Interchangeable guide head for transfer mechanism

Patent metadata

Field	Value
Publication number	US-11001078-B2
Application number	US-201816146966-A
Country	US
Kind code	B2
Filing date	Sep 28, 2018
Priority date	Sep 28, 2018
Publication date	May 11, 2021
Grant date	May 11, 2021

Abstract

An apparatus including a dot matrix transfer head that includes an impact wire housing. A plurality of impact wires are disposed within the impact wire housing and extend out of the impact wire housing. A splaying element attached to a bottom surface of the impact wire housing. The plurality of impact wires extend into and through the splaying element. A guide head attached to a bottom surface of the splaying element. The guide head includes multiple holes that arrange the plurality of impact wires in a matrix configuration. The splaying element is designed to direct the plurality of impact wires toward the multiple holes in the guide head.

First claim

What is claimed is:

1. A dot matrix transfer head, comprising:
an impact wire housing;
a plurality of impact wires disposed within the impact wire housing and extending out of the impact wire housing;
a splaying element attached to a bottom surface of the impact wire housing, wherein the plurality of impact wires extend into and through the splaying element; and
a guide head attached to a bottom surface of the splaying element, the guide head including multiple holes configured to arrange the plurality of impact wires in a matrix configuration,
wherein the splaying element is configured to direct the plurality of impact wires towards the multiple holes in the guide head.

2. The dot matrix transfer head according to claim 1 , wherein the guide head is configured to be interchangeable with another guide head while the plurality of impact wires remain in a neutral state.

3. The dot matrix transfer head according to claim 2 , wherein the neutral state refers to a state in which the plurality of impact wires are secured within the impact wire housing, inserted through the splaying element, and in a pre-transfer position.

4. The dot matrix transfer head according to claim 1 , wherein the guide head includes an attachment side and a base side.

5. The dot matrix transfer head according to claim 4 , wherein each of the multiple holes include a taper extending from the attachment side towards the base side, such that the taper forms a bevel around an opening of each hole.

6. The dot matrix transfer head according to claim 1 , wherein the guide head includes raised outer edges around an edge of the base side of the guide head.

7. The dot matrix transfer head according to claim 1 , wherein the plurality of impact wires includes one or more actuators to actuate the plurality of impact wires.

8. The dot matrix transfer head according to claim 7 , wherein the one or more actuators are communicatively coupled to a controller that is configured to activate the one or more actuators.

9. An apparatus for executing a direct transfer of one or more semiconductor device die from a wafer tape to a substrate, the apparatus comprising:
an impact wire housing configured to house multiple impact wires, wherein the multiple impact wires are secured within the impact wire housing at a first end of the multiple impact wires;
an actuator communicatively coupled to a controller configured to actuate the multiple impact wires;
a splaying element disposed adjacent the impact wire housing, wherein the multiple impact wires extend out of the impact wire housing and through the splaying element, the splaying element configured to spread the multiple impact wires away from each other; and
a guide having a plurality of holes removably attached to the splaying element in direction coincidental with a direction of extension of the multiple impact wires, wherein the multiple impact wires extend at least partially into the plurality of holes.

10. The apparatus according to claim 9 , wherein the actuator includes a single actuating element responsible for actuating each of the multiple impact wires, such that the actuator actuates the multiple impact wires independent from one another.

11. The apparatus according to claim 9 , wherein the plurality of holes of the guide head are configured in a matrix pattern.

12. The apparatus according to claim 9 , wherein the apparatus further comprises a controller that is configured to track usage of at least one of the actuator or the multiple impact wires.

13. The apparatus according to claim 9 , wherein the impact wire housing, the multiple impact wires, the actuator, and the splaying element remain in place while the guide is interchanged with another guide.

Assignees

• Rohinni Llc

Inventors

• Huska Andrew

Classifications

• H10P72/04

  Apparatus for manufacture or treatment · CPC title

• Y10T29/53174

  Means to fasten electrical component to wiring board, base, or substrate · CPC title

• H10P72/0446 Primary

  Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title

• B41J2/27 Primary

  Actuators for print wires · CPC title

• B41J2/235

  Print head assemblies · CPC title