Glass substrate and laminated substrate

Patent metadata

Field	Value
Publication number	US-10994517-B2
Application number	US-201916355613-A
Country	US
Kind code	B2
Filing date	Mar 15, 2019
Priority date	Sep 16, 2016
Publication date	May 4, 2021
Grant date	May 4, 2021

Abstract

A first aspect of the present invention relates to a glass substrate having a content of alkali metal oxides, as represented by molar percentage based on oxides, of 0 to 0.1%, a devitrification-temperature viscosity of 103.2 dPa·s or higher, and an average coefficient of thermal expansion α at 30 to 220° C. of 7.80 to 9.00 (ppm/° C.). A second aspect of the present invention relates to a glass substrate which is to be used for a support substrate for semiconductor packages, the glass substrate having a content of alkali metal oxides, as represented by molar percentage based on oxides, of 0 to 0.1% and a photoelastic constant of 10 to 26 nm/cm/MPa.

First claim

The invention claimed is:

1. A glass substrate comprising:
a content of alkali metal oxides, as represented by molar percentage based on oxides, of 0 to 0.1%;
a devitrification-temperature viscosity of 10 3.2 dPa·s or higher; and
an average coefficient of thermal expansion α at 30 to 220° C. of 7.80 to 9.00 (ppm/° C.).

2. The glass substrate according to claim 1 , wherein the glass substrate is configured to be used for a support substrate for semiconductor packages.

3. The glass substrate according to claim 1 , further comprising a photoelastic constant of 10 to 26 nm/cm/MPa.

4. The glass substrate according to claim 1 , further comprising a glass matrix composition consisting essentially of a composition, as represented by molar percentage based on oxides,
SiO 2 : 50 to 70%,
Al 2 O 3 : 2 to 8%,
B 2 O 3 : 0 to 5%,
MgO: 0 to 5%,
CaO: 0 to 6%,
SrO: 4 to 20%, and
BaO: 14 to 35%,
provided that MgO+CaO+SrO+BaO: 25 to 40%.

5. The glass substrate according to claim 1 , further comprising a value as determined by the following expression (1) of 81 to 93, the expression (1) showing a relationship of each content proportion of oxides as represented by molar percentage based on oxides:
0.174×(content of SiO 2 )−0.012×(content of Al 2 O 3 )+0.317×(content of B 2 O 3 )+0.988×(content of MgO)+1.715×(content of CaO)+2.011×(content of SrO)+2.251×(content of BaO)+0.076  (1).

6. The glass substrate according to claim 1 , further comprising a total content of SiO 2 and Al 2 O 3 of 60% or higher.

7. The glass substrate according to claim 1 , further comprising a transmittance of 360 nm-wavelength light of 15% or higher at a thickness of 1 mm.

8. The glass substrate according to claim 1 , further comprising a glass devitrification temperature of 1,250° C. or lower.

9. The glass substrate according to claim 1 , further comprising a Young's modulus of 65 GPa or higher.

10. The glass substrate according to claim 1 , further comprising a thickness of 2.0 mm or less.

11. The glass substrate according to claim 1 , further comprising one main surface having an area of 70 to 7,000 cm 2 .

12. A laminated substrate comprising the glass substrate according to claim 11 and a semiconductor substrate laminated via a resin layer, wherein the semiconductor substrate is supported by the glass substrate.

13. The glass substrate according to claim 1 , further comprising a β-OH of 0.05 to 0.65 mm −1 .

14. The glass substrate according to claim 1 , further comprising a light-shielding film on at least one main surface of the glass substrate.

15. A laminated glass substrate comprising the glass substrate according to claim 1 and another glass substrate laminated therewith.

16. A laminated substrate comprising the glass substrate according to claim 1 and a semiconductor substrate laminated via a resin layer, wherein the semiconductor substrate is supported by the glass substrate.

17. The laminated substrate according to claim 16 , further comprising another glass substrate laminated on an opposite side of a surface of the glass substrate where the semiconductor substrate is laminated.

18. A glass substrate comprising:
a content of alkali metal oxides, as represented by molar percentage based on oxides, of 0 to 0.1%; a devitrification-temperature viscosity of 10 3.2 dPa·s or higher;
an average coefficient of thermal expansion a at 30 to 220° C. of 7.80 to 9.00 (ppm/° C.); and
a photoelastic constant of 10 to 26 nm/cm/MPa,
wherein the glass substrate is configured to be used for a support substrate for semiconductor packages.

Assignees

• Agc Inc

Inventors

• Sawamura Shigeki
• Ono Kazutaka

Classifications

• H10W70/692

  Ceramics or glasses · CPC title

• C03B19/00

  Other methods of shaping glass (manufacture or treatment of flakes, fibres or filaments from softened glass, minerals or slags C03B37/00) · CPC title

• B32B17/10119

  having a composition deviating from the basic composition of soda-lime glass, e.g. borosilicate · CPC title

• B32B17/10174

  Coatings of a metallic or dielectric material on a constituent layer of glass or polymer · CPC title

• B32B17/06

  comprising glass as the main or only constituent of a layer, next to another layer of a specific {material} · CPC title