High-frequency module with connection interface

Patent metadata

Field	Value
Publication number	US-10992272-B2
Application number	US-201916555691-A
Country	US
Kind code	B2
Filing date	Aug 29, 2019
Priority date	Nov 15, 2018
Publication date	Apr 27, 2021
Grant date	Apr 27, 2021

Abstract

A high-frequency module can be used in communication satellites. The high-frequency module contains an electronic unit and a housing. The housing at least partially encloses the electronic unit, and the electronic unit is arranged at least partially in an interior space of the housing. An internal connector is arranged on the housing, which is coupled to the electronic unit such that electrical signals can be transmitted between the electronic unit and the internal connector. The internal connector is constructed integrally with at least a part of the housing. This allows a thermo-mechanical stress on the electronic unit to be reduced.

First claim

What is claimed is:

1. A high-frequency module, comprising:
an electronic unit;
a housing, which at least partially encloses the electronic unit, and the electronic unit is arranged at least partially in an interior space of the housing;
an internal connector, which is arranged on the housing and coupled to the electronic unit such that electrical signals can be transmitted between the electronic unit and the internal connector;
the internal connector being constructed integrally with at least a part of the housing;
a first waveguide section, which rests against an outer surface of the housing;
the first waveguide section comprising a first half-shell and a second half-shell; and
the housing being arranged between the first half-shell and the second half-shell.

2. The high-frequency module according to claim 1 , the internal connector being formed by an internal surface of the housing.

3. The high-frequency module according to claim 1 , the internal connector being formed by a tab of the housing that projects into the internal space.

4. The high-frequency module according to claim 3 , wherein an electrically non-conductive material is at least partially arranged in a gap between the tab and adjacent housing wall sections.

5. The high-frequency module according to claim 1 , the housing comprising aluminum or an aluminum alloy.

6. The high-frequency module according to claim 1 , the electronic unit comprising a high-power amplifier.

7. The high-frequency module according to claim 1 , wherein a connection between the electronic unit and the internal connector is a micro-strip connection.

8. The high-frequency module according to claim 1 ,
the housing having a second internal connector, which is integral to the housing; and
the second internal connector being connected to the electronic unit.

9. The high-frequency module according to claim 1 , a surface of the housing being at least partially coated with gold or silver.

10. The high-frequency module according to claim 1 , further comprising a second waveguide section, which is joined to the first waveguide section such that the housing is enclosed by the first waveguide section and the second waveguide section.

11. The high-frequency module according to claim 10 , wherein the second waveguide section contains at least one element from the group comprising the following elements: filters, insulators, bends, antennas, circulators, multiplexers.

12. The high-frequency module according to claim 1 , the housing being constructed integrally.

13. A communications satellite, comprising:
a data transmission link; and
a high-frequency module arranged in the data transmission link, wherein the high-frequency module comprises:
an electronic unit;
a housing, which at least partially encloses the electronic unit, and the electronic unit is arranged at least partially in an interior space of the housing;
an internal connector, which is arranged on the housing and coupled to the electronic unit such that electrical signals can be transmitted between the electronic unit and the internal connector;
the internal connector being constructed integrally with at least a part of the housing;
a first waveguide section, which rests against an outer surface of the housing;
the first waveguide section comprising a first half-shell and a second half-shell; and
the housing being arranged between the first half-shell and the second half-shell.

14. A high-frequency module, comprising:
an electronic unit;
a housing, which at least partially encloses the electronic unit, and the electronic unit is arranged at least partially in an interior space of the housing;
an internal connector, which is arranged on the housing and coupled to the electronic unit such that electrical signals can be transmitted between the electronic unit and the internal connector;
the internal connector being constructed integrally with at least a part of the housing; and
the internal connector being formed by a tab of the housing that projects into the internal space;
wherein an electrically non-conductive material is at least partially arranged in a gap between the tab and adjacent housing wall sections.

Assignees

• Tesat Spacecom Gmbh & Co Kg

Inventors

• Arnold Christian
• Janocha Tobias
• Mahr Ulrich
• Falk Benjamin

Classifications

• H03F3/58 Primary

  using travelling-wave tubes · CPC title

• H03F3/189

  High-frequency amplifiers, e.g. radio frequency amplifiers · CPC title

• H03F3/21

  with semiconductor devices only {(H03F3/245 takes precedence)} · CPC title

• H01J25/34 Primary

  Travelling-wave tubes; Tubes in which a travelling wave is simulated at spaced gaps · CPC title

• H04B7/18515

  Transmission equipment in satellites or space-based relays · CPC title