Electronic device with built in fuse

Patent metadata

Field	Value
Publication number	US-11013117-B2
Application number	US-201615367501-A
Country	US
Kind code	B2
Filing date	Dec 2, 2016
Priority date	Jun 26, 2014
Publication date	May 18, 2021
Grant date	May 18, 2021

Abstract

An electronic device that includes an intermediate connection layer interposed between a wiring substrate with a pair of land electrodes and an electronic component. The intermediate connection layer has first and second connection electrodes formed on the surface of a base. A fuse part is formed inside the second connection electrode between a main conductor part thereof opposed to a first external electrode of the electronic component and a main conductor part of the first connection electrode opposed to a second external electrode of the electronic component.

First claim

The invention claimed is:

1. An electronic device comprising:
a substrate having first and second land electrodes;
an electronic component having first and second opposed lateral end surfaces on which first and second external electrodes, respectively, are formed;
an intermediate connection layer interposed between the substrate and the electronic component, the intermediate connection layer having opposed first and second principal surfaces; and
a first set of connection electrodes including a first connection electrode located on the first principal surface of the intermediate connection layer and a second connection electrode located on the second principal surface of the intermediate connection layer, the first set of connection electrodes electrically connecting the first land electrode and the electronic component;
a second set of connection electrodes including a third connection electrode located on the first principal surface of the intermediate connection layer and a fourth connection electrode located on the second principal surface of the intermediate connection layer, the second set of connection electrodes electrically connecting the second land electrode and the electronic component;
a first set of protective layers on the first principal surface of the intermediate connection layer and positioned to prevent the first and third connection electrodes from coming into electrical contact with one another;
a second set of protective layers on the second principal surface of the intermediate connection layer and positioned to prevent the second and fourth connection electrodes from coming into electrical contact with one another; and
one of the connection electrodes having a fuse part which is located:
(a) under the electronic component so as to be sandwiched between the electronic component and the substrate; and
(b) between the opposed lateral end surfaces of the electronic component.

2. The electronic device according to claim 1 , wherein the fuse part is in a narrowed shape relative to other portions of the one of the connection electrodes, and extends along a long-side direction of the intermediate connection layer.

3. The electronic device according to claim 1 , wherein the fuse part is in a narrowed shape relative to other portions of the one of the connection electrodes, and extends along a short-side direction of the intermediate connection layer.

4. The electronic device according to claim 1 , wherein the fuse part is a metal wire.

5. The electronic device according to claim 1 , wherein the fuse part is located between the first principal surface of the intermediate connection layer and opposed to the electronic component.

6. The electronic device according to claim 1 , wherein the fuse part is on the second principal surface of the intermediate connection layer opposed to the substrate.

7. The electronic device according to claim 1 , further comprising a conducting via in the intermediate connection layer, the conducting via electrically connecting the first and second connection electrodes on the opposed first and second principal surfaces of the intermediate connection layer.

8. The electronic device according to claim 7 , wherein the at least one of the connection electrodes having an L-shaped portion, the fuse part being located in the L-shaped portion.

9. The electronic device according to claim 8 , wherein the fuse part is located in the L-shaped portion proximal to the conducting via.

10. The electronic device according to claim 1 , further comprising an extended part on a side surface of the intermediate connection layer, the extended part electrically connecting the first and second connection electrodes on the opposed first and second principal surfaces of the intermediate connection layer.

11. The electronic device according to claim 1 , further comprising a metal film on an end surface of the intermediate connection layer.

12. The electronic device according to claim 1 , further comprising a metal film on a side surface of the intermediate connection layer.

13. The electronic device according to claim 1 , wherein the at least one of the connection electrodes having an L-shaped portion, the fuse part being located in the L-shaped portion.

14. The electronic device according to claim 1 , wherein the first and third connection electrodes overlap one another and the fuse part is located in the area where the first and second connection electrodes overlap one another.

15. The electronic device according to claim 1 , wherein the first set of protective layers comprises first and second protective layers, the first protective layer being located on the first connection electrode, the second protective layer being located on the third connection electrode.

16. The electronic device according to claim 1 , wherein the second set of protective layers comprises a single protective layer located on the second and fourth connection electrodes.

17. The electronic device according to claim 1 , wherein:
the first connection electrode is soldered to the first external electrode, the second electrode is soldered to the first land electrode, the third connection electrode is soldered to the second external electrode and the fourth connection electrode is soldered to the second land electrode;
the first set of protective layers prevents solder on the first connection electrode from reaching the third connection electrode and solder on the third connection electrode from reaching the first connection electrode; and
the second set of protective layers prevents solder on the second connection electrode from reaching the fourth connection electrode and solder on the fourth connection electrode from reaching the second connection electrode.

Assignees

• Murata Manufacturing Co

Inventors

• Sakamoto Hiroki

Classifications

• H05K1/181 Primary

  associated with surface mounted components · CPC title

• H01H85/046

  Fuses formed as printed circuits · CPC title

• H01G2/16

  with fusing elements · CPC title

• H01G2/065

  for surface mounting, e.g. chip capacitors · CPC title

• H01G2/06 Primary

  specially adapted for mounting on a printed-circuit support · CPC title