Multiplexer and combiner structures embedded in a mmwave connector interface

US10992016B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10992016-B2
Application numberUS-201716466629-A
CountryUS
Kind codeB2
Filing dateJan 5, 2017
Priority dateJan 5, 2017
Publication dateApr 27, 2021
Grant dateApr 27, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Embodiments of the invention include a mm-wave waveguide connector and methods of forming such devices. In an embodiment the mm-wave waveguide connector may include a plurality of mm-wave launcher portions, and a plurality of ridge based mm-wave filter portions each communicatively coupled to one of the mm-wave launcher portions. In an embodiment, the ridge based mm-wave filter portions each include a plurality of protrusions that define one or more resonant cavities. Additional embodiments may include a multiplexer portion communicatively coupled to the plurality of ridge based mm-wave filter portions and communicative coupled to a mm-wave waveguide bundle. In an embodiment the plurality of protrusions define resonant cavities with openings between 0.5 mm and 2.0 mm, the plurality of protrusions are spaced apart from each other by a spacing between 0.5 mm and 2.0 mm, and wherein the plurality of protrusions have a thickness between 200 μm and 1,000 μm.

First claim

Opening claim text (preview).

What is claimed is: 1. A mm-wave waveguide connector, comprising: a first mm-wave launcher portion; a first ridge based mm-wave filter portion communicatively coupled to the first mm-wave launcher portion, wherein the first ridge based mm-wave filter portion includes a plurality of protrusions that define one or more resonant cavities, wherein the plurality of protrusions are spaced apart from each other by a spacing between approximately 0.5 mm and 2.0 mm; and a multiplexer portion communicatively coupled to the first ridge based mm-wave filter portion. 2. The mm-wave waveguide connector of claim 1 , wherein the multiplexer portion is communicatively coupled to one or more additional ridge based mm-wave filter portions and one or more additional mm-wave launcher portions. 3. The mm-wave waveguide connector of claim 2 , wherein the first mm-wave launcher portion and the first ridge based mm-wave filter portion are formed on a first surface of a package substrate and at least one of the one or more additional ridge based mm-wave filter portions and at least one of the one or more additional mm-wave launcher portions are formed on a second surface of the package substrate. 4. The mm-wave waveguide connector of claim 2 , wherein the first mm-wave launcher portion and the first ridge based mm-wave filter portion are formed on a first surface of a package substrate and at least one of the one or more additional ridge based mm-wave filter portions and at least one of the one or more additional mm-wave launcher portions are formed on the first surface of the package substrate. 5. The mm-wave waveguide connector of claim 1 wherein the first ridge based mm-wave filter portion includes a third order bandpass filter or greater. 6. The mm-wave waveguide connector of claim 5 , wherein the first ridge based mm-wave filter portion provides a signal roll-off of 20 dBs in 3 GHz or less. 7. The mm-wave waveguide connector of claim 5 , wherein the first ridge based mm-wave filter portion provides a signal roll-off of 20 dBs in 1 GHz or less. 8. The mm-wave waveguide connector of claim 1 , wherein the plurality of protrusions define resonant cavities with openings between 0.5 mm and 2.0 mm. 9. The mm-wave waveguide connector of claim 1 , wherein the plurality of protrusions have a thickness between 200 μm and 1,000 μm. 10. The mm-wave waveguide connector of claim 1 , wherein one or more of the mm-wave launcher portion, the ridge based filter portion, and the multiplexer portion are coupled to each other with a fitting. 11. The mm-wave waveguide connector of claim 1 , wherein the mm-wave launcher portion, the ridge based filter portion, and the multiplexer portion are integrated together as a single component. 12. The mm-wave waveguide connector of claim 11 , wherein the mm-wave waveguide connector is an edge connector that connects to an edge of a package substrate. 13. The mm-wave waveguide connector of claim 12 , wherein the package substrate includes mechanical stops and/or alignment features. 14. A ridge based bandpass filter, comprising: a conductive enclosure; and a plurality of resonator cavities formed within the conductive enclosure that are communicatively coupled to each other by openings, wherein a plurality of protrusions extending from the conductive enclosure define the plurality of resonator cavities, wherein the plurality of protrusions are spaced apart from each other by a spacing between approximately 0.5 mm and 2.0 mm. 15. The ridge based bandpass filter of claim 14 , further comprising: a dielectric material filling the conductive enclosure. 16. The ridge based bandpass filter of claim 14 , wherein the openings between each resonator cavity are not all uniform. 17. The ridge based bandpass filter of claim 14 , wherein the plurality of protrusions do not have a substantially uniform spacing. 18. The ridge based bandpass filter of claim 14 , wherein the plurality of resonant cavities includes three or more resonant cavities. 19. The ridge based bandpass filter of claim 18 , wherein the ridge based bandpass filter provides a signal roll-off of 20 dBs in 3 GHz or less. 20. The ridge based bandpass filter of claim 19 , wherein the plurality of protrusions define resonant cavities with openings between 0.5 mm and 2.0 mm, and wherein the plurality of protrusions have a thickness between 200 μm and 1,000 μm. 21. The ridge based bandpass filter of claim 14 , wherein the openings are apertures. 22. A computing system comprising: a package substrate; a plurality of mm-wave waveguide connectors coupled to the package substrate, wherein each of the mm-wave waveguide connectors comprises: a plurality of mm-wave launcher portions; a plurality of ridge based mm-wave filter portions each communicatively coupled to one of the mm-wave launcher portion, wherein the ridge based mm-wave filter portions each include a plurality of protrusions that define one or more resonant cavities, wherein the plurality of protrusions are spaced apart from each other by a spacing between approximately 0.5 mm and 2.0 mm; and a multiplexer portion communicatively coupled to the plurality of ridge based mm-wave filter portions and communicatively coupled to a mm-wave waveguide bundle. 23. The computing system of claim 22 , wherein the package substrate is a package substrate in a server or a high performance computing (HPC) system. 24. The computing system of claim 22 , wherein each of the plurality of ridge based mm-wave filter portions includes a bandpass filter that filters different portions of an available bandwidth of the mm-wave waveguide bundle.

Assignees

Inventors

Classifications

  • H01P5/18Primary

    consisting of two coupled guides, e.g. directional couplers · CPC title

  • Hollow-waveguide/coaxial-line transitions · CPC title

  • Hollow waveguide filters (H01P1/212, H01P1/213, H01P1/215, H01P1/219 take precedence) · CPC title

  • Hollow-waveguide/strip-line transitions · CPC title

  • Hollow waveguides (H01P3/20 takes precedence) · CPC title

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What does patent US10992016B2 cover?
Embodiments of the invention include a mm-wave waveguide connector and methods of forming such devices. In an embodiment the mm-wave waveguide connector may include a plurality of mm-wave launcher portions, and a plurality of ridge based mm-wave filter portions each communicatively coupled to one of the mm-wave launcher portions. In an embodiment, the ridge based mm-wave filter portions each in…
Who is the assignee on this patent?
Intel Corp
What technology area does this patent fall under?
Primary CPC classification H01P5/18. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Apr 27 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).