PC module assembly

Patent metadata

Field	Value
Publication number	US-10990143-B2
Application number	US-201716347068-A
Country	US
Kind code	B2
Filing date	Sep 30, 2017
Priority date	Nov 17, 2016
Publication date	Apr 27, 2021
Grant date	Apr 27, 2021

Abstract

A PC module assembly, comprising a PC module support, the PC module support comprising a bottom wall and a first side wall, the first side wall being provided with a first air outlet, an air inlet of a heat dissipation structure communicatively connected to the first air outlet. When mounting of a PC module, the PC module is mounted on the bottom wall, enabling the position of an air outlet of the PC module to correspond to the position of the first air outlet. When the PC module is in an operating state, hot air flow formed by the heat generated inside the PC module enters the first air outlet, and is diverted through the heat dissipation structure, so that the heat is dissipated from the inside of the PC module, thereby allowing the PC module to operate in a stable manner.

First claim

What is claimed is:

1. A PC module assembly, comprising:
a PC module support, the PC module support comprising a bottom wall and a first side wall, wherein the bottom wall is fixedly connected to the first side wall, the first side wall is provided with a first air outlet; and
a heat dissipation structure, the heat dissipation structure comprising an air duct, the air duct comprising an air inlet and an air outlet, wherein the air inlet of the air duct is communicatively connected to the first air outlet provided by the first side wall, a hot air flow is diverted from the air inlet of the air duct to the air outlet of the air duct, and the air duct is made from an insulating material that isolates the hot air flow from being diffused or transferred to outside walls of the air duct to other locations inside the PC module.

2. The PC module assembly according to claim 1 , wherein the heat dissipation structure further comprises an upper terminal holder, wherein the upper terminal holder is provided with a plurality of heat dissipation holes, and the plurality of heat dissipation holes are communicatively connected to the air outlet of the air duct.

3. The PC module assembly according to claim 2 , wherein the air duct is made of ethylene-vinyl acetate (EVA) material.

4. The PC module assembly according to claim 2 , wherein said heat dissipation holes are elliptical.

5. The PC module assembly according to claim 1 , wherein the first side wall is provided with a first heat dissipation outlet.

6. The PC module assembly according to claim 1 , wherein the PC module support is further provided with a second side wall, and the second side wall is provided with a second heat dissipation outlet.

7. The PC module assembly according to claim 1 , wherein the PC module support is further provided with a first connector member, and a first end of the PC module support is mounted on a wall hanging strip through the first connector member.

8. The PC module assembly according to claim 7 , wherein said first connector member is L-shaped, and a vertical portion of the first connector member is fixedly connected to the bottom wall, a horizontal portion of the first connector member is fixedly connected to the wall hanging strip.

9. The PC module assembly according to claim 8 , wherein the PC module support is further provided with a second connector member, and a second end of the PC module support is mounted on a side terminal holder through the second connector member.

10. The PC module assembly according to claim 9 , wherein the second connector member is riveted to the right terminal holder by a rivet.

Assignees

• Guangzhou Shiyuan Electronics Co Ltd
• Guangzhou Shirui Electronics Co Ltd

Inventors

• Zhang Junjun
• Deng Fangguang

Classifications

• G06F1/20 Primary

  Cooling means · CPC title

• H04L9/40

  Network security protocols · CPC title

• H05K7/20127

  Natural convection · CPC title

• G06F1/18 Primary

  Packaging or power distribution · CPC title