Ceramic electronic component with crack protection and production method therefor

Patent metadata

Field	Value
Publication number	US-10998135-B2
Application number	US-201916415592-A
Country	US
Kind code	B2
Filing date	May 17, 2019
Priority date	May 22, 2018
Publication date	May 4, 2021
Grant date	May 4, 2021

Abstract

A ceramic electronic component includes external electrodes having conductive resin layers thereinside on respective two ends opposed to each other in a rectangular parallelepiped ceramic component body. Each of the external electrodes includes an underlying metal layer, an intermediate metal layer, a conductive resin layer, an external metal layer. A tip angle α between an outer face of a tip portion of the wraparound portion of the underlying metal layer and a surface of the ceramic component body is 20° or smaller, and a tip angle β between an outer face of a tip portion of the wraparound portion of the intermediate metal layer and a surface of the ceramic component body is 20° or smaller.

First claim

What is claimed is:

1. A ceramic electronic component comprising:
external electrodes having conductive resin layers thereinside on respective two ends opposed to each other in a rectangular parallelepiped ceramic component body, wherein
when an opposing direction of two faces opposed to each other in the ceramic component body is defined as a first direction, an opposing direction of other two faces opposed to each other is defined as a second direction, an opposing direction of the remaining other two faces opposed to each other is defined as a third direction, and dimensions along respective directions are defined as a first direction dimension, a second direction dimension, and a third direction dimension respectively,
each of the external electrodes includes
<1> an underlying metal layer having an end face portion covering each end face in the first direction of the ceramic component body and a wraparound portion covering respective parts of the remaining four faces around the each end face that are continuously formed;
<2> an intermediate metal layer having an end face portion covering each end face portion of the underlying metal layer and a wraparound portion covering each wraparound portion of the underlying metal layer that are continuously formed;
<3> a conductive resin layer having an end face portion covering each end face portion of the intermediate metal layer and a wraparound portion covering each wraparound portion of the intermediate metal layer that are continuously formed, in which a value obtained by subtracting a thickness of the end face portion of the conductive resin layer from the wraparound portion of the conductive resin layer in the first direction dimension is larger than a thickness of the wraparound portion of the intermediate metal layer in the first direction dimension; and
<4> an external metal layer having an end face portion covering each end face portion of the conductive resin layer and a wraparound portion covering each wraparound portion of the conductive resin layer that are continuously formed, and

on at least a mounting side part of the wraparound portion of the underlying metal layer and on at least a mounting side part of the wraparound portion of the intermediate metal layer, a tip angle α between an outer face of a tip portion of the wraparound portion of the underlying metal layer and a surface of the ceramic component body is 20° or smaller, and a tip angle β between an outer face of a tip portion of the wraparound portion of the intermediate metal layer and the surface of the ceramic component body is 20° or smaller.

2. The ceramic electronic component according to claim 1 , wherein the tip portion of the wraparound portion of the underlying metal layer is covered by the tip portion of the wraparound portion of the intermediate metal layer.

3. The ceramic electronic component according to claim 1 , wherein the tip angle α is 3° or larger, and the tip angle β is 1° or larger.

4. The ceramic electronic component according to claim 1 , wherein the tip angle α is not larger than the tip angle β.

5. The ceramic electronic component according to claim 1 , wherein a value obtained by subtracting the tip angle α from the tip angle β is 10° or smaller.

6. The ceramic electronic component according to claim 1 , wherein
the underlying metal layer is formed by applying and baking a metal paste,
the intermediate metal layer is formed by a wet or dry plating method,
the conductive resin layer is formed by applying and thermally curing a conductive resin, and
the external metal layer is formed by a wet or dry plating method.

7. The ceramic electronic component according to claim 1 , wherein the ceramic electronic component is a multilayer ceramic capacitor.

8. A production method for a ceramic electronic component comprising:
external electrodes having conductive resin layers thereinside on respective two ends opposed to each other in a rectangular parallelepiped ceramic component body, wherein
when an opposing direction of two faces opposed to each other in the ceramic component body is defined as a first direction, an opposing direction of other two faces opposed to each other is defined as a second direction, an opposing direction of the remaining other two faces opposed to each other is defined as a third direction, and dimensions along respective directions are defined as a first direction dimension, a second direction dimension, and a third direction dimension respectively,
each of the external electrodes includes
<1> an underlying metal layer having an end face portion covering each end face in the first direction of the ceramic component body and a wraparound portion covering respective parts of the remaining four faces around the each end face that are continuously formed;
<2> an intermediate metal layer having an end face portion covering each end face portion of the underlying metal layer and a wraparound portion covering each wraparound portion of the underlying metal layer that are continuously formed;
<3> a conductive resin layer having an end face portion covering each end face portion of the intermediate metal layer and a wraparound portion covering each wraparound portion of the intermediate metal layer that are continuously formed, in which a value obtained by subtracting a thickness of the end face portion of the conductive resin layer from the wraparound portion of the conductive resin layer in the first direction dimension is larger than a thickness of the wraparound portion of the intermediate metal layer in the first direction dimension; and
<4> an external metal layer having an end face portion covering each end face portion of the conductive resin layer and a wraparound portion covering each wraparound portion of the conductive resin layer that are continuously formed, and

on at least a mounting side part of the wraparound portion of the underlying metal layer and on at least a mounting side part of the wraparound portion of the intermediate metal layer, a tip angle α between an outer face of a tip portion of the wraparound portion of the underlying metal layer and a surface of the ceramic component body is 20° or smaller, and a tip angle β between an outer face of a tip portion of the wraparound portion of the intermediate metal layer and the surface of the ceramic component body is 20° or smaller.

9. The ceramic electronic component production method according to claim 8 , wherein the tip portion of the wraparound portion of the underlying metal layer is covered by the tip portion of the wraparound portion of the intermediate metal layer.

10. The ceramic electronic component production method according to claim 8 , wherein the tip angle α is 3° or larger, and the tip angle β is 1° or larger.

11. The ceramic electronic component production method according to claim 8 , wherein the tip angle α is not larger than the tip angle β.

12. The ceramic electronic component production method according to claim 8 , wherein a value obtained by subtracting the tip angle α from the tip angle β is 10° or smaller.

13. The ceramic electronic component production method according to claim 8 , wherein
the underlying metal layer is formed by applying and baking a metal paste,
the intermediate metal layer is formed by a wet or dry plating method,
the conductive resin layer is formed by applying and thermally curing a conductive resin, and
the external metal layer is formed by a wet or dry plating method.

14. The ceramic electronic component production method according to claim 8 , wherein the ceramic electronic component is a multilayer ceramic capacitor.

Assignees

• Taiyo Yuden Kk

Inventors

• Kobayashi Satoshi
• Fukuda Takahisa
• Nakamura Tomoaki
• Tahara Mikio
• Saito Naoki
• Yatagawa Kiyoshiro

Classifications

• H01G4/2325 Primary

  characterised by the material of the terminals · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title