Infrared imaging system shutter assembly with integrated thermister

Patent metadata

Field	Value
Publication number	US-10996542-B2
Application number	US-201916511365-A
Country	US
Kind code	B2
Filing date	Jul 15, 2019
Priority date	Dec 31, 2012
Publication date	May 4, 2021
Grant date	May 4, 2021

Abstract

An infrared imaging system is provided with a shutter assembly having an integrated thermistor. In one example, a device includes a shutter assembly. The shutter assembly includes a paddle configured to move between an open position and a closed position. The paddle is configured to block external infrared radiation from reaching a focal plane array (FPA) in a closed position, and pass the external infrared radiation to the FPA in an open position. The shutter assembly also includes an embedded thermistor configured to sense a temperature of the paddle when the paddle is in the open position. In another example, an infrared sensor assembly includes a first set of mechanically engageable electrical contacts for engaging with a second set of mechanically engageable electrical contacts of a shutter assembly electrically coupled with a thermistor through a conductive path. Additional devices and related methods are also provided.

First claim

What is claimed is:

1. A device comprising:
a focal plane array (FPA) configured to capture thermal images of a target scene; and
a shutter assembly comprising:
a paddle configured to move between an open position and a closed position, the paddle being configured to block scene-based infrared radiation from reaching the FPA in a closed position and pass the scene-based infrared radiation to the FPA in an open position;
a thermistor embedded within the shutter assembly and configured to sense a temperature of the paddle when the paddle is in the open position;
a low emissive surface adjacent to, substantially parallel with, and facing the FPA and configured to attenuate out-of-field thermal radiation while the FPA captures the scene-based thermal radiation; and
wherein the shutter assembly is configured to interface with a lens assembly disposed between the shutter assembly and the target scene.

2. The device of claim 1 , further comprising:
an infrared sensor assembly comprising:
the FPA, and
a first set of electrical contacts; and

wherein the shutter assembly further comprises a second set of electrical contacts electrically coupled with the thermistor through a conductive path and mechanically engaged with the first set of electrical contacts.

3. The device of claim 2 , wherein the temperature sensed by the thermistor is provided as a voltage based on a resistance value of the thermistor to the infrared sensor assembly through the first and second sets of electrical contacts.

4. The device of claim 2 , wherein the first and second sets of electrical contacts are complementary with each other.

5. The device of claim 4 , wherein one of the first or the second set of electrical contacts are conductive pads and the other one of the first or the second set of electrical contacts are spring contacts engaged with the conductive pads.

6. The device of claim 1 , wherein the paddle is further configured to rotate about an axis between the open position and the closed position.

7. The device of claim 2 , wherein:
the thermistor is disposed at a first side of the shutter assembly;
the second set of electrical contacts are disposed at a second side of the shutter assembly;
the shutter assembly further comprises an inner plate and an outer plate at the first side of the shutter assembly, the paddle being disposed between the inner plate and the outer plate such that the paddle is configured to slide between the inner plate and the outer plate to move from the open position to the closed position; and
the paddle is configured to be at a same temperature as the inner plate through heat transfer between the paddle and the inner plate.

8. The device of claim 7 , further comprising the lens assembly configured to pass the scene-based infrared radiation from the target scene to the FPA, the lens assembly connected to the shutter assembly at a side opposite the infrared sensor assembly, the paddle being disposed between the thermistor and the lens assembly.

9. The device of claim 2 , wherein:
the infrared sensor assembly further comprises a third set of mechanically engageable electrical contacts; and
the shutter assembly further comprises:
a fourth set of mechanically engageable electrical contacts complementary with the third set of electrical contacts, and
an actuator configured to move the paddle between the open position and the closed position in response to a voltage provided through the third and fourth sets of electrical contacts.

10. The system of claim 1 , further comprising:
the FPA comprising a plurality of infrared sensors configured to capture the thermal images in response to the scene-based thermal radiation received over a first angle and out-of-field thermal radiation received over a second angle;
wherein the shutter assembly comprises an opening configured to pass the scene-based thermal radiation to the FPA while the paddle is in the open position, wherein the shutter assembly subtends over at least a portion of the second angle; and
wherein the low emissive surface is configured to attenuate the out-of-field thermal radiation received by the FPA through the subtended portion of the second angle.

11. The system of claim 1 , further comprising a lens barrel holder comprising snap-on clips configured to selectively attach a lens barrel to position the lens barrel between the shutter assembly and an imaged scene.

12. A method comprising:
providing a paddle in a shutter assembly connected to an infrared sensor assembly, wherein the paddle is configured to move between a closed position blocking scene-based infrared radiation from reaching a focal plane array (FPA) of the infrared sensor assembly configured to capture thermal images of a target scene, and an open position passing the scene-based infrared radiation to the FPA;
sensing a temperature of the paddle in the open position by a thermistor embedded within the shutter assembly;
determining the temperature of the paddle based on voltage values of the thermistor based on resistance values of the thermistor corresponding to the temperature sensed by the thermistor;
attenuating, by a low emissive surface of the shutter assembly adjacent to, substantially parallel with, and facing the FPA, out-of-field thermal radiation while the FPA captures the scene-based thermal radiation; and
wherein the shutter assembly is configured to interface with a lens assembly disposed between the shutter assembly and the target scene.

13. The method of claim 12 , wherein:
the infrared sensor assembly comprises a first set of mechanically engageable contacts; and
the shutter assembly comprises a second set of mechanically engageable electrical contacts electrically coupled with the thermistor through a conductive path and mechanically engaged with the first set of electrical contacts.

14. The method of claim 13 , further comprising coupling the shutter assembly with the infrared sensor assembly by the first and second sets of electrical contacts.

15. The method of claim 13 , wherein the first and second sets of electrical contacts are complementary with each other.

16. The method of claim 15 , wherein one of the first or the second set of electrical contacts are conductive pads and the other one of the first or the second set of electrical contacts are spring contacts engaged with the conductive pads.

17. The method of claim 13 , wherein:
the thermistor is disposed at a first side of the shutter assembly;
the second set of electrical contacts are disposed at a second side of the shutter assembly;
the paddle is disposed between an inner plate and an outer plate of the shutter assembly;
the paddle, the inner plate, and the outer plate are disposed between the thermistor and a lens assembly; and
the method further comprises:
sliding the paddle between the inner plate and the outer plate to move from the open position to the closed position, and
maintaining a temperature of the inner plate at a same temperature as the paddle through heat transfer between the inner plate and the paddle.

18. The method of claim 12 , wherein:
the infrared sensor assembly further comprises a third set of mechanically engageable electrical contacts;
the shutter assembly further comprises a fourth set of mechanically engageable electrical contacts complementary with the third set of electrical contacts; and
the method further comprises:
coupling the third set of electrical contacts with the fourth set of electrical contacts, and
rotating the paddle between the open position and the closed posit

Assignees

• Flir Systems

Inventors

• Kostrzewa Joseph
• Covington Bruce A
• Tremblay Marcel
• Hoelter Theodore R
• Boulanger Pierre M

Classifications

• H04N23/55 Primary

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N25/21

  for transforming thermal infrared radiation into image signals · CPC title

• H04N23/23

  from thermal infrared radiation · CPC title

• G03B9/08 Primary

  Shutters · CPC title

• G03B7/22

  in accordance with temperature or height, e.g. in aircraft · CPC title