Modified polyphenylene ether, method for preparing same, polyphenylene ether resin composition, resin varnish, prepreg, metal-clad laminate and printed circuit board
US-2015218326-A1 · Aug 6, 2015 · US
US10995182B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10995182-B2 |
| Application number | US-201916377935-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 8, 2019 |
| Priority date | Apr 30, 2018 |
| Publication date | May 4, 2021 |
| Grant date | May 4, 2021 |
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A phenylene ether oligomer has repeating units of the structure and less than 30 weight percent of repeating units derived from a monohydric phenol having identical substituents in the 2- and 6-positions, wherein the phenylene ether oligomer includes a vinyl benzene ether end group, an amine end group, maleimide end group, a norbornene end group, an anhydride end group, or a combination comprising at least one of the foregoing. The phenylene ether oligomer can be used to provide a curable composition. The curable composition can be cured to provide a thermoset composition. Articles comprising the thermoset composition are also described.
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What is claimed is: 1. A phenylene ether oligomer comprising repeating units of the structure wherein the phenylene ether oligomer comprises less than 0.1 weight percent of repeating units derived from a monohydric phenol having identical substituents in the 2- and 6-positions; and wherein the phenylene ether oligomer comprises a vinyl benzene ether end group, an amine end group, maleimide end group, a norbornene group, an anhydride group, or a combination comprising at least one of the foregoing. 2. The phenylene ether oligomer of claim 1 , wherein the phenylene ether oligomer has a number average molecular weight of 600 to 5,000 grams per mole, determined by gel permeation chromatography relative to polystyrene standards. 3. The phenylene ether oligomer of claim 1 , wherein the phenylene ether oligomer has an intrinsic viscosity of less than 0.15 deciliter per gram, measured by Ubbelohde viscometer at 25° C. in chloroform. 4. The phenylene ether oligomer of claim 1 , wherein the phenylene ether oligomer comprises a vinyl benzene ether end group. 5. The phenylene ether oligomer of claim 1 , wherein the phenylene ether oligomer is of the structure wherein x and y are independently 0 to 30, provided that the sum of x and y is at least 2; each occurrence of R 1 , R 2 , R 3 , and R 4 independently comprises hydrogen, halogen, unsubstituted or substituted C 1 -C 12 primary or secondary hydrocarbyl, C 1 -C 12 hydrocarbylthio, C 1 -C 12 hydrocarbyloxy, or C 2 -C 12 halohydrocarbyloxy wherein at least two carbon atoms separate the halogen and oxygen atoms; z is 0 or 1; Y has a structure comprising wherein each occurrence of R 7 independently comprises hydrogen and C 1 -C 12 hydrocarbyl, and each occurrence of R 8 and R 9 is each independently hydrogen, C 1 -C 12 hydrocarbyl, or C 1 -C 6 hydrocarbylene wherein R 8 and R 9 collectively form a C 4 -C 12 alkylene group; and R is independently at each occurrence a vinyl benzene ether end group, an amine end group, or a maleimide end group, a norbornene end group, or an anhydride group. 6. The phenylene ether oligomer of claim 5 , wherein each occurrence of R 1 and R 2 is methyl, each occurrence of R 3 and R 4 is hydrogen, Y is an isopropylidene group, and R is a vinyl benzyl ether group. 7. The phenylene ether oligomer of claim 1 , wherein the phenylene ether oligomer comprises a polysiloxane block. 8. A method of making the phenylene ether oligomer of claim 1 , the method comprising oxidatively polymerizing 2-methyl-6-cyclohexyl phenol in the presence of a catalyst to provide the phenylene ether oligomer. 9. The method of claim 8 , further comprising reacting the phenylene ether oligomer with a vinyl benzene ether group, an amine group, a maleimide group, a norbornene group, an anhydride group, or a combination comprising at least one of the foregoing to provide a functionalized phenylene ether oligomer. 10. A curable composition comprising the phenylene ether oligomer of claim 1 ; and a curing promoter. 11. The curable composition of claim 10 , wherein the curing promoter comprises an amine, a dicyandiamide, a polyamide, an amidoamine, a Mannich base, an anhydride, a phenol-formaldehyde resin, a carboxylic acid functional polyester, a polysulfide, a polymercaptan, an isocyanate, a cyanate ester, or combinations thereof. 12. The curable composition of claim 10 , further comprising an auxiliary curable resin, a curable unsaturated monomer composition, or both. 13. A thermoset composition comprising a cured product of the curable composition of claim 10 . 14. An article comprising the thermoset composition of claim 13 . 15. A method for the manufacture of a thermoset composition, the method comprising curing the curable composition of claim 10 .
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