Flexible circuit board
US-2018310404-A1 · Oct 25, 2018 · US
Display device, circuit bonding structure, and circuit bonding method
US11013121B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11013121-B2 |
| Application number | US-201816301397-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 22, 2018 |
| Priority date | Jun 5, 2017 |
| Publication date | May 18, 2021 |
| Grant date | May 18, 2021 |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
The present disclosure relates to a circuit bonding structure, a circuit bonding method, and a display device. The circuit bonding structure includes a carrying portion configured to carry a driving circuit and having two sides which are adjacent to each other and form a preset acute angle and a preset circuit board having a bonding region having two sides which are adjacent to each other and form a preset acute angle. The driving circuit is bonded to the bonding region by the carrying portion.
First claim
Opening claim text (preview).
What is claimed is: 1. A circuit bonding method for bonding a driving circuit to a preset circuit board, comprising: determining whether an effective contact area of a carrying portion for carrying the driving circuit and a bonding region of the preset circuit board is smaller than a preset value, wherein each of the carrying portion and the bonding region has two sides which are adjacent to each other and form a preset acute angle; if it is determined that the effective contact area is smaller than the preset value, adjusting a position of the carrying portion in a direction perpendicular to one of the sides which form the preset acute angle to increase the effective contact area to be greater than the preset value; and bonding the driving circuit to the preset circuit board by the carrying portion; and wherein determining whether an effective contact area of a carrying portion for carrying the driving circuit and a bonding region of the preset circuit board is smaller than a preset value, comprising: identifying images of the carrying portion and the bonding region of the preset circuit board by a charge-coupled device; and determining whether the effective contact area of the carrying portion and the bonding region of the preset circuit board is smaller than the preset value according to the images. 2. The circuit bonding method according to claim 1 , wherein the preset acute angle is in a range of 60 degrees to 80 degrees. 3. The circuit bonding method according to claim 2 , wherein the carrying portion is a chip on film, and the preset circuit board is a flexible circuit board. 4. The circuit bonding method according to claim 1 , wherein each of a shape of the carrying portion and a shape of the bonding region is a parallelogram. 5. The circuit bonding method according to claim 4 , wherein the carrying portion is a chip on film, and the preset circuit board is a flexible circuit board. 6. The circuit bonding method according to claim 1 , wherein the carrying portion is a chip on film, and the preset circuit board is a flexible circuit board.
Assignees
Inventors
Classifications
by means of a mounting structure (H05K3/325 takes precedence) · CPC title
- H05K1/181Primary
associated with surface mounted components · CPC title
Display · CPC title
Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component · CPC title
- H05K1/189Primary
characterised by the use of flexible or folded printed circuits · CPC title
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Frequently asked questions
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- What does patent US11013121B2 cover?
- The present disclosure relates to a circuit bonding structure, a circuit bonding method, and a display device. The circuit bonding structure includes a carrying portion configured to carry a driving circuit and having two sides which are adjacent to each other and form a preset acute angle and a preset circuit board having a bonding region having two sides which are adjacent to each other and f…
- Who is the assignee on this patent?
- Boe Technology Group Co Ltd, Boe Hebei Mobile Display Technology Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H05K1/181. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue May 18 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).