Laying die, laying device and method for manufacturing a laying die

US11007729B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11007729-B2
Application numberUS-201916583919-A
CountryUS
Kind codeB2
Filing dateSep 26, 2019
Priority dateApr 24, 2013
Publication dateMay 18, 2021
Grant dateMay 18, 2021

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A laying die, for picking up and laying of substrates, comprising an elastically deformable substrate receiving structure providing an engagement surface for releasable receiving of substrates, an attaching element comprising a gas channel for providing positively or negatively pressurized gas for picking up and blowing off the substrates, and a carrier body made from elastically deformable material and sandwiched between the substrate receiving structure and the attaching element which is arranged to distribute the positively or negatively pressurized gas over the carrier body. The carrier body comprises breakthroughs to transfer the pressurized gas from the attaching element to the substrate receiving structure that comprises an elastically deformable distribution plate to distribute the positively or negatively pressurized gas over the engagement surface. Also, a laying device which changes the position and/or orientation of substrates to predetermined values can comprise the laying die and a method for manufacturing the laying die.

First claim

Opening claim text (preview).

What is claimed: 1. A method for manufacturing a laying die, comprising: providing an elastically deformable substrate receiving structure with an elastically deformable distribution plate; providing a carrier body made from an elastically deformable material; providing an attaching element comprising a gas channel; distributing a plurality of breakthroughs into the carrier body; sandwiching the carrier body between the substrate receiving structure and the attaching element; and providing a cambering device including a rope attached to the substrate receiving structure, wherein the cambering device configured to pull at least one of the carrier body and the substrate receiving structure into a predetermined deformation. 2. The method according to claim 1 , wherein the providing the elastically deformable structure comprises: providing two elastically deformable films; arranging a heating element between the two elastically deformable films to provide a stack; and distributing a plurality of holes into the stack.

Assignees

Inventors

Classifications

  • B29C70/38Primary

    Automated lay-up, e.g. using robots, laying filaments according to predetermined patterns {(application heads for tyres B29D30/28)} · CPC title

  • B29C70/388Primary

    Tape placement heads, e.g. component parts, details or accessories · CPC title

  • of preforms {to be moulded, e.g. tablets, fibre reinforced preforms, extruded ribbons, tubes or profiles; Manipulating means specially adapted for feeding preforms, e.g. supports conveyors (B29C31/066, B29C37/001, B29C43/085 take precedence)} · CPC title

  • comprising fillers or reinforcement {(non-woven fabrics per se D04H1/00, D04H3/00)} · CPC title

  • Half-products, e.g. films, plates · CPC title

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Frequently asked questions

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What does patent US11007729B2 cover?
A laying die, for picking up and laying of substrates, comprising an elastically deformable substrate receiving structure providing an engagement surface for releasable receiving of substrates, an attaching element comprising a gas channel for providing positively or negatively pressurized gas for picking up and blowing off the substrates, and a carrier body made from elastically deformable mat…
Who is the assignee on this patent?
Airbus Defence & Space Gmbh
What technology area does this patent fall under?
Primary CPC classification B29C70/38. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 18 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).