Laser processing

US11008250B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11008250-B2
Application numberUS-201514738839-A
CountryUS
Kind codeB2
Filing dateJun 13, 2015
Priority dateJun 25, 2014
Publication dateMay 18, 2021
Grant dateMay 18, 2021

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A laser processing method comprises generating a laser beam comprising laser pulses having a duration less than 1000 ps, focussing the laser beam to form a focal region inside a transparent material and varying the position of at least one of the focal region and the transparent material so as to provide a pulse-to-pulse overlap of between 45% and 99%, thereby to form a smooth material modification inside the transparent material.

First claim

Opening claim text (preview).

The invention claimed is: 1. A laser processing method, comprising: forming a watermark in a glass material, wherein the watermark comprises a patterned volumetric grating which varies in visibility to the naked eye with changes in a viewing direction and/or an illumination direction, forming the watermark comprising forming a smooth refractive index modification inside the glass material, wherein forming the smooth refractive index modification comprises: generating a laser beam comprising laser pulses having a duration within the range of 2 ps to 1000 ps; focussing the laser beam to form a focal region inside the glass material; and varying the position of at least one of the focal region and the glass material so as to provide a pulse-to-pulse overlap of between 45% and 99%. 2. A laser processing method as claimed in claim 1 , wherein the fluence in the focal region is less than the bulk damage threshold of the glass material. 3. A laser processing method as claimed in claim 1 , wherein the laser pulses have a duration within the range of 2 ps to 30 ps. 4. A laser processing method as claimed in claim 1 , wherein the focal region has a 1/e 2 spot size diameter within the range of 2 μm to 100 μm. 5. A laser processing method as claimed in claim 4 , wherein the focal region has a 1/e 2 spot size diameter within the range of 5 μm to 10 μm. 6. A laser processing method as claimed in claim 1 , wherein the laser pulses have a wavelength within the near-infrared, near UV, or visible region of the electromagnetic spectrum. 7. A laser processing method as claimed in claim 1 , wherein forming the watermark comprises said varying the position of at least one of the focal region and the glass material to provide a pulse overlap of between 45% and 99%, thereby to form a plurality of regions defined by smooth, laser-induced modification of refractive index, wherein said plurality of regions are arranged to cause light propagating in the illumination direction to be redirected such that the mark is visible when viewed in the viewing direction. 8. A laser processing method as claimed in claim 7 , wherein said plurality of regions define a plurality of layers. 9. A laser processing method as claimed in claim 1 , wherein the smooth refractive index modification comprises a diffractive area. 10. A laser processing method as claimed in claim 1 , wherein the position of at least one of the focal region and glass material is varied so as to provide a pulse-pulse overlap of between 50% and 90%.

Assignees

Inventors

Classifications

  • by a laser beam · CPC title

  • for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks · CPC title

  • B41M5/267Primary

    Marking of plastic artifacts, e.g. with laser · CPC title

  • Working by transmitting the laser beam through or within the workpiece · CPC title

  • Energy control of the laser beam (B23K26/0622 takes precedence) · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11008250B2 cover?
A laser processing method comprises generating a laser beam comprising laser pulses having a duration less than 1000 ps, focussing the laser beam to form a focal region inside a transparent material and varying the position of at least one of the focal region and the transparent material so as to provide a pulse-to-pulse overlap of between 45% and 99%, thereby to form a smooth material modifica…
Who is the assignee on this patent?
Fianium Ltd, Nkt Photonics As
What technology area does this patent fall under?
Primary CPC classification C03C23/0025. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue May 18 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).