Resin composition for encapsulating semiconductor, semiconductor device, and method for producing resin composition for encapsulating semiconductor

Patent metadata

Field	Value
Publication number	US-11015017-B2
Application number	US-201916964026-A
Country	US
Kind code	B2
Filing date	Jan 30, 2019
Priority date	Feb 6, 2018
Publication date	May 25, 2021
Grant date	May 25, 2021

Abstract

The resin composition for encapsulating semiconductor of the present invention is a resin composition for encapsulating semiconductor including an epoxy resin, a curing agent, an inorganic filler, and carbon black fine particles, in which when the resin composition for encapsulating semiconductor is injection-molded to have a length of 80 mm, a width of 10 mm and a thickness of 4 mm under conditions of a mold temperature of 175° C., an injection pressure of 10 MPa, and a curing time of 120 seconds, and then heated at 175° C. for 4 hours to obtain a cured product, and then a surface of the obtained cured product is observed with a fluorescence microscope, a maximum particle diameter of aggregates of the carbon black fine particles is 50 μm or less.

First claim

The invention claimed is:

1. A method for producing a resin composition for encapsulating semiconductor, the method comprising:
a step of pre-pulverizing a carbon black alone by jet milling;
a step of mixing the pre-pulverized carbon black and an inorganic filler to obtain a mixture, and pulverizing the mixture by jet milling to pulverize the pre-pulverized carbon black so as to obtain a mixture of the inorganic filler and carbon black fine particles,
wherein a particle diameter D 50 at which a cumulative frequency of a volume-based particle size distribution of aggregates of the pre-pulverized carbon black in the mixture is 50% is 6 μm or more and 500 μm or less; and
wherein when the D 50 of the pre-pulverized carbon black is set as A, a particle diameter D 50 at which a cumulative frequency of a volume-based particle size distribution of the inorganic filler in the mixture is 50% is set as B, A/B is 0.1 or more and 200 or less; and

a step of mixing an epoxy resin and a curing agent with the mixture of the inorganic filler and the carbon black fine particles to obtain the resin composition for encapsulating semiconductor.

2. The method for producing a resin composition for encapsulating semiconductor according to claim 1 ,
wherein a content of the inorganic filler in the mixture is 5 parts by mass or more and 2000 parts by mass or less with respect to 100 parts by mass of the carbon black.

3. The method for producing a resin composition for encapsulating semiconductor according to claim 1 ,
wherein the inorganic filler in the mixture is one or more selected from the group consisting of inorganic oxides, inorganic nitrides, inorganic carbides, and inorganic hydroxides.

4. The method for producing a resin composition for encapsulating semiconductor according to claim 1 ,
wherein the inorganic filler in the mixture has a Mohs hardness of 2 or more and 10 or less.

5. The method for producing a resin composition for encapsulating semiconductor according to claim 1 ,
wherein the inorganic filler in the mixture is one or more selected from the group consisting of silica, alumina, and aluminum hydroxide.

6. The method for producing a resin composition for encapsulating semiconductor according to claim 1 ,
wherein a particle diameter D 50 at which a cumulative frequency of a volume-based particle size distribution of aggregates of the carbon black fine particles is 50% is 0.01 μm or more and 25 μm or less.

Assignees

• Sumitomo Bakelite Co

Inventors

• Kotani Takahiro
• Shibata Hiroshi

Classifications

• H10W74/473

  containing a filler · CPC title

• H10W74/111

  the semiconductor body being completely enclosed · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title