Steerable antenna assembly

Patent metadata

Field	Value
Publication number	US-10992037-B2
Application number	US-201916574126-A
Country	US
Kind code	B2
Filing date	Sep 18, 2019
Priority date	Sep 18, 2019
Publication date	Apr 27, 2021
Grant date	Apr 27, 2021

Abstract

An antenna assembly includes a composite substrate. One or more first antenna elements are secured to the composite substrate. A microstrip feed network is secured to the composite substrate. The first antenna elements are electrically coupled to the microstrip feed network. A switch is electrically connected to the microstrip feed network. The switch is configured to selectively control the first antenna element(s). A dielectric lens may be disposed on the composite substrate over the first antenna element(s).

First claim

What is claimed is:

1. An antenna assembly, comprising:
a composite substrate having a cavity;
one or more first antenna elements secured to the composite substrate;
a microstrip feed network secured to the composite substrate, wherein the one or more first antenna elements are electrically coupled to the microstrip feed network; and
a switch positioned within the cavity of the composite substrate, wherein the switch is electrically connected to the microstrip feed network, and wherein the switch is configured to selectively control the one or more first antenna elements.

2. The antenna assembly of claim 1 , further comprising a dielectric lens disposed on the composite substrate over the one or more first antenna elements.

3. The antenna assembly of claim 2 , wherein the one or more first antenna elements are disposed on a top surface of the composite substrate, wherein the dielectric lens comprises a hemispherical dome mounted on the top surface of the composite substrate over the one or more first antenna elements, and wherein the one or more first antenna elements are enclosed between the dielectric lens and the top surface of the composite substrate.

4. The antenna assembly of claim 1 , wherein the one or more first antenna elements are disposed on a top surface of the composite substrate.

5. The antenna assembly of claim 1 , wherein the microstrip feed network is embedded within the composite substrate.

6. The antenna assembly of claim 1 , further comprising a ground plane secured to a bottom surface of the composite substrate below the one or more first antenna elements.

7. The antenna assembly of claim 1 , further comprising a ground plane secured to a top surface of the composite substrate away from the one or more first antenna elements.

8. The antenna assembly of claim 7 , further comprising:
a waveguide secured to a bottom surface of the composite substrate opposite from the ground plane; and
one or more second antenna elements disposed on the bottom surface of the composite substrate within a central channel of the waveguide.

9. The antenna assembly of claim 8 , further comprising one or more microstrip feed lines that electrically couple the one or more second antenna elements to the switch.

10. The antenna assembly of claim 1 , wherein the composite substrate comprises:
a first dielectric, wherein the one or more first antenna elements are disposed on a top surface of the first dielectric;
a second dielectric;
a third dielectric, wherein the microstrip feed network is disposed on the third dielectric, and wherein the first dielectric is separated from third dielectric by the second dielectric; and
a fourth dielectric.

11. The antenna assembly of claim 10 , further comprising:
a dielectric lens disposed on the top surface of the first dielectric over the one or more first antenna elements; and
a first ground plane disposed on a bottom surface of the fourth dielectric below the one or more first antenna elements.

12. The antenna assembly of claim 11 , further comprising:
a second ground plane disposed on the top surface of the first dielectric away from the one or more first antenna elements;
one or more electrical vias extending through the composite substrate and electrically connecting the first ground plane to the second ground plane;
one or more second antenna elements disposed on the bottom surface of the fourth dielectric away from the first ground plane and below the second ground plane; and
a waveguide disposed on the bottom surface of the fourth dielectric, wherein the one or more second antenna elements are within a central channel of the waveguide.

13. A method, comprising:
securing one or more first antenna elements to a composite substrate;
securing a microstrip feed network to the composite substrate;
electrically coupling the one or more first antenna elements to the microstrip feed network;
positioning a switch within a cavity of the composite substrate; and
electrically connecting the switch to the microstrip feed network, wherein the switch is configured to selectively control the one or more first antenna elements.

14. The method of claim 13 , further comprising disposing a dielectric lens on the composite substrate over the one or more first antenna elements.

15. The method of claim 14 , further comprising:
disposing the one or more first antenna elements on a top surface of the composite substrate,
wherein said disposing the dielectric lens comprises mounting a hemispherical dome on the top surface of the composite substrate over the one or more first antenna elements; and
enclosing the one or more first antenna elements between the dielectric lens and the top surface of the composite substrate.

16. The method of claim 13 , wherein said securing the one or more first antenna elements comprises disposing the one or more first antenna elements on a top surface of the composite substrate, and wherein said securing the microstrip feed network comprises embedding the microstrip feed network within the composite substrate.

17. The method of claim 13 , further comprising:
securing a first ground plane to a bottom surface of the composite substrate below the one or more first antenna elements; and
securing a second ground plane secured to a top surface of the composite substrate away from the one or more first antenna elements.

18. The method of claim 17 , further comprising:
securing a waveguide to a bottom surface of the composite substrate opposite from the second ground plane;
disposing one or more second antenna elements on the bottom surface of the composite substrate within a central channel of the waveguide; and
electrically coupling the switch to the one or more second antenna elements with one or more microstrip feed lines.

19. The method of claim 13 , further comprising:
disposing the one or more first antenna elements on a top surface of a first dielectric of the composite substrate;
disposing a dielectric lens on the top surface of the first dielectric over the one or more first antenna elements;
providing a second dielectric of the composite substrate;
disposing the microstrip feed network on a third dielectric of the composite substrate;
separating the first dielectric from the third dielectric by the second dielectric;
disposing a first ground plane on a bottom surface of a fourth dielectric of the composite substrate below the one or more first antenna elements;
disposing a second ground plane on the top surface of the first dielectric away from the one or more first antenna elements;
extending one or more electrical vias through the composite substrate to electrically connect the first ground plane to the second ground plane;
disposing one or more second antenna elements on the bottom surface of the fourth dielectric away from the first ground plane and below the second ground plane; and
disposing a waveguide on the bottom surface of the fourth dielectric, wherein the one or more second antenna elements are within a central channel of the waveguide.

20. An antenna assembly, comprising:
a composite substrate including a first dielectric, a second dielectric, a third dielectric, and a fourth dielectric, wherein a cavity is formed in one of more of the first dielectric, the second dielectric, the third dielectric, or the fourth dielectric;
one or more first antenna elements disposed on a top surface of the first dielectric;
a microstrip feed network embedded within the composite substrate and disposed on the thir

Assignees

• Boeing Co

Inventors

• Rogers John E
• Thacker Corey M

Classifications

• H01Q19/09

  wherein the primary active element is coated with or embedded in a dielectric or magnetic material (protective material H01Q1/40, varying the electric or magnetic characteristics of refracting or diffracting devices H01Q3/44) · CPC title

• H01Q3/24 Primary

  varying the orientation by switching energy from one active radiating element to another, e.g. for beam switching · CPC title

• H01Q21/0075

  Stripline fed arrays (H01Q21/065 takes precedence) · CPC title

• H01Q15/08

  formed of solid dielectric material · CPC title

• H01Q21/0087

  Apparatus or processes specially adapted for manufacturing antenna arrays (manufacturing waveguides H01P11/00) · CPC title