Three-dimensional (3D) printing with epoxy resin

US11007712B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11007712-B2
Application numberUS-201616073115-A
CountryUS
Kind codeB2
Filing dateApr 20, 2016
Priority dateApr 20, 2016
Publication dateMay 18, 2021
Grant dateMay 18, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In a three-dimensional printing method example, a build material, including an epoxy resin powder, is applied. A hardener liquid is selectively applied on at least a portion of the build material. The portion of the build material in contact with the hardener liquid is allowed to cure to form a layer of a 3D part. In another three-dimensional printing method example, a filler build material is applied. A liquid epoxy resin is selectively applied on at least a portion of the filler. A hardener liquid is selectively applied on the at least the portion of the filler. The portion of the filler in contact with the liquid epoxy resin and the hardener liquid is allowed to cure to form a layer of a 3D part.

First claim

Opening claim text (preview).

What is claimed is: 1. A three-dimensional (3D) printing method, consisting of: applying a build material, the build material including an epoxy resin powder; selectively applying a hardener liquid consisting of a curing agent and a solvent on at least a portion of the build material, wherein the curing agent chemically reacts with the epoxy resin powder; and allowing the portion of the build material in contact with the hardener liquid to cure to form a layer of a 3D part; wherein the hardener liquid further optionally consists of co-solvents, anti-kogation agents, surfactants, diluents, toughening agents, or combinations thereof. 2. The method as defined in claim 1 wherein: the applying of the build material is accomplished by squeegeeing, spraying, extruding, or dispensing; and the selectively applying of the hardener liquid is accomplished by thermal inkjet printing or piezoelectric inkjet printing. 3. The method as defined in claim 1 wherein the allowing of the portion of the build material in contact with the hardener liquid to cure includes exposing the build material, including the portion, to energy. 4. The method as defined in claim 3 wherein the exposing of the build material to energy is accomplished by heating the build material to a temperature ranging from about 20° C. to about 200° C. for a time period ranging from about 30 seconds to about 60 minutes. 5. The method as defined in claim 1 wherein: the hardener liquid includes the curing agent dissolved in the solvent; the curing agent is an amine, an anhydride, an acid, a phenol, an alcohol, a thiol, an anionic ring opening initiator, or a cationic ring opening initiator; and the solvent is a ketone, an ester, an acetate, or a sulfoxide. 6. A three-dimensional (3D) printing method, comprising: applying a build material, the build material including an epoxy resin powder; selectively applying a hardener liquid including a curing agent on at least a portion of the build material; wherein the curing agent chemically reacts with the epoxy resin powder; and allowing the portion of the build material in contact with the hardener liquid to cure to form a layer of a 3D part; wherein the epoxy resin powder is bisphenol-A epoxy resin, bisphenol-F epoxy resin, novolac epoxy resin, aliphatic epoxy resin, or glycidylamine epoxy resin. 7. The method as defined in claim 6 wherein the build material further includes a filler selected from the group consisting of a polymer powder, a ceramic powder, a metal powder, and a carbon black powder. 8. The method as defined in claim 7 wherein a ratio of the epoxy resin powder to the filler ranges from about 90:10 to about 10:90. 9. The method as defined in claim 6 wherein: the hardener liquid includes the curing agent dissolved in a solvent; the curing agent is an amine, an anhydride, an acid, a phenol, an alcohol, a thiol, an anionic ring opening initiator, or a cationic ring opening initiator; and the solvent is a ketone, an ester, an acetate, or a sulfoxide. 10. A three-dimensional (3D) printing method, comprising: applying a filler build material; selectively applying a liquid epoxy resin on at least a portion of the filler build material; selectively applying a hardener liquid including a curing agent on the at least the portion of the filler build material having the liquid epoxy resin applied thereon, wherein the curing agent chemically reacts with the liquid epoxy resin; and allowing the at least the portion of the filler build material to cure to form a layer of a 3D part. 11. The method as defined in claim 10 wherein: the liquid epoxy resin includes an epoxy resin dissolved in a solvent; the epoxy resin is a bisphenol-A epoxy resin, a bisphenol-F epoxy resin, a novolac epoxy resin, an aliphatic epoxy resin, or a glycidylamine epoxy resin; and the solvent is a ketone, an ester, an acetate, or a sulfoxide. 12. The method as defined in claim 11 wherein a ratio of epoxy resin to filler build material ranges from about 90:10 to about 10:90. 13. The method as defined in claim 10 wherein the filler build material is a ceramic powder, a polymer powder, a metal powder, or a carbon black powder. 14. The method as defined in claim 10 wherein the selectively applying of the liquid epoxy resin and the selectively applying of the hardener liquid are accomplished by thermal inkjet printing or piezoelectric inkjet printing. 15. The method as defined in claim 10 wherein the allowing of the portion of the filler build material in contact with the hardener liquid to cure includes exposing the filler build material, including the portion, to energy, and wherein the energy exposure is accomplished by heating the filler build material to a temperature ranging from about 20° C. to about 200° C. for a time period ranging from about 30 seconds to about 60 minutes. 16. The method as defined in claim 10 wherein: the hardener liquid includes the curing agent dissolved in a solvent; the curing agent is an amine, an anhydride, an acid, a phenol, an alcohol, a thiol, an anionic ring opening initiator, or a cationic ring opening initiator; and the solvent is a ketone, an ester, an acetate, or a sulfoxide. 17. The method as defined in claim 10 wherein the filler build material consists of a ceramic powder or a metal powder and further optionally consists of a flow aid. 18. The method as defined in claim 17 wherein the filler build material is the ceramic powder and wherein the ceramic powder is selected from the group consisting of alumina, soda-lime glass, silicon carbide, silicon nitride, silicon dioxide, zirconia, titanium dioxide, iron oxide, hafnia, barium titanate, tungsten carbide, lead zirconate titanate, hydroxyapatite, and combinations thereof. 19. The method as defined in claim 18 wherein the ceramic powder is alumina or silicon dioxide.

Assignees

Inventors

Classifications

  • Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials · CPC title

  • Materials specially adapted for additive manufacturing · CPC title

  • Processes of additive manufacturing · CPC title

  • B29C64/165Primary

    using a combination of solid and fluid materials, e.g. a powder selectively bound by a liquid binder, catalyst, inhibitor or energy absorber · CPC title

  • Use of {EP, i.e.} epoxy resins {or derivatives thereof}, as moulding material · CPC title

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What does patent US11007712B2 cover?
In a three-dimensional printing method example, a build material, including an epoxy resin powder, is applied. A hardener liquid is selectively applied on at least a portion of the build material. The portion of the build material in contact with the hardener liquid is allowed to cure to form a layer of a 3D part. In another three-dimensional printing method example, a filler build material is …
Who is the assignee on this patent?
Hewlett Packard Development Co
What technology area does this patent fall under?
Primary CPC classification B29C64/165. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 18 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).