Skin-to-core bond line mapping system and method

Patent metadata

Field	Value
Publication number	US-11007724-B2
Application number	US-201816058660-A
Country	US
Kind code	B2
Filing date	Aug 8, 2018
Priority date	Aug 8, 2018
Publication date	May 18, 2021
Grant date	May 18, 2021

Abstract

A skin-to-core bond line mapping system and method is disclosed. Layered composite components formed by “sandwiching” multiple materials together require a continuous bond between those materials with voids below particular thresholds that can vary by application. The skin-to-core bond line mapping system can include a laminate, an adhesive, a separator film, a core, a breather, a layup tool, bagging material, sealant, and a vacuum port. By employing systems and processes that layer separator film over adhesive and applying a core proximate the adhesive, a bagging material can be disposed over the materials to facilitate vacuum compaction, thereby impressing core impressions on the adhesive to map the areas between the skin and core that have good contact. An iterative process is disclosed, in which additional adhesive can be used to build the bond line until contact is made (or engineering tolerance is reached).

First claim

What is claimed is:

1. A method for bond line mapping, comprising: applying an adhesive to at least a portion of a part; disposing a separator film proximate the adhesive; positioning a layup tool proximate the film to guide placement of a core proximate the adhesive; disposing the core onto the film; disposing an airproof material to the part, covering the adhesive, the film, and the core; creating a vacuum compaction between the airproof material and the part to impart markings on the adhesive by the core; curing the adhesive with markings; removing the airproof material and detecting any void using the markings on the adhesive prior to the curing; and determining whether the void is within a tolerance.

2. The method of claim 1 , further comprising adding additional adhesive in the void if the void is not within the tolerance.

3. The method of claim 1 , further comprising repeating the aforementioned steps until the void is within the tolerance.

4. The method of claim 1 , wherein the tolerance is based upon the size of the void.

5. The method of claim 1 , wherein the tolerance is based upon the number of voids.

6. A method for bond line mapping, comprising: applying an adhesive to at least a portion of a part; disposing a separator film proximate the adhesive; disposing a core onto the film; disposing the part, the adhesive, the film, and the core into an airproof bag; creating a vacuum within the bag to cause a compaction and impart markings on the adhesive by the core curing the adhesive with the markings; and detecting any void using the markings in the adhesive prior to the curing.

7. The method of claim 6 , further comprising determining whether the void is within a tolerance.

8. The method of claim 6 , further comprising adding additional adhesive in the void to eliminate the void.

9. The method of claim 6 , further comprising repeating the aforementioned steps until the void is within the tolerance.

10. The method of claim 6 , wherein the tolerance is based upon the size of the void.

11. The method of claim 7 , wherein the tolerance is based upon the number of voids.

12. The method of claim 6 , further comprising positioning a layup tool proximate the film to guide the placement of the core proximate the adhesive.

Assignees

• Textron Innovations Inc

Inventors

• Knowles Kelly
• Gibson Clyde

Classifications

• B29C70/342

  using isostatic pressure · CPC title

• B32B37/146

  whereby one or more of the layers is a honeycomb structure · CPC title

• B32B9/007

  comprising carbon, e.g. graphite, composite carbon · CPC title

• B32B3/08

  characterised by added members at particular parts {(layer formed of separate pieces of material which are juxtaposed side-by-side B32B3/14, B32B3/18)} · CPC title

• B32B3/12

  characterised by a layer of regularly- arranged cells, e.g. a honeycomb structure · CPC title