Ceramic electronic component and method for producing ceramic electronic component

Patent metadata

Field	Value
Publication number	US-11011306-B2
Application number	US-201816161313-A
Country	US
Kind code	B2
Filing date	Oct 16, 2018
Priority date	Apr 28, 2016
Publication date	May 18, 2021
Grant date	May 18, 2021

Abstract

A ceramic electronic component that includes a ceramic insulator and an inner conductor layer disposed in the ceramic insulator. The inner conductor layer contains a metal and a metal oxide containing at least one first metal element selected from Ti, Mg, and Zr, first insulator regions that contain at least one second metal element selected from Ti, Mg, and Zr and that are discontinuous from the ceramic insulator and present in a dispersed state in the inner conductor layer, and a second insulator region containing a third metal element the same as the second metal element contained in the first insulator regions and present around the inner conductor layer.

First claim

The invention claimed is:

1. A ceramic electronic component comprising:
a ceramic insulator; and
an inner conductor layer disposed in the ceramic insulator, wherein the inner conductor layer contains a metal and a metal oxide containing at least one first metal element selected from a group consisting of Ti, Mg, and Zr;
first insulator regions that contain at least one second metal element selected from a group consisting of Ti, Mg, and Zr, the first insulator regions being discontinuous from the ceramic insulator and present in a dispersed state in the inner conductor layer; and
a second insulator region containing a third metal element that is the same as the second metal element contained in the first insulator regions, the second insulator region located around the inner conductor layer, and wherein the second insulator region fully separates the inner conductor layer from the ceramic insulator.

2. The ceramic electronic component according to claim 1 , wherein the ceramic insulator contains a fourth metal element that is the same as the second metal element contained in the first insulator regions and the third metal element contained in the second insulator region.

3. The ceramic electronic component according to claim 2 , wherein a first concentration of the fourth metal element contained in the ceramic insulator is lower than a second concentration of the second metal element in the first insulator regions and a concentration of the third metal element in the second insulator region.

4. The ceramic electronic component according to claim 1 , wherein the inner conductor layer is exposed at a surface of the ceramic insulator.

5. The ceramic electronic component according to claim 1 , further comprising an outer conductor disposed on a surface of the ceramic insulator, wherein the inner conductor layer is electrically connected to the outer conductor.

6. The ceramic electronic component according to claim 1 , a portion of a lower surface of the inner conductor layer that is in contact with an upper surface of the inner conductor layer contains a void having a length of 100 μm or less.

7. The ceramic electronic component according to claim 1 , wherein the ceramic insulator contains a low temperature co-fired ceramic material.

8. The ceramic electronic component according to claim 1 , wherein the metal contained in the inner conductor layer is selected from Au, Ag, Cu, Pt, Ta, W, Ni, Fe, Cr, Mo, Ti, Pd, and Ru and alloys thereof.

9. The ceramic electronic component according to claim 1 , wherein the second insulator region is present around the inner conductor layer.

10. A method for producing a ceramic electronic component, the method comprising:
preparing a plurality of green sheets containing a ceramic material powder;
forming a conductive paste film by applying a conductive paste to a main surface of at least one of the plurality of green sheets, the conductive paste containing a metal powder, a metal oxide powder or a metal oxide precursor powder, and an organic vehicle, the metal oxide powder or the metal oxide precursor powder containing at least one first metal element selected from a group consisting of Ti, Mg, and Zr;
producing a raw multilayer body in which the conductive paste film is located between adjacent green sheets of the plurality of green sheets when the plurality of green sheets are laminated; and
firing the raw multilayer body to produce a ceramic electronic component having;
a ceramic insulator; and
an inner conductor layer disposed in the ceramic insulator, wherein the inner conductor layer contains a metal and a metal oxide containing the at least one first metal element selected from the group consisting of Ti, Mg, and Zr;
first insulator regions that contain at least one second metal element selected from a group consisting of Ti, Mg, and Zr, the first insulator regions being discontinuous from the ceramic insulator and present in a dispersed state in the inner conductor layer; and
a second insulator region containing a third metal element that is the same as the second metal element contained in the first insulator regions, the second insulator region located around the inner conductor layer, and wherein the second insulator region fully separates the inner conductor layer from the ceramic insulator.

11. The method for producing a ceramic electronic component according to claim 10 , wherein the metal oxide powder or the metal oxide precursor powder has a specific surface area of 6 m 2 /g to 90 m 2 /g.

12. The method for producing a ceramic electronic component according to claim 10 , wherein 2.28≤D M50 /D Osf ≤105.5, where D Osf represents a particle diameter calculated from a specific surface area of the metal oxide powder or the metal oxide precursor powder and D M50 represents a volume-based median diameter of the metal powder.

13. The method for producing a ceramic electronic component according to claim 12 , wherein 18.8≤D M50 /D Osf 105.5.

14. The method for producing a ceramic electronic component according to claim 10 , wherein an initial sintering temperature of the metal powder is equal to or lower than an initial sintering temperature of the plurality of green sheets.

15. The method for producing a ceramic electronic component according to claim 10 , wherein the ceramic material powder contains SiO 2 , Al 2 O 3 , and a Ba compound.

16. The method for producing a ceramic electronic component according to claim 10 , wherein an amount of the metal oxide powder or the metal oxide precursor powder in the conductive paste is 1.5 weight% to 4.0 weight%.

17. The method for producing a ceramic electronic component according to claim 10 , further comprising forming an outer conductor on a surface of the ceramic electronic component, and electrically connecting the outer conductor to the inner conductor layer.

18. The method for producing a ceramic electronic component according to claim 10 , wherein the metal powder contained in the conductive paste is selected from Au powder, Ag powder, Cu powder, Pt powder, Ta powder, W powder, Ni powder, Fe powder, Cr powder, Mo powder, Ti powder, Pd powder, and Ru powder and alloy powders thereof.

19. The method for producing a ceramic electronic component according to claim 10 , wherein the ceramic material powder is a low temperature co-fired ceramic material.

20. The method for producing a ceramic electronic component according to claim 10 , wherein the second insulator region is present around the inner conductor layer.

Assignees

• Murata Manufacturing Co

Inventors

• Tanaka Hiromichi
• Takemori Yuki

Classifications

• H01G4/1245

  containing also titanates · CPC title

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H01G4/012 Primary

  Form of non-self-supporting electrodes · CPC title

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/1236

  based on zirconium oxides or zirconates (H01G4/1263 takes precedence) · CPC title