Audio speakers with integrated sealing and assembly features for “caseless” installation

US11006195B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11006195-B2
Application numberUS-201715605951-A
CountryUS
Kind codeB2
Filing dateMay 26, 2017
Priority dateSep 26, 2015
Publication dateMay 11, 2021
Grant dateMay 11, 2021

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Small-scale audio speakers of various shapes are installed in parent devices. Inner casings, and the surrounding vibration-damping zone often required between such casings and the surrounding parent-device walls, are omitted from the assembly. During integration with the parent device, each un-encased speaker and its signal lines are sealed into a single-walled enclosure that incorporates a parent-device wall as at least one side. The entire interior of the single-walled enclosure becomes a back volume for the speaker. The single-walled enclosure may incorporate seals at the speaker's audio-output aperture, at the pass-through for the signal lines, and at the interface between the parent-device wall(s) and the added side(s) constituting the single-walled enclosure. Optional adhesive-free sealing options include sliding tabs held by a snap-lock latch.

First claim

Opening claim text (preview).

We claim: 1. A device, comprising: a wall; an audio speaker positioned on a first side of the wall, having a front part defined by a maximum audio output and having at least one non-front part uncovered by the wall; a speaker aperture through the wall from the first side to a second side, wherein the front of the audio speaker faces the speaker aperture; and a resilient layer between a frame of the audio speaker and a surface of the first side of the wall, wherein the frame of the audio speaker comprises cutouts or cog teeth that extend radially outward from the frame in a plane parallel to the wall and are arranged to be pushed toward the wall and rotated or translated in a plane parallel to the wall, to engage with corresponding wall tabs that extend radially inward from the wall towards the speaker aperture in a plane parallel to the wall on the first side of the wall. 2. The device of claim 1 , wherein the resilient layer comprises a gasket. 3. The device of claim 1 , wherein the resilient layer comprises an O-ring. 4. The device of claim 1 , wherein the resilient layer is airtight. 5. The device of claim 1 , wherein the resilient layer is between a front-facing surface of the frame and an opposing surface of the first side of the wall. 6. The device of claim 1 , wherein the resilient layer is between an outward-facing surface of the frame and an opposing surface of the first side of the wall. 7. The device of claim 1 , wherein the resilient layer is between an inward-facing surface of the frame and an opposing surface of the first side of the wall. 8. The device of claim 1 , wherein the resilient layer has an aperture coinciding with the speaker aperture. 9. The device of claim 1 , wherein the resilient layer extends across the speaker aperture and comprises a plurality of through-holes inside a perimeter of the speaker aperture. 10. The device of claim 1 , wherein the resilient layer is integrated into the front part of the speaker. 11. The device of claim 1 , wherein a speaker rim and a speaker diaphragm are made of the same material. 12. The device of claim 1 , wherein the resilient layer, the frame, and a speaker diaphragm are formed as a single piece. 13. The device of claim 1 , wherein the cutouts or cog teeth are engageable by a tool to be simultaneously pushed and rotated. 14. The device of claim 1 , wherein the device further comprises a seal around a signal line of the audio speaker in an opening where the signal line exits the wall.

Assignees

Inventors

Classifications

  • H04R31/006Primary

    Interconnection of transducer parts (of diaphragm and outer suspension by moulding H04R31/003) · CPC title

  • corrugated, pleated or ribbed · CPC title

  • for loudspeaker transducers · CPC title

  • Securing diaphragm or cone resiliently to support by flexible material, springs, cords, or strands · CPC title

  • using a plurality of acoustic drivers (H04R1/24 and H04R1/403 take precedence) · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11006195B2 cover?
Small-scale audio speakers of various shapes are installed in parent devices. Inner casings, and the surrounding vibration-damping zone often required between such casings and the surrounding parent-device walls, are omitted from the assembly. During integration with the parent device, each un-encased speaker and its signal lines are sealed into a single-walled enclosure that incorporates a par…
Who is the assignee on this patent?
Intel Corp
What technology area does this patent fall under?
Primary CPC classification H04R31/006. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue May 11 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).