MEMS microphone system

Patent metadata

Field	Value
Publication number	US-11012789-B2
Application number	US-201816021511-A
Country	US
Kind code	B2
Filing date	Jun 28, 2018
Priority date	Sep 22, 2017
Publication date	May 18, 2021
Grant date	May 18, 2021

Abstract

A MEMS microphone includes a substrate, a lower membrane supported on the substrate, an upper membrane suspended above the lower membrane, a first electrode supported on the lower membrane, and a second electrode supported on the upper membrane. The lower membrane and the upper membrane enclose a cavity in which the first electrode and the second electrode are located. The lower membrane and the upper membrane are each formed of silicon carbonitride (SiCN). The first electrode and the second electrode are each formed of polysilicon.

First claim

What is claimed is:

1. A MEMS microphone comprising:
a substrate;
a flexible lower membrane supported on the substrate;
a flexible upper membrane suspended above the lower membrane;
a first electrode supported on the lower membrane;
a second electrode supported on the upper membrane; and
a counter electrode assembly within the cavity, the counter electrode assembly including:
an intermediate membrane extending between the lower membrane and the upper membrane,
a third electrode on a first side of the intermediate membrane facing the first electrode, and
a fourth electrode on a second side of the intermediate membrane facing the second electrode,

wherein the first electrode and the third electrode form a first capacitive sensor and the second electrode and the fourth electrode form a second capacitive sensor,
wherein the lower membrane and the upper membrane enclose a cavity in which the first electrode and the second electrode are located, the lower membrane and the upper membrane each being closed and nonporous to prevent dust particles and moisture from entering the cavity,
wherein the lower membrane and the upper membrane are each formed of silicon carbonitride (SiCN), and
wherein the first electrode and the second electrode are each formed of polysilicon.

2. The MEMS microphone of claim 1 , wherein the lower membrane, the upper membrane, the first electrode and the second electrode are each formed of at least one thin film, each thin film of the lower membrane, the upper membrane, the first electrode and the second electrode having a thickness of approximately 250 nm to approximately 500 nm.

3. The MEMS microphone of claim 1 , wherein the intermediate membrane is formed of SiCN and
wherein the third electrode and the fourth electrode are each formed of polysilicon.

4. The MEMS microphone of claim 1 , wherein at least one of the upper membrane and the lower membrane includes etch access holes via which an etchant was introduced into the cavity during a fabrication process, and
further comprising:
a nitride layer deposited onto the at least one of the upper membrane and the lower membrane having the etch access holes to seal the etch access holes,

wherein the nitride layer is deposited at a low pressure, the low pressure being approximately 1.3 mbar or less.

5. The MEMS microphone of claim 1 , further comprising:
a leak hole channel that extends through the upper membrane and the lower membrane.

6. The MEMS microphone of claim 1 , further comprising:
a plurality of pillars that extend from the upper membrane to the lower membrane, each of the pillars having walls formed of SiCN surrounding an oxide core.

Assignees

• Bosch Gmbh Robert
• Akustica Inc

Inventors

• Hermes Christoph
• Gehl Bernhard
• Hoechst Arnim
• Meisel Daniel
• Doller Andrew
• Zhang Yujie
• Hatipoglu Gokhan

Classifications

• H04R31/003

  for diaphragms or their outer suspension · CPC title

• H04R2307/025

  Diaphragms comprising polymeric materials · CPC title

• H04R7/10

  comprising superposed layers in contact · CPC title

• H04R2201/003

  Mems transducers or their use · CPC title

• H04R19/04 Primary

  Microphones (H04R19/01 takes precedence) · CPC title