Dielectric-heating bonding film and joining method using dielectric-heating bonding film

Patent metadata

Field	Value
Publication number	US-11007722-B2
Application number	US-201716344621-A
Country	US
Kind code	B2
Filing date	Oct 18, 2017
Priority date	Oct 27, 2016
Publication date	May 18, 2021
Grant date	May 18, 2021

Abstract

A dielectric welding film capable of tightly welding adherends of a polyolefin resin or the like within a relatively short time through dielectric heating, and a bonding method using the dielectric welding film are provided. The dielectric welding film is configured to bond a plurality of adherends of the same material or different materials through dielectric heating, the dielectric welding film containing (A) a polyolefin resin and (B) a dielectric filler whose mean particle size measured in accordance with JIS Z 8819-2 (2001) is in a range from 1 to 30 μm, a thickness of the dielectric welding film ranging from 10 to 2,000 μm. The method uses the dielectric welding film.

First claim

The invention claimed is:

1. A dielectric welding film configured to bond a plurality of adherends of the same material or different materials through dielectric heating, the dielectric welding film comprising:
(A) a polyolefin resin; and
(B) a dielectric filler whose mean particle size measured in accordance with JIS Z 8819-2 (2001) is in a range from 2 to 25 μm, wherein
the dielectric filler is zinc oxide, anatase-type titanium oxide or barium titanate,
a thickness of the dielectric welding film is in a range from 100 to 1000 μm and
a dielectric property (tanδ/ε′) defined by dividing a dissipation factor tanδ by a permittivity ε′ at 23 degrees C. and 40 MHz frequency is 0.005 or more.

2. The dielectric welding film according to claim 1 , wherein the (A) component is a polypropylene resin.

3. The dielectric welding film according to claim 2 , wherein a melting point or a softening point of the polypropylene resin as the (A) component defined in accordance with JIS K 7121 (1987) is in a range from 80 to 200 degrees C.

4. The dielectric welding film according to claim 1 , wherein a content of the (B) component is in a range from 5 to 800 parts by weight with respect to 100 parts by weight of the (A) component.

5. The dielectric welding film according to claim 1 , wherein a storage modulus E′ measured at 23 degrees C. and 10 Hz frequency and a storage modulus E′ measured at 80 degrees C. and 10 Hz frequency are both in a range from 1×10 6 to 1×10 10 Pa.

6. The dielectric welding film according to claim 1 , wherein the (B) component is zinc oxide.

7. The dielectric welding film according to claim 1 , wherein a light transmissivity of the dielectric welding film is 5% or more.

8. A bonding method using a dielectric welding film configured to bond a plurality of adherends of the same material or different materials through dielectric heating, the dielectric welding film comprising (A) a polyolefin resin and (B) a dielectric filler whose mean particle size measured in accordance with JIS Z 8819-2 (2001) is in a range from 2 to 25 μm, the dielectric filler being zinc oxide, anatase-type titanium oxide or barium titanate, a thickness of the dielectric welding film ranging from 100 to 1000 μm, the method comprising:
(1) holding the dielectric welding film between the plurality of adherends of the same material or different materials; and
(2) applying the dielectric heating on the dielectric welding film held between the plurality of adherends with a dielectric heater at a frequency ranging from 1 to 100 MHz wherein a dielectric property (tanδ/ε′) defined by dividing a dissipation factor tansδ by a permittivity ε′ at 23 degrees C. and 40 MHz frequency is 0.005 or more.

9. The bonding method using a dielectric welding film according to claim 8 , wherein
the (B) component is zinc oxide.

10. The bonding method using a dielectric welding film according to claim 8 , wherein
a high frequency is applied in (2) applying the dielectric heating at a high-frequency output ranging from 0.1 to 20 kW and a high-frequency-wave application time of 1 second or more and less than 40 seconds.

Assignees

• Lintec Corp

Inventors

• Ishikawa Masakazu
• Izumi Tatsuya

Classifications

• C09J5/06

  involving heating of the applied adhesive · CPC title

• C08K2003/2296

  of zinc · CPC title

• C09J2423/00

  Presence of polyolefin · CPC title

• H01B3/441

  from alkenes · CPC title

• C09J123/26

  modified by chemical after-treatment · CPC title