Projector and wavelength conversion device

Patent metadata

Field	Value
Publication number	US-11002952-B2
Application number	US-201816164670-A
Country	US
Kind code	B2
Filing date	Oct 18, 2018
Priority date	Oct 24, 2017
Publication date	May 11, 2021
Grant date	May 11, 2021

Abstract

A projector and a wavelength conversion device thereof are provided. The projector includes an illumination system that includes a light source device and a wavelength conversion device. The light source device is configured to provide an excitation beam. The wavelength conversion device is disposed on a transmission path of the excitation beam, and configured to convert the excitation beam into an illumination beam. The wavelength conversion device includes a substrate comprising a first surface, a second surface, and an axis center, a heat-conducting connection structure, a first reflective structure, and a wavelength conversion structure. The heat-conducting connection structure is located between the first surface and a first reflective structure, the first reflective structure is located between the heat-conducting connection structure and a wavelength conversion structure, and the wavelength conversion structure is located on the first reflective structure.

First claim

What is claimed is:

1. A projector, comprising:
an illumination system, comprising:
a light source device, configured to provide an excitation beam; and
a wavelength conversion device, located on a transmission path of the excitation beam and configured to convert the excitation beam into an illumination beam, wherein the wavelength conversion device comprises:
a substrate, having a first surface, a second surface, and an axis center, wherein the first surface is opposite to the second surface;
a heat-conducting connection structure, disposed on the first surface of the substrate and around the axis center;
a first reflective structure, disposed on the heat-conducting connection structure and around the axis center, wherein the heat-conducting connection structure is located between the first surface of the substrate and the first reflective structure; and
a wavelength conversion structure, disposed on the first reflective structure and around the axis center, wherein the first reflective structure is located between the wavelength conversion structure and the heat-conducting connection structure;

a light valve, located on a transmission path of the illumination beam and configured to convert the illumination beam into an image beam; and
a lens, located on a transmission path of the image beam, wherein the image beam becomes a projection beam after passing through the lens,
wherein the first reflective structure comprises a reflective layer and a metal layer plated onto the reflective layer, the metal layer of the first reflective structure is located between the reflective layer and the heat-conducting connection structure, wherein a material of the metal layer of the first reflective structure comprises at least one of copper, nickel, tin, gold, and silver, and a material of the heat-conducting connection structure comprises at least one of solder and an eutectic welding material, the substrate comprises a base layer and a connecting metal layer plated on the base layer, the connecting metal layer is located between the base layer and the heat-conducting connection structure, wherein a material of the connecting metal layer of the substrate comprises at least one of copper, nickel, tin, gold, and silver.

2. The projector according to claim 1 , wherein the wavelength conversion structure has an engagement surface facing the first reflective structure, and the engagement surface of the wavelength conversion structure is engaged to the first reflective structure.

3. The projector according to claim 1 , wherein a material of the reflective layer of the first reflective structure further comprises at least one of a dielectric, aluminum and a diffuse reflection material.

4. The projector according to claim 1 , wherein a material of the base layer of the substrate comprises at least one of aluminum and its alloys, aluminum nitride, copper and its alloys, ceramics, glass and sapphire.

5. The projector according to claim 1 , wherein the wavelength conversion structure is a plate, the wavelength conversion structure comprises a plurality of phosphors, and a volume percent concentration of the plurality of phosphors is no less than 50% and no greater than 100%.

6. The projector according to claim 1 , wherein a thickness of the wavelength conversion structure is no less than 0.05 millimeter and no greater than 0.3 millimeter.

7. The projector according to claim 1 , wherein the wavelength conversion device further comprises a driving motor and a connection layer, the driving motor is disposed on the second surface of the substrate, the connection layer is located between the driving motor and the second surface of the substrate, and the driving motor is connected to the second surface of the substrate by using the connection layer.

8. The projector according to claim 1 , wherein the wavelength conversion device further comprises an annular and a connection layer, the annular is disposed on the first surface of the substrate, the annular is located between the substrate and the wavelength conversion structure and around the axis center of the substrate, the connection layer is located between the annular and the first surface of the substrate, and the annular is connected to the first surface of the substrate by using the connection layer.

9. The projector according to claim 1 , wherein the wavelength conversion device further comprises a transparent component, the substrate has an opening, and the transparent component is disposed at the opening to constitute a light penetrating area adjacent to the wavelength conversion structure.

10. A wavelength conversion device, comprising:
a substrate, having a first surface, a second surface and an axis center, wherein the first surface is opposite to the second surface;
a heat-conducting connection structure, disposed on the first surface of the substrate and around the axis center;
a first reflective structure, disposed on the heat-conducting connection structure and around the axis center, wherein the heat-conducting connection structure is located between the first surface of the substrate and the first reflective structure; and
a wavelength conversion structure, disposed on the first reflective structure and around the axis center, wherein the first reflective structure is located between the wavelength conversion structure and the heat-conducting connection structure,
wherein the first reflective structure comprises a reflective layer and a metal layer plated onto the reflective layer, the metal layer of the first reflective structure is located between the reflective layer and the heat-conducting connection structure, wherein a material of the metal layer of the first reflective structure comprises at least one of copper, nickel, tin, gold, and silver, and a material of the heat-conducting connection structure comprises at least one of solder and an eutectic welding material, the substrate comprises a base layer and a connecting metal layer plated on the base layer, the connecting metal layer is located between the base layer and the heat-conducting connection structure, wherein a material of the connecting metal layer of the substrate comprises at least one of copper, nickel, tin, gold, and silver.

11. The wavelength conversion device according to claim 10 , wherein the wavelength conversion structure has an engagement surface facing the first reflective structure, and wherein the engagement surface of the wavelength conversion structure is engaged to the first reflective structure.

12. The wavelength conversion device according to claim 10 , wherein a material of the reflective layer of the first reflective structure further comprises at least one of a dielectric, aluminum and a diffuse reflection material.

13. The wavelength conversion device according to claim 10 , wherein a material of the base layer of the substrate comprises at least one of aluminum and its alloys, aluminum nitride, copper and its alloys, ceramics, glass and sapphire.

14. The wavelength conversion device according to claim 10 , wherein the wavelength conversion structure is a plate, the wavelength conversion structure comprises a plurality of phosphors, and the volume percent concentration of the plurality of phosphors is no less than 50% and no greater than 100%.

15. The wavelength conversion device according to claim 10 , wherein a thickness of the wavelength conversion structure is no less than 0.05 millimeter and no greater than 0.3 millimeter.

16. The wavelength conversion device according to claim 10 , further comprising a driving motor and a connection layer, wherein the drivin

Assignees

• Coretronic Corp

Inventors

• Chen I-Hua
• Hsieh Chi-Tang

Classifications

• G02F2/004 Primary

  Transferring the modulation of modulated light, i.e. transferring the information from one optical carrier of a first wavelength to a second optical carrier of a second wavelength, e.g. all-optical wavelength converter · CPC title

• G03B21/2066

  Reflectors in illumination beam (in projection beam G03B21/28) · CPC title

• H04N9/3158

  for controlling the spectrum · CPC title

• G03B21/16

  Cooling; Preventing overheating · CPC title

• H04N9/315

  Modulator illumination systems (general applications of lighting devices F21V; general optical systems G02B; lamp houses for projectors not peculiar to the presence of an electronic spatial light modulator G03B21/20) · CPC title