Computing device using bypass assembly

Patent metadata

Field	Value
Publication number	US-11003225-B2
Application number	US-202016830267-A
Country	US
Kind code	B2
Filing date	Mar 26, 2020
Priority date	May 4, 2015
Publication date	May 11, 2021
Grant date	May 11, 2021

Abstract

A computing device includes a first connector near a first wall. The first connector is in communication with a chip package positioned apart for the first wall via a first cable. The chip package includes a chip supported by a support layer. The chip can be supported by a substrate and/or a circuit board. A second connector can be positioned near a second wall and can also be in communication with the chip package via a second cable. If desired, the substrate or circuit board can include a signal board connector that is configured to engage board connectors terminated to ends of the first and second cables.

First claim

We claim:

1. A computing device, comprising:
an enclosure with a first wall;
a signal board positioned in the enclosure away from the first wall;
a chip package mounted on the signal board including a chip electrically connected to a first signal board connector;
a first connector supported near the first wall, the first connector including a cage that defines a front opening and an internal connector with a mating interface, the internal connector supporting a first pair of terminals, each terminal of the first pair of terminals each having a contact in the mating interface, the first connector including an light emitting diode (LED) array positioned adjacent the front opening;
a first cable with a pair of conductors, the cable including a first end and a second end, a first end of the cable terminated to the first pair of terminals;
a first board connector, the first board connector terminated to the second end of the first cable and configured to mate with the first signal board connector; and
component circuitry that provides power to the chip.

2. The computing device of claim 1 , wherein the chip is supported by a signal board and the first signal board connector is mounted on the signal board.

3. The computing device of claim 2 , wherein the enclosure includes a second wall, the computing device including a second connector supported near the second wall, the second connector terminated to a first end of a second cable, the second cable having a second end terminated to a second board connector, wherein the signal circuit board supports a second signal board connector that is electrically connected to the chip, the second board connector configured to mate with the second signal board connector.

4. The computing device of claim 2 , wherein the component circuitry is connected to the signal board via a cable assembly.

5. The computing device of claim 1 , wherein the chip package includes a substrate that supports the chip.

6. The computing device of claim 5 , wherein the substrate is supported by a signal board, the signal board not extending to the first connector.

7. The computing device of claim 6 , wherein the first connector is supported by a tray.

8. The computing device of claim 1 , wherein the chip is electrically connected to a plurality of signal board connectors and each of the plurality of signal board connectors are mated to a different first connector via a corresponding board connector.

9. A connector system, comprising:
an enclosure with a first wall;
a signal board positioned in the enclosure and supporting a plurality of first signal board connectors;
a chip package mounted on a signal board, the chip package including a chip electrically connected to the plurality of first signal board connectors, wherein the first signal board connectors are positioned on at least two sides of the chip package;
a plurality of first connectors positioned by the first wall, each of the first connectors including a cage and a housing supported by the cage, the housing include a card slot with a plurality of terminals positioned on two sides of the card slot, the plurality of terminals each including contacts that extend into the card slot and tail portions;
a plurality of first cables extending from respective ends of the plurality of first connectors, each of the first cables with a first end and a second end, the first ends being terminated to the tail portions;
a plurality of first board connector terminated to the second ends of the plurality of first cables, wherein the plurality of first board connectors are mated with the first signal board connectors.

10. The connector system of claim 9 , wherein the first signal board connectors are mounted on at least three sides of the chip.

11. The connector system of claim 10 , wherein the first signal board connectors are mounted on four sides of the chip.

12. The connector system of claim 9 , wherein the enclosure includes a second wall with at least one second connector positioned at the second wall and the chip is electronically connected to a second signal board connector via the signal board, the second connector electrically connected to a second board connector via a second cable, wherein the second board connector is mated to the second signal board connector.

13. The connector system of claim 9 , wherein the insertion loss between the chip and the first signal board connector is less than 2 dB when operating at 15 GHz.

Assignees

• Molex Llc

Inventors

• Reed Bruce
• Lloyd Brian Keith
• Fitzgerald Gregory

Classifications

• H05K7/1485

  Servers; Data center rooms, e.g. 19-inch computer racks · CPC title

• G06F1/181 Primary

  Enclosures (for portable computers G06F1/1613) · CPC title

• H05K7/1487

  Blade assemblies, e.g. blade cases or inner arrangements within a blade · CPC title

• G06F1/189

  Power distribution · CPC title

• H01R13/6583

  with separate conductive resilient members between mating shield members · CPC title