Method for applying electronic components

Patent metadata

Field	Value
Publication number	US-10999936-B2
Application number	US-201916563527-A
Country	US
Kind code	B2
Filing date	Sep 6, 2019
Priority date	Sep 7, 2018
Publication date	May 4, 2021
Grant date	May 4, 2021

Abstract

A method for applying at least one electronic component to a surface is described. The method includes placing a component stencil on a support. At least one electronic component is arranged in a corresponding opening of the component stencil with a top surface of the electronic component on the support. A contact material stencil is positioned on the component stencil such that at least one opening in the contact material stencil is over a corresponding contact region on the bottom surface of the at least one electronic component. A contact material is applied on the at least one contact region of the at least one electronic component within the corresponding opening of the contact material stencil. The contact material stencil is removed from the component stencil. The component stencil is removed from the support. The at least one electronic component is applied to the surface.

First claim

What is claimed is:

1. A method for applying at least one electronic component to a non-planar surface of an object, the method comprising:
placing a component stencil on a support;
arranging a plurality of electronic components in a plurality of corresponding openings of the component stencil with a top surface of the plurality of electronic components on the support;
positioning a contact material stencil on the component stencil such that each of the plurality of openings in the contact material stencil is over a corresponding contact region on the bottom surface of each of the plurality of electronic components;
applying a contact material on the at least one contact region of each of the plurality of electronic components within the corresponding opening of the contact material stencil;
removing the contact material stencil from the component stencil;
removing the component stencil from the support; and
applying the plurality of electronic components to the non-planar surface by bending the support to conform to the shape of the non-planar surface such that the contact material couples each of the plurality of electronic components to the non-planar surface of the object.

2. The method according to claim 1 , further comprising using an SMT component placement system to apply the plurality of electronic components to the non-planar surface of the object.

3. The method according to claim 1 ,
wherein the arranging the plurality of electronic components further comprises removably fixing the plurality of electronic components on the support, and
wherein the applying the plurality of electronic components to the non-planar surface further comprises applying the plurality of electronic components to the non-planar surface while the plurality of electronic components are removably fixed on the support.

4. The method of claim 3 , wherein the removably fixing the plurality of electronic components on the support further comprises providing an adhesive on the support.

5. The method according to claim 3 ,
wherein the support comprises at least one bend line dividing the support into a plurality of regions, each of the plurality of regions comprising at least one of the plurality of electronic components, and bending the support to conform to the shape of the non-planar surface comprises bending the support at each of the at least one bend line.

6. The method of claim 1 , wherein the bending the support further comprises using at least one holding device to bend the support to conform to the shape of the non-planar surface.

7. The method of claim 1 , wherein the applying the plurality of electronic components to the non-planar surface further comprises arranging the plurality of electronic components fixed on the support on the non-planar surface using at least one holding device.

8. The method according to claim 1 ,
wherein the applying the plurality of electronic components to the non-planar surface further comprises establishing an electrical contact between the plurality of electronic components and the non-planar surface.

9. The method according to claim 1 ,
further comprising removing the contact material stencil from the component stencil prior to applying the plurality of electronic components to the surface.

10. The method according to claim 9 , wherein the non-planar surface comprises at least two mounting faces adjacent to each other, and the applying the plurality of electronic components to the non-planar surface further comprises arranging the plurality of electronic components along an arrangement direction of at least one of the at least two mounting surfaces.

11. A device comprising:
a flexible support comprising at least one bend line dividing the flexible support into a plurality of regions;
a component stencil on a surface of the flexible support and comprising a plurality of openings, each of the plurality of openings overlying one of the plurality of regions;
an electronic component in each of the plurality of openings in the component stencil, a top surface of the electronic component mechanically coupled to the surface of the support, and a bottom surface of the electronic component comprising at least one contact; and
a contact material stencil disposed over the component stencil and the electronic component, the contact material stencil comprising at least one opening corresponding to at least one contact of the at least one electronic component.

12. The device of claim 11 , further comprising contact material in the at least one opening in the component stencil.

13. The device of claim 12 , wherein the contact material is one of solder paste and conductive adhesive.

14. The device of claim 13 , wherein the conductive adhesive is a UV-curable adhesive.

15. The device of claim 11 , wherein the support comprises polyimides.

16. The device of claim 11 , wherein the electronic component is a light-emitting diode.

17. A device comprising:
a flexible support comprising at least one bend line dividing the flexible support into a plurality of regions;
a component stencil on the support and comprising a plurality of openings, each of the plurality of openings overlying one of the plurality of regions; and
a plurality of electronic components having a top surface and a bottom surface, the bottom surface comprising at least one contact,
one of the plurality of electronic components being disposed in one of the plurality of openings with the top surface of each of the plurality of electronic components on the flexible support.

18. The device of claim 17 , further comprising a contact material on the at least one contact.

19. The device of claim 18 , further comprising a contact material stencil on the component stencil, the contact material stencil having a respective opening over each of the at least one contact of each of the plurality of electronic components, the contact material on the at least one contact contained within the respective opening in the contact material stencil.

20. The device of claim 17 , wherein the plurality of electronic components comprises a plurality of light-emitting diodes.

Assignees

• Lumileds Holding Bv
• Lumileds Llc

Inventors

• Epmeier Matthias
• Wellmeier Petra
• Giese Frank
• Weber Carsten
• Deckers Michael
• Henninger Georg

Classifications

• H10P72/0446

  Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title

• H10H20/01

  Manufacture or treatment · CPC title

• H10H29/142

  Two-dimensional arrangements, e.g. asymmetric LED layout · CPC title

• H10H20/036

  of packages · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title