Applicator

US11000877B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11000877-B2
Application numberUS-201816130231-A
CountryUS
Kind codeB2
Filing dateSep 13, 2018
Priority dateApr 9, 2014
Publication dateMay 11, 2021
Grant dateMay 11, 2021

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An applicator for application onto and embossing microprofiling of a fluidic medium on a substrate, in particular in the aerospace sector, and a corresponding application device having such an applicator. The applicator has a circumferentially moving die that has an embossing profile, a press for the die and a stabilizing device, in particular a hardening device, for the applied medium. In addition, the applicator has a hollow support body, surrounded by the die at a distance forming a gap, the press being arranged in the gap. The application device has, in addition to the applicator, a handling device for a relative movement between the applicator and a workpiece.

First claim

Opening claim text (preview).

The invention claimed is: 1. An applicator for applying and embossing a microprofile on a fluidic medium on an outer skin of an aircraft, the applicator comprising: a circumferentially movable die comprising an embossing profile for embossing the microprofile in the fluidic medium on the outer skin of the aircraft; a frame; a feeding device; a hollow support body, which is rotatably mounted on the frame and within the die, the hollow support body being surrounded, when mounted on the frame, by the die at a distance to form a gap between the support body and the die; and a press for the die, wherein the press is arranged in the gap and is configured to act on the die from an inside of the die to exert a pressure force on the die, so that the die is rotatably locked to the support body; wherein the die is configured to receive the fluidic medium from the feeding device using the embossing profile when the die moves circumferentially; wherein the die is in a form of an endless annular path; and wherein the die is configured to be rolled over the outer skin of the aircraft to transfer the fluidic medium to the outer skin of the aircraft. 2. The applicator according to claim 1 , comprising a drive for circumferential movement of the die. 3. The applicator according to claim 2 , wherein the support body is coupled to the drive. 4. The applicator according to claim 1 , wherein the die is configured to form the microprofile on the outer skin of the aircraft to comprise a microstructure having elevations and indentions in a form of at least one stripe. 5. The applicator according to claim 1 , wherein the die is configured to emboss a plurality of parallel stripes in one application path. 6. The applicator according to claim 5 , wherein a width of the die is greater than a width of the application path, and the embossing profile extends only over a partial area of the width of the die. 7. The applicator according to claim 6 , comprising a stabilizer and a barrier arranged at an edge of the die that prevents passage of the stabilizer and allows a region of the fluidic medium to remain unstabilized. 8. The applicator according to claim 7 , wherein the stabilizer is configured to solidify the unstabilized region during an adjacent application path. 9. The applicator according to claim 1 , further comprising a fluidic medium stabilizer. 10. The applicator according to claim 1 , wherein the feeding device is mounted on the frame. 11. An application device for applying and embossing a fluidic medium to form a microprofile on a flat or curved surface of an outer skin of an aircraft, the application device comprising a handling device and at least one applicator, the applicator comprising; a circumferentially movable die comprising an embossing profile for embossing the microprofile in the fluidic medium on the surface; a fluidic medium stabilizer; a frame; a feeding device mounted on the frame; a hollow support body, which is rotatably mounted on the frame and within the die, the hollow support body being surrounded, when mounted on the frame, by the die at a distance to form a gap between the support body and the die; and a press for the die, wherein the press is arranged in the gap and is configured to act on the die from an inside of the die to exert a pressure force on the die, so that the die is rotatably locked to the support body; wherein the die is configured to receive the fluidic medium from the feeding device using the embossing profile when the die moves circumferentially; wherein the die is configured to be rolled over the surface to transfer the fluidic medium to the surface; and wherein the die is in a form of an endless annular path. 12. The application device according to claim 11 , wherein the handling device comprises a multi-axis programmable industrial robot for a relative motion between the at least one applicator and the outer skin of the aircraft. 13. The application device according to claim 11 , comprising a plurality of applicators, wherein the applicators are connected to a common handler mount by articulated mounting arms and/or an adjusting device. 14. An applicator for applying and embossing a microprofile on a fluidic medium on an outer skin of an aircraft, the applicator comprising: a die for receiving a fluidic medium, the die comprising an embossing profile for embossing the microprofile in the fluidic medium on the outer skin of the aircraft; a frame; a feeding device mounted on the frame; a hollow support body, which is rotatably mounted on the frame and within the die, the hollow support body being surrounded, when mounted on the frame, by the die at a distance to form a gap between the support body and the die; and a press for the die, wherein the press is arranged in the gap and is configured to act on the die from an inside of the die to exert a pressure force on the die, so that the die is rotatably locked to the support body; wherein the die is circumferentially movable to roll over the outer skin of the aircraft to transfer the fluidic medium to the outer skin of the aircraft; and wherein the die is in a form of an endless annular path. 15. The applicator according to claim 14 , wherein the hollow support body is surrounded by the die at a distance, thereby forming a gap, and wherein the press is in the gap. 16. The applicator according to claim 14 , comprising a drive for circumferential movement of the die. 17. The applicator according to claim 14 , wherein the support body is coupled to the drive. 18. The applicator according to claim 14 , further comprising a fluidic medium stabilizer.

Assignees

Inventors

Classifications

  • B29C59/046Primary

    for layered or coated substantially flat surfaces · CPC title

  • Curing or cross-linking the coating · CPC title

  • B05C1/0808Primary

    Details thereof, e.g. surface characteristics · CPC title

  • Distributing applied liquids or other fluent materials by members moving relatively to surface · CPC title

  • using UV radiation · CPC title

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Frequently asked questions

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What does patent US11000877B2 cover?
An applicator for application onto and embossing microprofiling of a fluidic medium on a substrate, in particular in the aerospace sector, and a corresponding application device having such an applicator. The applicator has a circumferentially moving die that has an embossing profile, a press for the die and a stabilizing device, in particular a hardening device, for the applied medium. In addi…
Who is the assignee on this patent?
Airbus Operations Gmbh
What technology area does this patent fall under?
Primary CPC classification B29C59/046. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 11 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).