Laser dicing glass wafers using advanced laser sources
US-2024409449-A1 · Dec 12, 2024 · US
US11008250B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11008250-B2 |
| Application number | US-201514738839-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 13, 2015 |
| Priority date | Jun 25, 2014 |
| Publication date | May 18, 2021 |
| Grant date | May 18, 2021 |
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A laser processing method comprises generating a laser beam comprising laser pulses having a duration less than 1000 ps, focussing the laser beam to form a focal region inside a transparent material and varying the position of at least one of the focal region and the transparent material so as to provide a pulse-to-pulse overlap of between 45% and 99%, thereby to form a smooth material modification inside the transparent material.
Opening claim text (preview).
The invention claimed is: 1. A laser processing method, comprising: forming a watermark in a glass material, wherein the watermark comprises a patterned volumetric grating which varies in visibility to the naked eye with changes in a viewing direction and/or an illumination direction, forming the watermark comprising forming a smooth refractive index modification inside the glass material, wherein forming the smooth refractive index modification comprises: generating a laser beam comprising laser pulses having a duration within the range of 2 ps to 1000 ps; focussing the laser beam to form a focal region inside the glass material; and varying the position of at least one of the focal region and the glass material so as to provide a pulse-to-pulse overlap of between 45% and 99%. 2. A laser processing method as claimed in claim 1 , wherein the fluence in the focal region is less than the bulk damage threshold of the glass material. 3. A laser processing method as claimed in claim 1 , wherein the laser pulses have a duration within the range of 2 ps to 30 ps. 4. A laser processing method as claimed in claim 1 , wherein the focal region has a 1/e 2 spot size diameter within the range of 2 μm to 100 μm. 5. A laser processing method as claimed in claim 4 , wherein the focal region has a 1/e 2 spot size diameter within the range of 5 μm to 10 μm. 6. A laser processing method as claimed in claim 1 , wherein the laser pulses have a wavelength within the near-infrared, near UV, or visible region of the electromagnetic spectrum. 7. A laser processing method as claimed in claim 1 , wherein forming the watermark comprises said varying the position of at least one of the focal region and the glass material to provide a pulse overlap of between 45% and 99%, thereby to form a plurality of regions defined by smooth, laser-induced modification of refractive index, wherein said plurality of regions are arranged to cause light propagating in the illumination direction to be redirected such that the mark is visible when viewed in the viewing direction. 8. A laser processing method as claimed in claim 7 , wherein said plurality of regions define a plurality of layers. 9. A laser processing method as claimed in claim 1 , wherein the smooth refractive index modification comprises a diffractive area. 10. A laser processing method as claimed in claim 1 , wherein the position of at least one of the focal region and glass material is varied so as to provide a pulse-pulse overlap of between 50% and 90%.
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