
(2) R 3 is a C2-C7 alkyl or alkoxy group;

with the provisos that
(a) the acyclic amide of Formula I comprises 6 or more carbon atoms;
(b) R 1 and R 2 are not simultaneously hydrogen;
(c) when R 3 is a C3-C7 alkyl or alkoxy group, then R 1 and R 2 are a C1-C3 alkyl or alkoxy group; and
(d) when R 3 is a C2 alkyl or alkoxy group, then R 1 and R 2 are a C3-C4 alkyl or alkoxy group; and

(B) a second component consisting of at least one of:
(1) DEAC; or
(2) M3DMPA; or
(3) N,N-dimethyl propionamide; or
(4) one or more glycol ethers or glycol ether acetates; or
(5) one or more cyclic amides of Formulae II-IV:

wherein R 2 ′ is a C5-C9 aliphatic group, R 1 ′ is a C1-C4 alkyl or alkoxy group, and the carbon atoms of the cyclic ring can have C1-C2 alkyl or alkoxy substituents; or

wherein R 1 ″ and R 2 ″ are hydrogen, or C1-C2 alkyl or alkoxy groups, R 3 ″ is a C2-C4 alkyl group optionally containing an ether linkage, and R 4 ″ is hydrogen or a C1-C3 alkyl or alkoxy group; or

wherein R 1 ′″ is a C5-C9 aliphatic group, R 2 ′″ is hydrogen or a C1-C3 alkyl or alkoxy group, and the carbon atoms of the cyclic ring can have C1-C2 alkyl or alkoxy substituents.

7. The solvent of claim 6 consisting essentially of one or more acyclic amides of Formula I and one or more cyclic amides of Formulae II-IV.

8. The solvent of claim 6 consisting essentially of one or more acyclic amides of Formula I and one or more glycol ethers or glycol ether acetates.

9. The solvent of claim 6 consisting essentially of one or more acyclic amides of Formula I and one or more of DEAC, M3DMPA and N,N-dimethyl-propionamide.

10. A process for stripping a photoresist from a substrate, the process comprising the step of contacting the photoresist with a solvent of claim 6 .

11. A process for cleaning an electronic part or equipment of a contaminant, the process comprising the step of contacting the contaminant on the electronic part or equipment with a solvent of claim 6 .

12. A process for stripping a photoresist from a substrate, the process comprising the step of contacting the photoresist with a solvent consisting essentially of one or more acyclic amides of claim 6 .

13. A process for cleaning an electronic part or equipment of a contaminant, the process comprising the step of contacting the contaminant on the electronic part or equipment with a solvent consisting essentially of one or more acyclic amides of claim 6 .

Assignees

• Dow Global Technologies Llc

Inventors

• Jiang Qi
• Jiang Xin
• Ren Hua
• Kim Eungkyu
• Mu Jianhai
• Ohba Kaoru
• Harris William J

Classifications

• G03F7/425

  containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen · CPC title

• C11D7/3263

  Amides or imides · CPC title

• G03F7/422 Primary

  using liquids only (G03F7/421 takes precedence) · CPC title