Composition for forming protective film for electroconductive pattern, protective film for electroconductive pattern, method for producing protective film, and method for producing transparent electroconductive film

Patent metadata

Field	Value
Publication number	US-10995235-B2
Application number	US-201716465400-A
Country	US
Kind code	B2
Filing date	Nov 29, 2017
Priority date	Dec 1, 2016
Publication date	May 4, 2021
Grant date	May 4, 2021

Abstract

A composition for a protective film for electroconductive patterns, including: (A) a polyurethane containing a carboxyl group; (B) an epoxy compound; (C) a curing accelerator; and (D) a solvent, wherein the percentage of the solvent (D) contained is from 95.0% to 99.9% by mass, and the solvent (D) contains (D1) a solvent containing a hydroxyl group and having a boiling point in excess of 100° C., and (D2) a solvent having a boiling point that does not exceed 100° C., wherein the content of the solvent (D2) having a boiling point that does not exceed 100° C. is 30% to less than 70% by mass of total solvent in total. The composition can be cured by heating at a temperature not exceeding 100° C. for a heating time not exceeding 10 minutes.

First claim

The invention claimed is:

1. A composition for a protective film for a conductive pattern, comprising
(A) a polyurethane containing a carboxyl group,
(B) an epoxy compound,
(C) a curing accelerator, and
(D) solvent,
wherein the content of the solvent (D) is 95.0% by mass or more and 99.9% by mass or less of the total composition,
(D) comprises (D1) and (D2), (D1) being a solvent having a boiling point exceeding 100° C. and containing a hydroxyl group, (D2) being a solvent having a boiling point of 100° C. or lower, and the content of the solvent (D2) having the boiling point of 100° C. or lower is 30% by mass or more and less than 70% by mass of the solvent in total.

2. A composition for a protective film for a conductive pattern according to claim 1 , wherein (D1) solvent having the boiling point exceeding 100° C. and containing a hydroxyl group is at least one selected from a group consisting of propylene glycol monomethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, triethylene glycol, and ethyl lactate.

3. A composition for a protective film for a conductive pattern according to claim 1 , wherein (D2) solvent having the boiling point of 100° C. or lower is at least one selected from a group consisting of propylene glycol dimethyl ether, isopropyl alcohol, t-butyl alcohol, and methyl ethyl ketone.

4. A composition for a protective film for a conductive pattern according to claim 2 , wherein (D2) solvent having the boiling point of 100° C. or lower is at least one selected from a group consisting of propylene glycol dimethyl ether, isopropyl alcohol, t-butyl alcohol, and methyl ethyl ketone.

5. A composition for a protective film for a conductive pattern according to claim 2 , wherein (D1) solvent having the boiling point exceeding 100° C. and containing a hydroxyl group is at least one of diethylene glycol monoethyl ether (EC) and propylene glycol monomethyl ether (PGME).

6. A composition for a protective film for a conductive pattern according to claim 3 , wherein (D2) solvent having the boiling point of 100° C. or lower is isopropyl alcohol (IPA).

7. A protective film for a conductive pattern which is made of a cured product of the composition for the protective film for the conductive pattern according to claim 1 , and which has a cure degree of 45 or more.

8. A method for producing a protective film, wherein the composition for the protective film for the conductive pattern according to claim 1 is cured at a temperature of 100° C. or lower and for a heating time of 10 minutes or less.

9. A method for producing a transparent conductive film comprising a step of forming the protective film on the transparent conductive film by the method according to claim 7 .

10. A composition for a protective film for a conductive pattern according claim 1 , wherein (A) polyurethane containing a carboxyl group is polyurethane synthesized by using (a1) a polyisocyanate compound, (a2) a polyol compound, and (a3) a dihydroxy compound containing a carboxyl group, as monomers, (a1) being an alicyclic compound having 6 to 30 carbon atoms other than the carbon atoms in the isocyanato group (—NCO group), (a2) being either polycarbonate polyol or polybutadiene polyol, and (a3) being either 2,2-dimethylolpropionic acid or 2,2-dimethylolbutanoic acid.

11. A composition for a protective film for a conductive pattern according claim 1 , wherein (B) epoxy compound having two or more epoxy groups in one molecule is selected from a group consisting of: an amino group-containing epoxy resin, an aliphatic-type epoxy resin containing a glycidyl group, and an alicyclic epoxy resin containing a glycidyl group.

12. A composition for a protective film for a conductive pattern according claim 1 , wherein the mixing ratio of (A) polyurethane containing a carboxyl group relative to (B) epoxy compound is 0.5 to 1.5, in terms of equivalent ratio of the carboxyl groups of polyurethane relative to the epoxy groups of (B) epoxy compound, and the used amount of (C) curing accelerator is 0.1 to 10% by mass relative to the total mass of (A) polyurethane containing a carboxyl group and (B) epoxy compound.

13. A composition for a protective film for a conductive pattern according claim 10 , wherein (A) polyurethane containing a carboxyl group has an acid value of 10 to 140 mg-KOH/g.

Assignees

• Show A Denko K K
• Showa Denko Kk

Inventors

• Toba Masahiko
• Nakazawa Eri
• Yamaki Shigeru

Classifications

• H01B1/124 Primary

  Intrinsically conductive polymers · CPC title

• C08G18/758

  containing two or more cycloaliphatic rings · CPC title

• C08G18/44

  Polycarbonates · CPC title

• C09D7/20 Primary

  Diluents or solvents · CPC title

• C08G18/0823

  containing carboxylate salt groups or groups forming them · CPC title