Silicone adhesive composition, adhesive tape, and method for producing adhesive tape

US10995247B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10995247-B2
Application numberUS-201515116462-A
CountryUS
Kind codeB2
Filing dateJan 8, 2015
Priority dateFeb 13, 2014
Publication dateMay 4, 2021
Grant dateMay 4, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A silicone adhesive composition includes 100 parts by weight of a peroxide-curable silicone, 1.2 to 3.2 parts by weight of an organic peroxide curing agent, and 2 to 9 parts by weight of an addition reaction-curable silicone rubber. An adhesive tape includes a base and an adhesive layer placed on the base, the adhesive layer being formed from the above silicone adhesive composition. The adhesive composition exhibits high load bearing capacity even in higher-temperature environments than ever before. The adhesive tape exhibits high load bearing capacity and good shelf life even in such high-temperature environments.

First claim

Opening claim text (preview).

The invention claimed is: 1. A silicone adhesive composition consisting essentially of: 100 parts by weight of a peroxide-curable silicone; 1.2 to 3.2 parts by weight of an organic peroxide curing agent; and 2 to 9 parts by weight of an addition reaction-curable silicone rubber, wherein the peroxide-curable silicone includes (1) at least one selected from the group consisting of a dimethylpolysiloxane which may optionally have a hydroxy group, and a partial condensate thereof and (2) and at least one selected from an MQ resin which is comprises an M unit and a Q unit, and a partial condensate thereof, the addition reaction-curable silicone rubber contains an addition-polymerizable group, and the silicone adhesive composition satisfies at least one of the following conditions: (a) a gel fraction of a cured product of the silicone adhesive composition is 40 to 60%; or (b) in an adhesive tape comprising a base and an adhesive layer placed on the base, the adhesive layer being formed from the silicone adhesive composition, an amount of peel in 90° direction is 0 (mm), wherein the amount of peel in 90° direction is determined by: (i) cutting the adhesive tape to obtain a 10-mm-wide test specimen; (ii) attaching the test specimen to a stainless steel plate so that an adhesive area is 10 mm×20 mm and one edge of the test specimen is not in contact with the stainless steel plate; (iii) applying a load of 20 g, acting in a direction perpendicular to the surface of the stainless steel plate, to the one edge of the test specimen; (iv) quickly heating the test specimen and the stainless steel plate to 250° C. and holding at 250° C. for 1 hour; and (v) evaluating an amount of peel of the test specimen.

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What does patent US10995247B2 cover?
A silicone adhesive composition includes 100 parts by weight of a peroxide-curable silicone, 1.2 to 3.2 parts by weight of an organic peroxide curing agent, and 2 to 9 parts by weight of an addition reaction-curable silicone rubber. An adhesive tape includes a base and an adhesive layer placed on the base, the adhesive layer being formed from the above silicone adhesive composition. The adhesiv…
Who is the assignee on this patent?
Nitto Denko Corp
What technology area does this patent fall under?
Primary CPC classification C09J183/04. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue May 04 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).