Semiconductor device

Patent metadata

Field	Value
Publication number	US-10991703-B2
Application number	US-201916524426-A
Country	US
Kind code	B2
Filing date	Jul 29, 2019
Priority date	Aug 1, 2018
Publication date	Apr 27, 2021
Grant date	Apr 27, 2021

Abstract

Provided is a semiconductor device that has a low interface resistance between a contact plug and a bottom electrode of a real ferroelectric capacitor. A real capacitor oxidation suppression structure ST including a dummy ferroelectric capacitor 312 and a second plug 311 is formed. The dummy ferroelectric capacitor 312 includes a second bottom electrode 51, a second ferroelectric film 52, and a second top electrode 53, and is not used as a nonvolatile memory element. The second bottom electrode 51 is formed on an interlayer insulating film 50. The second ferroelectric film 52 is formed on the second bottom electrode 51. The second top electrode 53 is formed on the second ferroelectric film 52. The second plug 311 penetrates the interlayer insulating film 50 and electrically connects the second bottom electrode 51 to a semiconductor substrate 40.

First claim

The invention claimed is:

1. A semiconductor device, comprising:
a semiconductor substrate;
an interlayer insulating film that is formed on the semiconductor substrate;
a nonvolatile memory element that includes a real ferroelectric capacitor formed on the interlayer insulating film, wherein
the real ferroelectric capacitor includes:
a first bottom electrode formed on the interlayer insulating film,
a first ferroelectric film formed on the first bottom electrode, and
a first top electrode formed on the first ferroelectric film, and

the first bottom electrode of the real ferroelectric capacitor is electrically connected to the semiconductor substrate through a first plug penetrating the interlayer insulating film;

a shield ring having a ring-like shape as viewed from above,
wherein the shield ring is formed continuously around the semiconductor device and along a scribe region of the semiconductor device in order to prevent entry of moisture; and

a first dummy ferroelectric capacitor formed intermittently around the semiconductor device and along the shield ring, wherein
the shield ring includes a real capacitor oxidation suppression structure,
the real capacitor oxidation suppression structure includes a second dummy ferroelectric capacitor and a second plug,
the second dummy ferroelectric capacitor includes a second bottom electrode, a second ferroelectric film, and a second top electrode,
the second dummy ferroelectric capacitor is not used as the nonvolatile memory element,
the second bottom electrode is formed on the interlayer insulating film,
the second ferroelectric film is formed on the second bottom electrode,
the second top electrode is formed on the second ferroelectric film, and
the second plug penetrates the interlayer insulating film and electrically connects the second bottom electrode to the semiconductor substrate.

2. The semiconductor device according to claim 1 , wherein
the nonvolatile memory element further includes a transistor formed on the semiconductor substrate,
the first bottom electrode of the real ferroelectric capacitor is connected to the transistor, and
the second bottom electrode of the second dummy ferroelectric capacitor is not connected to the transistor.

3. The semiconductor device according to claim 1 ,
wherein the real capacitor oxidation suppression structure is formed in a ring-like or substantially ring-like manner as viewed from above.

4. The semiconductor device according to claim 1 ,
wherein each of the second dummy ferroelectric capacitor and the second plug has the ring-like shape as viewed from above.

5. The semiconductor device according to claim 1 , wherein
the shield ring includes a first shield ring and a second shield ring,
each of the first shield ring and the second shield ring is in the ring-like shape as viewed from above,
the second shield ring is formed so as to surround the first shield ring, and
the real capacitor oxidation suppression structure is formed as a part of the first shield ring.

6. The semiconductor device according to claim 5 ,
wherein the real capacitor oxidation suppression structure formed as the part of the first shield ring includes the second dummy ferroelectric capacitor having the ring-like shape as viewed from above and the second plug having the ring-like shape as viewed from above.

