Laser processing machine and laser processing method

Patent metadata

Field	Value
Publication number	US-10994374-B2
Application number	US-201816097973-A
Country	US
Kind code	B2
Filing date	Oct 2, 2018
Priority date	Mar 14, 2018
Publication date	May 4, 2021
Grant date	May 4, 2021

Abstract

The laser processing machine includes a beam oscillation mechanism that oscillates a beam spot on a surface of a sheet metal. The control device controls the beam oscillation mechanism so as to oscillate the beam spot with an oscillation component in a direction orthogonal to a cutting direction of the sheet metal in a non-holding region, in which a holding portion of the conveyance apparatus for conveying a product is not held, when cutting the product from the sheet metal by irradiating the sheet metal with the laser beam. The non-holding region is at least a part of a periphery of a protrusion portion of the product, or at least a part of a periphery of a recess forming region in which a recess of the product is formed.

First claim

The invention claimed is:

1. A laser processing machine comprising:
a processing head in which a nozzle is attached to a tip, the nozzle emitting a laser beam from an opening;
a focusing lens that is provided in the processing head and irradiates a sheet metal with the laser beam by focusing the laser beam, thereby forming a beam spot on a surface of the sheet metal;
a moving mechanism comprising an X-axis carriage and a Y-axis carriage configured to move a relative position of the processing head with respect to the surface of the sheet metal;
a beam oscillation mechanism comprising a pair of scanning mirrors and a pair of drivers for rotating the pair of scanning mirrors configured to oscillate the beam spot on the surface of the sheet metal by oscillating the laser beam emitted from the opening in the opening; and
an NC device configured to control the beam oscillation mechanism so as to oscillate the beam spot with an oscillation pattern including an oscillation component in a direction orthogonal to a cutting direction of the sheet metal in a non-holding region, in which a plurality of suction pads comprising a conveyance apparatus for conveying a product is not held, when cutting the product from the sheet metal by moving the relative position of the processing head using the moving mechanism and irradiating the sheet metal with the laser beam, the non-holding region being at least a part of a periphery of a protrusion portion of the product, or at least a part of a periphery of a recess forming region in which a recess portion of the product is formed.

2. The laser processing machine according to claim 1 , wherein
the NC device is configured to control the beam oscillation mechanism so as to oscillate the beam spot with an oscillation pattern including only an oscillation component in the direction orthogonal to the cutting direction without including an oscillation component in a direction parallel to the cutting direction.

3. The laser processing machine according to claim 1 , wherein
a position at which the beam spot is oscillated with the oscillation pattern including the oscillation component in the direction orthogonal to the cutting direction of the sheet metal is designated by a processing program for cutting the product from the sheet metal, and
the NC device is configured to control the beam oscillation mechanism so as to oscillate the beam spot at the position designated by the processing program.

4. A laser processing method comprising:
irradiating a sheet metal on a surface of a sheet metal from an opening of a nozzle with a focused laser beam;
moving a beam spot formed on the surface of the sheet metal along an end of a product so as to cut the product from the sheet metal; and
oscillating the beam spot in a non-holding region, in which a holding unit of a conveyance apparatus for conveying the product is not held, with an oscillation pattern including an oscillation component in a direction orthogonal to a cutting direction of the sheet metal when cutting a periphery of a protrusion portion of the product, or a periphery of a recess forming portion, the non-holding region being at least a part of a periphery of the protrusion portion or the recess portion, whereby a kerf width formed on the sheet metal is widened.

5. The laser processing method according to claim 4 , further comprising:
oscillating the beam spot with an oscillation pattern including only an oscillation component in the direction orthogonal to the cutting direction without including an oscillation component in a direction parallel to the cutting direction.

6. The laser processing method according to claim 4 , further comprising:
designating a position at which the beam spot is oscillated with the oscillation pattern including the oscillation component in the direction orthogonal to the cutting direction of the sheet metal by a processing program for cutting the product from the sheet metal; and
oscillating the beam spot at the position designated by the processing program.

Assignees

• Amada Holdings Co Ltd

Inventors

• Yamanashi Takaaki
• Funaki Kouji
• Pohle Dennis

Classifications

• B23K26/082 Primary

  Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head · CPC title

• B23K2101/18

  Sheet panels · CPC title

• B23K37/0408

  for planar work · CPC title

• B23K37/0288

  Carriages forming part of a cutting unit · CPC title

• B23K26/064

  by means of optical elements, e.g. lenses, mirrors or prisms · CPC title