METHODS FOR PERFORMING EMBEDDED WAFER-LEVEL PACKAGING (eWLP) AND eWLP DEVICES, PACKAGES AND ASSEMBLIES MADE BY THE METHODS
US-2015262984-A1 · Sep 17, 2015 · US
US10998300B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10998300-B2 |
| Application number | US-201515544585-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 16, 2015 |
| Priority date | Jan 29, 2015 |
| Publication date | May 4, 2021 |
| Grant date | May 4, 2021 |
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Official abstract text for this publication.
A display unit is provided, on a substrate, with a first wiring layer and a device section. The device section has a plurality of pixels. The device section includes, in each of the pixels, a light-emitting device section and a drive device. The light-emitting device section includes a light-emitting device and a light-emitting surface. The drive device drives the light-emitting device section and is electrically coupled to the light-emitting device section through the first wiring layer. An end of the light-emitting surface of the light-emitting device section is disposed at a position as high as an upper end of the drive device, or at a position higher than the upper end.
Opening claim text (preview).
The invention claimed is: 1. A display unit provided, on a substrate, with a first wiring layer and a device section having a plurality of pixels, the device section comprising, in each of the pixels: a light-emitting device section that includes a light-emitting device and a light-emitting surface; and a drive device that drives the light-emitting device section and is electrically coupled to the light-emitting device section through the first wiring layer, wherein the light-emitting device section is coupled to the first wiring layer through a single insulating film directly contacting a majority of a surface of the light-emitting device section closest to the first wiring layer, wherein the first wiring layer is disposed at a position lower than the drive device, and wherein an end of the light-emitting surface of the light-emitting device section is disposed at a position as high as an upper end of the drive device, or at a position higher than the upper end. 2. The display unit according to claim 1 , wherein the light-emitting device section is provided with a first insulating film on substrate side of the light-emitting device, wherein a total of a thickness of the first insulating film and a thickness of the light-emitting device is equal to or greater than a thickness of the drive device. 3. The display unit according to claim 1 , further comprising a second insulating film having a first recessed portion at a selective region, the second insulating film being provided between the substrate and the light-emitting device section as well as the drive device, the drive device being formed to allow a portion of the drive device to be embedded into the first recessed portion of the second insulating film. 4. The display unit according to claim 1 , further comprising a sealing layer that covers the drive device and the light-emitting device section, the light-emitting device section including a high-refractive-index layer having a refractive index that is higher than a refractive index of the sealing layer, the high-refractive-index layer covering the light-emitting device and having the light-emitting surface. 5. The display unit according to claim 4 , wherein a maximum value of an emission angle of light emitted from an end of the light-emitting surface of the high-refractive-index layer is 90 degrees. 6. The display unit according to claim 5 , wherein a refractive index and a thickness of the high-refractive-index layer satisfy the following conditional expression (A): n 0/ n 1< L 1/( H 1 2 +L 1 2 ) 1/2 (A) where n 0 is a refractive index of the sealing layer, n 1 is a refractive index of the high-refractive-index layer, L 1 is a thickness of the high-refractive-index layer facing a side surface of the light-emitting device, and H 1 is a thickness of the high-refractive-index layer facing the light-emitting surface of the light-emitting device. 7. The display unit according to claim 1 , wherein the light-emitting device is formed to be embedded into a portion of the drive device. 8. The display unit according to claim 7 , wherein the drive device has a second recessed portion at a selective region, and the light-emitting device is formed inside the second recessed portion. 9. The display unit according to claim 8 , further comprising a third insulating film that serves to adjust a height of the light-emitting surface on a bottom surface of the second recessed portion. 10. The display unit according to claim 1 , wherein the drive device has a tapered shape. 11. The display unit according to claim 10 , wherein a cross-sectional shape of the drive device is trapezoidal. 12. The display unit according to claim 1 , further comprising a light-shielding film that is formed to cover a surface of the drive device. 13. The display unit according to claim 1 , further comprising an antireflective film that is formed to cover a surface of the drive device. 14. The display unit according to claim 1 , further comprising a connection wiring line for electrical coupling between the light-emitting device and the drive device, the connection wiring line being interposed between the light-emitting device and the drive device to serve as a light-shielding layer as well. 15. The display unit according to claim 14 , wherein the connection wiring line is formed of a through-silicon via. 16. The display unit according to claim 1 , further comprising a seed layer that is superposed on the drive device and is used to form a metallic wiring line through plating, the seed layer being interposed between the light-emitting device and the drive device to serve as a light-shielding layer as well. 17. The display unit according to claim 1 , further comprising a light-shielding resin layer that is formed to be embedded between the light-emitting device and the drive device. 18. The display unit according to claim 17 , wherein the light-shielding resin layer is embedded between the pixels and between the light-emitting device and the drive device to serve as a planarizing layer as well. 19. The display unit according to claim 1 , wherein the single insulating film is disposed at a position lower than the drive device.
Encapsulations, e.g. protective coatings · CPC title
Fan-out layouts · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
Configurations of laterally-adjacent chips · CPC title
of the portions that connect to chips, wafers or package parts · CPC title
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