7. The semiconductor device according to claim 1 , wherein
the shield ring includes a first shield ring and a second shield ring,
each of the first shield ring and the second shield ring is in the ring-like shape as viewed from above,
the second shield ring is formed so as to surround the first shield ring, and
the real capacitor oxidation suppression structure is formed as a part of the second shield ring.

8. The semiconductor device according to claim 7 ,
wherein the real capacitor oxidation suppression structure formed as the part of the second shield ring includes the second dummy ferroelectric capacitor having the ring-like shape as viewed from above and the second plug having the ring-like shape as viewed from above.

9. The semiconductor device according to claim 1 , wherein
the shield ring includes a first shield ring and a second shield ring,
each of the first shield ring and the second shield ring is in the ring-like shape as viewed from above,
the second shield ring is formed so as to surround the first shield ring, and
the real capacitor oxidation suppression structure is not only formed as a part of the first shield ring, but also formed as a part of the second shield ring.

10. The semiconductor device according to claim 9 , wherein
the real capacitor oxidation suppression structure formed as the part of the first shield ring includes the second dummy ferroelectric capacitor having the ring-like shape as viewed from above and the second plug having the ring-like shape as viewed from above, and
the real capacitor oxidation suppression structure formed as the part of the second shield ring includes a third dummy ferroelectric capacitor having the ring-like shape as viewed from above and a third plug having the ring-like shape as viewed from above.

11. The semiconductor device according to claim 4 , further comprising:
when the interlayer insulating film is regarded as a first interlayer insulating film,
a hydrogen barrier film that covers a surface of the real ferroelectric capacitor, a surface of the second dummy ferroelectric capacitor, and a surface of the first interlayer insulating film; and
a second interlayer insulating film that is formed on the hydrogen barrier film,
wherein the shield ring further includes:
a shield wiring that is in the ring-like shape as viewed from above and formed on the second interlayer insulating film, and
a shield plug that is in the ring-like shape as viewed from above, embedded in the second interlayer insulating film, and used to electrically connect a top electrode of the real capacitor oxidation suppression structure to the shield wiring.

12. The semiconductor device according to claim 6 , further comprising:
when the interlayer insulating film is regarded as a first interlayer insulating film,
a hydrogen barrier film that covers a surface of the real ferroelectric capacitor, a surface of the second dummy ferroelectric capacitor, and a surface of the first interlayer insulating film; and
a second interlayer insulating film that is formed on the hydrogen barrier film,
wherein the first shield ring further includes:
a shield wiring that is in the ring-like shape as viewed from above and formed on the second interlayer insulating film, and
a shield plug that is in the ring-like shape as viewed from above, embedded in the second interlayer insulating film, and used to electrically connect a top electrode of the real capacitor oxidation suppression structure to the shield wiring.

13. The semiconductor device according to claim 8 , further comprising:
when the interlayer insulating film is regarded as a first interlayer insulating film,
a hydrogen barrier film that covers a surface of the real ferroelectric capacitor, a surface of the second dummy ferroelectric capacitor, and a surface of the first interlayer insulating film; and
a second interlayer insulating film that is formed on the hydrogen barrier film,
wherein the second shield ring further includes:
a shield wiring that is in the ring-like shape as viewed from above and formed on the second interlayer insulating film, and
a shield plug that is in the ring-like shape as viewed from above, embedded in the second interlayer insulating film, and used to electrically connect a top electrode of the r

Assignees

• Rohm Co Ltd

Inventors

• Ozawa Takanori
• Ito Hiroaki

Classifications

• H10D1/688 Primary

  comprising barrier layers to prevent diffusion of hydrogen or oxygen · CPC title

• H10D1/684

  the dielectrics comprising multiple layers, e.g. comprising buffer layers, seed layers or gradient layers · CPC title

• H10D1/682

  having dielectrics comprising perovskite structures · CPC title

• H01L28/56

  Electricity · mapped topic

• H01L27/11507 Primary

  Electricity · mapped topic